GB1508324A - Moulds for encapsulating - Google Patents

Moulds for encapsulating

Info

Publication number
GB1508324A
GB1508324A GB24062/75A GB2406275A GB1508324A GB 1508324 A GB1508324 A GB 1508324A GB 24062/75 A GB24062/75 A GB 24062/75A GB 2406275 A GB2406275 A GB 2406275A GB 1508324 A GB1508324 A GB 1508324A
Authority
GB
United Kingdom
Prior art keywords
mould
plugs
component
aluminium
outer casing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB24062/75A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novartis AG
Original Assignee
Ciba Geigy AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Geigy AG filed Critical Ciba Geigy AG
Priority to GB24062/75A priority Critical patent/GB1508324A/en
Priority to US05/691,968 priority patent/US4076791A/en
Priority to CH685776A priority patent/CH612120A5/xx
Priority to DE19762624803 priority patent/DE2624803A1/de
Priority to CA253,943A priority patent/CA1080922A/en
Priority to FR7616852A priority patent/FR2313844A1/fr
Priority to JP51064701A priority patent/JPS5221069A/ja
Publication of GB1508324A publication Critical patent/GB1508324A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
GB24062/75A 1975-06-04 1975-06-04 Moulds for encapsulating Expired GB1508324A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
GB24062/75A GB1508324A (en) 1975-06-04 1975-06-04 Moulds for encapsulating
US05/691,968 US4076791A (en) 1975-06-04 1976-06-01 Molds for encapsulating electrical components
CH685776A CH612120A5 (cg-RX-API-DMAC7.html) 1975-06-04 1976-06-01
DE19762624803 DE2624803A1 (de) 1975-06-04 1976-06-02 Form
CA253,943A CA1080922A (en) 1975-06-04 1976-06-02 Moulds
FR7616852A FR2313844A1 (fr) 1975-06-04 1976-06-03 Appareil et procede pour l'encapsulation de composants, notamment de composants electriques, a l'aide d'une resine thermodurcissable
JP51064701A JPS5221069A (en) 1975-06-04 1976-06-04 Sealed mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB24062/75A GB1508324A (en) 1975-06-04 1975-06-04 Moulds for encapsulating

Publications (1)

Publication Number Publication Date
GB1508324A true GB1508324A (en) 1978-04-19

Family

ID=10205765

Family Applications (1)

Application Number Title Priority Date Filing Date
GB24062/75A Expired GB1508324A (en) 1975-06-04 1975-06-04 Moulds for encapsulating

Country Status (7)

Country Link
US (1) US4076791A (cg-RX-API-DMAC7.html)
JP (1) JPS5221069A (cg-RX-API-DMAC7.html)
CA (1) CA1080922A (cg-RX-API-DMAC7.html)
CH (1) CH612120A5 (cg-RX-API-DMAC7.html)
DE (1) DE2624803A1 (cg-RX-API-DMAC7.html)
FR (1) FR2313844A1 (cg-RX-API-DMAC7.html)
GB (1) GB1508324A (cg-RX-API-DMAC7.html)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2952297A1 (de) * 1979-12-24 1981-07-02 Werner Dipl.-Ing. 6840 Lampertheim Schaller Verfahren und vorrichtung zur herstellung von elektronischen geraeten, insbesondere beruehrungslosen sensoren und modulen
US4611649A (en) * 1982-11-24 1986-09-16 Albany-Chicago Corporation Method of making multiple magnet core units
US4540966A (en) * 1982-11-24 1985-09-10 Albany-Chicago Corporation Multiple magnet core unit
US4543228A (en) * 1984-01-13 1985-09-24 Milton Roy Company Injection molded sliding vane pump
JPH069858B2 (ja) * 1988-12-14 1994-02-09 財団法人日本航空機開発協会 熱可塑性樹脂製品の成形方法および装置
US5833909A (en) * 1995-06-29 1998-11-10 Texas Instruments Incorporated Transfer molding process using self-straightening alignment pins
US5642991A (en) * 1996-03-11 1997-07-01 Procon Products Sliding vane pump with plastic housing
DE29611461U1 (de) * 1996-07-01 1996-09-12 Bürkert Werke GmbH & Co., 74653 Ingelfingen Vorrichtung zum Vergießen von Bauteilen
US7066628B2 (en) 2001-03-29 2006-06-27 Fiber Optic Designs, Inc. Jacketed LED assemblies and light strings containing same
JP4549521B2 (ja) * 2000-12-14 2010-09-22 フィーサ株式会社 インサート成形方法及び金型
GB0120835D0 (en) * 2001-08-28 2001-10-17 Smithkline Beecham Plc Process
EP1363120A1 (en) * 2002-05-14 2003-11-19 PerkinElmer International C.V. Tool for making a sample holder
US6817854B2 (en) * 2002-05-20 2004-11-16 Stmicroelectronics, Inc. Mold with compensating base
DE10340328A1 (de) * 2003-08-29 2005-03-24 Endress + Hauser Gmbh + Co. Kg Vergußschale
US7241414B2 (en) * 2004-06-25 2007-07-10 Asm Technology Singapore Pte Ltd. Method and apparatus for molding a semiconductor device
KR100980104B1 (ko) * 2005-09-28 2010-09-07 주식회사 엘지화학 이차전지 제조장치

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2266169A (en) * 1939-07-25 1941-12-16 Eastman Kodak Co Lens mount
GB869863A (en) * 1958-06-18 1961-06-07 A & M Fell Ltd Improvements in or relating to the manufacture of transistors, rectifiers and other semi-conductor devices
FR1297831A (fr) * 1961-05-24 1962-07-06 Air Liquide Perfectionnements aux moules servant à surmouler une pièce en matière plastique sur un objet en substance dure
GB1222651A (en) * 1966-12-30 1971-02-17 Fordath Ltd Formerly The Forda Improvements relating to articles which include carbon
US3525966A (en) * 1968-07-24 1970-08-25 Square D Co Encapsulated coil and method of making same and spacer for use during encapsulation
US3813763A (en) * 1970-12-17 1974-06-04 Gen Electric Laminated structure with insulating member formed in situ thereon and method for making same

Also Published As

Publication number Publication date
JPS5221069A (en) 1977-02-17
CA1080922A (en) 1980-07-08
FR2313844B1 (cg-RX-API-DMAC7.html) 1979-04-27
FR2313844A1 (fr) 1976-12-31
US4076791A (en) 1978-02-28
DE2624803A1 (de) 1976-12-23
CH612120A5 (cg-RX-API-DMAC7.html) 1979-07-13

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee