FR2355923B1 - - Google Patents

Info

Publication number
FR2355923B1
FR2355923B1 FR7719444A FR7719444A FR2355923B1 FR 2355923 B1 FR2355923 B1 FR 2355923B1 FR 7719444 A FR7719444 A FR 7719444A FR 7719444 A FR7719444 A FR 7719444A FR 2355923 B1 FR2355923 B1 FR 2355923B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7719444A
Other languages
French (fr)
Other versions
FR2355923A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Felten and Guilleaume Carlswerk AG
Original Assignee
Felten and Guilleaume Carlswerk AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Felten and Guilleaume Carlswerk AG filed Critical Felten and Guilleaume Carlswerk AG
Publication of FR2355923A1 publication Critical patent/FR2355923A1/fr
Application granted granted Critical
Publication of FR2355923B1 publication Critical patent/FR2355923B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
FR7719444A 1976-06-24 1977-06-24 Procede permettant de rendre metallophobes des objets, en particulier des matieres isolantes de circuits imprimes Granted FR2355923A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2628350A DE2628350C3 (de) 1976-06-24 1976-06-24 Verfahren zur Herstellung von nichtmetallisierbaren Oberflächen auf Schichtstoffen unter Verwendung eines gelösten Antimonkomplexes und Anwendung des Verfahrens

Publications (2)

Publication Number Publication Date
FR2355923A1 FR2355923A1 (fr) 1978-01-20
FR2355923B1 true FR2355923B1 (enExample) 1981-10-16

Family

ID=5981334

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7719444A Granted FR2355923A1 (fr) 1976-06-24 1977-06-24 Procede permettant de rendre metallophobes des objets, en particulier des matieres isolantes de circuits imprimes

Country Status (9)

Country Link
JP (1) JPS537538A (enExample)
AT (1) AT351885B (enExample)
CA (1) CA1104010A (enExample)
CH (1) CH632299A5 (enExample)
DE (1) DE2628350C3 (enExample)
FR (1) FR2355923A1 (enExample)
GB (1) GB1547079A (enExample)
IT (1) IT1077233B (enExample)
SE (1) SE424005B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4151313A (en) * 1977-03-11 1979-04-24 Hitachi, Ltd. Method for production of printed circuits by electroless metal plating employing a solid solution of metal oxides of titanium, nickel, and antimony as a masking material
JPS6054998A (ja) * 1983-09-06 1985-03-29 Nikkiso Co Ltd 気相成長炭素繊維の製造方法
JPS60185818A (ja) * 1984-03-01 1985-09-21 Nikkiso Co Ltd 気相法炭素繊維の製造方法
JPS6074599A (ja) * 1983-09-30 1985-04-26 株式会社日立製作所 プリント配線板及びその製造方法
JPS60224816A (ja) * 1984-04-20 1985-11-09 Nikkiso Co Ltd 気相成長による炭素繊維の製造方法
FR2564110B1 (fr) * 1984-05-10 1986-09-05 Lorraine Carbone Procede de production de fibres de carbone vapo-deposees a partir de methane
CA1286465C (en) * 1986-11-20 1991-07-23 Adrian Swinburn Allen Absorbent polymeric materials and their manufacture
JP4794248B2 (ja) * 2005-09-14 2011-10-19 卓 新井 亜鉛もしくは亜鉛合金製品用表面処理剤

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3775121A (en) * 1972-08-09 1973-11-27 Western Electric Co Method of selectively depositing a metal on a surface of a substrate

Also Published As

Publication number Publication date
DE2628350B2 (de) 1978-04-20
ATA380177A (de) 1979-01-15
CA1104010A (en) 1981-06-30
CH632299A5 (en) 1982-09-30
JPS537538A (en) 1978-01-24
SE424005B (sv) 1982-06-21
AT351885B (de) 1979-08-27
GB1547079A (en) 1979-06-06
DE2628350C3 (de) 1978-12-07
FR2355923A1 (fr) 1978-01-20
DE2628350A1 (de) 1977-12-29
IT1077233B (it) 1985-05-04
SE7707077L (sv) 1977-12-25

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Legal Events

Date Code Title Description
ST Notification of lapse