ATA380177A - Verafhren zum herstellen von metallophoben (metallabweisenden) oberflaechen auf gegen- staenden, insbesondere fuer die herstellung von basismaterial fuer gedruckte schaltungen - Google Patents
Verafhren zum herstellen von metallophoben (metallabweisenden) oberflaechen auf gegen- staenden, insbesondere fuer die herstellung von basismaterial fuer gedruckte schaltungenInfo
- Publication number
- ATA380177A ATA380177A AT380177A AT380177A ATA380177A AT A380177 A ATA380177 A AT A380177A AT 380177 A AT380177 A AT 380177A AT 380177 A AT380177 A AT 380177A AT A380177 A ATA380177 A AT A380177A
- Authority
- AT
- Austria
- Prior art keywords
- metallophobic
- repellent
- objects
- producing
- production
- Prior art date
Links
- 239000000463 material Substances 0.000 title 1
- 239000005871 repellent Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electrochemistry (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2628350A DE2628350C3 (de) | 1976-06-24 | 1976-06-24 | Verfahren zur Herstellung von nichtmetallisierbaren Oberflächen auf Schichtstoffen unter Verwendung eines gelösten Antimonkomplexes und Anwendung des Verfahrens |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| ATA380177A true ATA380177A (de) | 1979-01-15 |
| AT351885B AT351885B (de) | 1979-08-27 |
Family
ID=5981334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT380177A AT351885B (de) | 1976-06-24 | 1977-05-27 | Verfahren zum herstellen von metallophoben (metallabweisenden) oberflaechen auf gegen- staenden, insbesondere fuer die herstellung von basismaterial fuer gedruckte schaltungen |
Country Status (9)
| Country | Link |
|---|---|
| JP (1) | JPS537538A (de) |
| AT (1) | AT351885B (de) |
| CA (1) | CA1104010A (de) |
| CH (1) | CH632299A5 (de) |
| DE (1) | DE2628350C3 (de) |
| FR (1) | FR2355923A1 (de) |
| GB (1) | GB1547079A (de) |
| IT (1) | IT1077233B (de) |
| SE (1) | SE424005B (de) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4151313A (en) * | 1977-03-11 | 1979-04-24 | Hitachi, Ltd. | Method for production of printed circuits by electroless metal plating employing a solid solution of metal oxides of titanium, nickel, and antimony as a masking material |
| JPS6054998A (ja) * | 1983-09-06 | 1985-03-29 | Nikkiso Co Ltd | 気相成長炭素繊維の製造方法 |
| JPS60185818A (ja) * | 1984-03-01 | 1985-09-21 | Nikkiso Co Ltd | 気相法炭素繊維の製造方法 |
| JPS6074599A (ja) * | 1983-09-30 | 1985-04-26 | 株式会社日立製作所 | プリント配線板及びその製造方法 |
| JPS60224816A (ja) * | 1984-04-20 | 1985-11-09 | Nikkiso Co Ltd | 気相成長による炭素繊維の製造方法 |
| FR2564110B1 (fr) * | 1984-05-10 | 1986-09-05 | Lorraine Carbone | Procede de production de fibres de carbone vapo-deposees a partir de methane |
| EP0269393B2 (de) * | 1986-11-20 | 2000-03-22 | Ciba Specialty Chemicals Water Treatments Limited | Absorbierende Produkte und deren Herstellung |
| JP4794248B2 (ja) * | 2005-09-14 | 2011-10-19 | 卓 新井 | 亜鉛もしくは亜鉛合金製品用表面処理剤 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3775121A (en) * | 1972-08-09 | 1973-11-27 | Western Electric Co | Method of selectively depositing a metal on a surface of a substrate |
-
1976
- 1976-06-24 DE DE2628350A patent/DE2628350C3/de not_active Expired
-
1977
- 1977-05-27 AT AT380177A patent/AT351885B/de not_active IP Right Cessation
- 1977-06-08 IT IT24504/77A patent/IT1077233B/it active
- 1977-06-10 GB GB24333/77A patent/GB1547079A/en not_active Expired
- 1977-06-17 SE SE7707077A patent/SE424005B/xx unknown
- 1977-06-23 CA CA281,246A patent/CA1104010A/en not_active Expired
- 1977-06-23 CH CH773777A patent/CH632299A5/de not_active IP Right Cessation
- 1977-06-24 JP JP7536177A patent/JPS537538A/ja active Pending
- 1977-06-24 FR FR7719444A patent/FR2355923A1/fr active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| GB1547079A (en) | 1979-06-06 |
| DE2628350A1 (de) | 1977-12-29 |
| CA1104010A (en) | 1981-06-30 |
| CH632299A5 (en) | 1982-09-30 |
| AT351885B (de) | 1979-08-27 |
| FR2355923B1 (de) | 1981-10-16 |
| SE424005B (sv) | 1982-06-21 |
| JPS537538A (en) | 1978-01-24 |
| DE2628350C3 (de) | 1978-12-07 |
| SE7707077L (sv) | 1977-12-25 |
| DE2628350B2 (de) | 1978-04-20 |
| IT1077233B (it) | 1985-05-04 |
| FR2355923A1 (fr) | 1978-01-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EFA | Change in the company name | ||
| ELJ | Ceased due to non-payment of the annual fee | ||
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |