DE2624803A1 - Form - Google Patents

Form

Info

Publication number
DE2624803A1
DE2624803A1 DE19762624803 DE2624803A DE2624803A1 DE 2624803 A1 DE2624803 A1 DE 2624803A1 DE 19762624803 DE19762624803 DE 19762624803 DE 2624803 A DE2624803 A DE 2624803A DE 2624803 A1 DE2624803 A1 DE 2624803A1
Authority
DE
Germany
Prior art keywords
mold
inserts
housing
thermosetting resin
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19762624803
Other languages
German (de)
English (en)
Inventor
Frederick William Barter
Peter James Douglas Vict Brett
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novartis AG
Original Assignee
Ciba Geigy AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Geigy AG filed Critical Ciba Geigy AG
Publication of DE2624803A1 publication Critical patent/DE2624803A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565Moulds

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
DE19762624803 1975-06-04 1976-06-02 Form Withdrawn DE2624803A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB24062/75A GB1508324A (en) 1975-06-04 1975-06-04 Moulds for encapsulating

Publications (1)

Publication Number Publication Date
DE2624803A1 true DE2624803A1 (de) 1976-12-23

Family

ID=10205765

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19762624803 Withdrawn DE2624803A1 (de) 1975-06-04 1976-06-02 Form

Country Status (7)

Country Link
US (1) US4076791A (cg-RX-API-DMAC7.html)
JP (1) JPS5221069A (cg-RX-API-DMAC7.html)
CA (1) CA1080922A (cg-RX-API-DMAC7.html)
CH (1) CH612120A5 (cg-RX-API-DMAC7.html)
DE (1) DE2624803A1 (cg-RX-API-DMAC7.html)
FR (1) FR2313844A1 (cg-RX-API-DMAC7.html)
GB (1) GB1508324A (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2952297A1 (de) * 1979-12-24 1981-07-02 Werner Dipl.-Ing. 6840 Lampertheim Schaller Verfahren und vorrichtung zur herstellung von elektronischen geraeten, insbesondere beruehrungslosen sensoren und modulen

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4611649A (en) * 1982-11-24 1986-09-16 Albany-Chicago Corporation Method of making multiple magnet core units
US4540966A (en) * 1982-11-24 1985-09-10 Albany-Chicago Corporation Multiple magnet core unit
US4543228A (en) * 1984-01-13 1985-09-24 Milton Roy Company Injection molded sliding vane pump
JPH069858B2 (ja) * 1988-12-14 1994-02-09 財団法人日本航空機開発協会 熱可塑性樹脂製品の成形方法および装置
US5833909A (en) * 1995-06-29 1998-11-10 Texas Instruments Incorporated Transfer molding process using self-straightening alignment pins
US5642991A (en) * 1996-03-11 1997-07-01 Procon Products Sliding vane pump with plastic housing
DE29611461U1 (de) * 1996-07-01 1996-09-12 Bürkert Werke GmbH & Co., 74653 Ingelfingen Vorrichtung zum Vergießen von Bauteilen
US7066628B2 (en) 2001-03-29 2006-06-27 Fiber Optic Designs, Inc. Jacketed LED assemblies and light strings containing same
JP4549521B2 (ja) * 2000-12-14 2010-09-22 フィーサ株式会社 インサート成形方法及び金型
GB0120835D0 (en) * 2001-08-28 2001-10-17 Smithkline Beecham Plc Process
EP1363120A1 (en) * 2002-05-14 2003-11-19 PerkinElmer International C.V. Tool for making a sample holder
US6817854B2 (en) * 2002-05-20 2004-11-16 Stmicroelectronics, Inc. Mold with compensating base
DE10340328A1 (de) * 2003-08-29 2005-03-24 Endress + Hauser Gmbh + Co. Kg Vergußschale
US7241414B2 (en) * 2004-06-25 2007-07-10 Asm Technology Singapore Pte Ltd. Method and apparatus for molding a semiconductor device
KR100980104B1 (ko) * 2005-09-28 2010-09-07 주식회사 엘지화학 이차전지 제조장치

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2266169A (en) * 1939-07-25 1941-12-16 Eastman Kodak Co Lens mount
GB869863A (en) * 1958-06-18 1961-06-07 A & M Fell Ltd Improvements in or relating to the manufacture of transistors, rectifiers and other semi-conductor devices
FR1297831A (fr) * 1961-05-24 1962-07-06 Air Liquide Perfectionnements aux moules servant à surmouler une pièce en matière plastique sur un objet en substance dure
GB1222651A (en) * 1966-12-30 1971-02-17 Fordath Ltd Formerly The Forda Improvements relating to articles which include carbon
US3525966A (en) * 1968-07-24 1970-08-25 Square D Co Encapsulated coil and method of making same and spacer for use during encapsulation
US3813763A (en) * 1970-12-17 1974-06-04 Gen Electric Laminated structure with insulating member formed in situ thereon and method for making same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2952297A1 (de) * 1979-12-24 1981-07-02 Werner Dipl.-Ing. 6840 Lampertheim Schaller Verfahren und vorrichtung zur herstellung von elektronischen geraeten, insbesondere beruehrungslosen sensoren und modulen

Also Published As

Publication number Publication date
JPS5221069A (en) 1977-02-17
CA1080922A (en) 1980-07-08
FR2313844B1 (cg-RX-API-DMAC7.html) 1979-04-27
FR2313844A1 (fr) 1976-12-31
US4076791A (en) 1978-02-28
GB1508324A (en) 1978-04-19
CH612120A5 (cg-RX-API-DMAC7.html) 1979-07-13

Similar Documents

Publication Publication Date Title
DE2624803A1 (de) Form
DE2919058A1 (de) Elektronisches geraet mit mindestens einer leiterplatte
CH261736A (de) Verfahren zur Herstellung eines Trockentransformators.
CH299458A (de) Verfahren zum Giessen von Kunstharzkörpern in Giessformen.
WO2017194444A1 (de) Verfahren zum Fixieren einer Spulenwickung
DE968124C (de) Verfahren zum Einbau von elektrischen Bauelementen, z.B. Kondensatoren, in ein Metallgehaeuse
DE1082983B (de) Verfahren zur Herstellung von kunststoffumpressten Trockengleichrichteranordnungen und Pressform zur Durchfuehrung des Verfahrens
DE877318C (de) Verfahren zur Verbesserung der magnetischen Guetewerte bei der Herstellung gesinterter Dauermagnete
DE7913357U1 (de) Vorrichtung zur befestigung und lecksicheren festhaltung ummantelter elektrischer widerstaende
DE2015988A1 (de) Endenabschluß fur mit einem thermo plastischen oder thermoelastischen Kunst stoff isolierte Starkstromkabel
EP0658527A1 (de) Verfahren zur Herstellung einer Giesskeramik
DE902029C (de) Verfahren zur Verfestigung von Verdrahtungen
DE1179629B (de) Gehaeuse fuer elektrische Maschinen, insbesondere Elektromotoren, aus Zementmoertel oder Beton
DE1263285B (de) Verfahren zum Umhuellen von elektrischen Bauteilen
DE1490529C3 (de) Verfahren zur Herstellung von elektrischen Hochspannungsisolatoren aus Gießharz
DE938802C (de) Verfahren zur Herstellung elektrischer Kontaktsaetze, insbesondere fuer elektrische Zerhacker
DE907950C (de) Verfahren zur Herstellung von elektromechanischen Wandlern unter Verwendung von piezoelektrischen Kristallen
DE1907620C3 (de) Verfahren zur Herstellung elektrisch leitfähiger und/oder wärmeleitfähiger Kunststoffgegenstände
DE1243762C2 (de) Giessharzkoerper fuer elektrische schalter
DE1059173B (de) Verfahren zum Einbetten von vorzugsweise metallischen Koerpern in haertbare Giessharze
DE1081571B (de) Mit einer ausgehaerteten Masse umpresstes elektrisches Bauelement, insbesondere elektrischer Kondensator, und Verfahren zu seiner Herstellung
AT257728B (de) Verfahren zur Herstellung von elektrischen Bauelementen oder Bauelementekombinationen
DE1068815B (cg-RX-API-DMAC7.html)
DE1488373A1 (de) Verfahren zum Vergiessen von Wicklungen fuer Transformatoren
DE1143268B (de) Verfahren zur Herstellung von Schmelzsicherungen mit einem den Loeschsand umschliessenden Koerper aus Giessharz

Legal Events

Date Code Title Description
8130 Withdrawal