DE2542518C3 - - Google Patents

Info

Publication number
DE2542518C3
DE2542518C3 DE2542518A DE2542518A DE2542518C3 DE 2542518 C3 DE2542518 C3 DE 2542518C3 DE 2542518 A DE2542518 A DE 2542518A DE 2542518 A DE2542518 A DE 2542518A DE 2542518 C3 DE2542518 C3 DE 2542518C3
Authority
DE
Germany
Prior art keywords
power supply
supply system
layer
semiconductor
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2542518A
Other languages
German (de)
English (en)
Other versions
DE2542518B2 (de
DE2542518A1 (de
Inventor
William Arthur South Wonston Winchester Hampshire Warwick (Ver. Koenigreich)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE2542518A1 publication Critical patent/DE2542518A1/de
Publication of DE2542518B2 publication Critical patent/DE2542518B2/de
Application granted granted Critical
Publication of DE2542518C3 publication Critical patent/DE2542518C3/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/211—Design considerations for internal polarisation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H10W70/611—
    • H10W70/685—

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
DE19752542518 1974-11-20 1975-09-24 Stromversorgungssystem fuer hochintegrierte halbleiterschaltungen Granted DE2542518B2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB50342/74A GB1487945A (en) 1974-11-20 1974-11-20 Semiconductor integrated circuit devices

Publications (3)

Publication Number Publication Date
DE2542518A1 DE2542518A1 (de) 1976-08-12
DE2542518B2 DE2542518B2 (de) 1977-05-12
DE2542518C3 true DE2542518C3 (cg-RX-API-DMAC10.html) 1980-04-30

Family

ID=10455562

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19752542518 Granted DE2542518B2 (de) 1974-11-20 1975-09-24 Stromversorgungssystem fuer hochintegrierte halbleiterschaltungen

Country Status (11)

Country Link
US (1) US4021838A (cg-RX-API-DMAC10.html)
JP (1) JPS572183B2 (cg-RX-API-DMAC10.html)
CA (1) CA1038086A (cg-RX-API-DMAC10.html)
CH (1) CH594290A5 (cg-RX-API-DMAC10.html)
DE (1) DE2542518B2 (cg-RX-API-DMAC10.html)
ES (1) ES442615A1 (cg-RX-API-DMAC10.html)
FR (1) FR2292336A1 (cg-RX-API-DMAC10.html)
GB (1) GB1487945A (cg-RX-API-DMAC10.html)
IT (1) IT1042696B (cg-RX-API-DMAC10.html)
NL (1) NL7513483A (cg-RX-API-DMAC10.html)
SE (1) SE401754B (cg-RX-API-DMAC10.html)

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JPS5915183B2 (ja) * 1976-08-16 1984-04-07 株式会社日立製作所 マトリツクス配線基板
EP0007993A1 (de) * 1978-07-12 1980-02-20 Siemens Aktiengesellschaft Leiterplatte zur Halterung und elektrischen Verbindung von Halbleiterchips
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JPS61111561A (ja) * 1984-10-05 1986-05-29 Fujitsu Ltd 半導体装置
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US4845542A (en) * 1987-03-19 1989-07-04 Unisys Corporation Interconnect for layered integrated circuit assembly
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US4901136A (en) * 1987-07-14 1990-02-13 General Electric Company Multi-chip interconnection package
JPH01225137A (ja) * 1988-03-04 1989-09-08 Toshiba Corp 半導体集積回路装置
GB2249428A (en) * 1988-08-11 1992-05-06 Plessey Co Plc Connections for led arrays
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US5021869A (en) * 1988-12-27 1991-06-04 Hewlett-Packard Company Monolithic semiconductor chip interconnection technique and arrangement
EP0393220B1 (en) * 1989-04-20 1994-07-13 International Business Machines Corporation Integrated circuit package
JP2585799B2 (ja) * 1989-06-30 1997-02-26 株式会社東芝 半導体メモリ装置及びそのバーンイン方法
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US5434453A (en) * 1991-04-26 1995-07-18 Hitachi, Ltd. Semiconductor integrated circuit device and computer system using the same
US5185652A (en) * 1991-05-28 1993-02-09 Ncr Corporation Electrical connection between buses on a semiconductor integrated circuit
JPH05183019A (ja) * 1991-12-27 1993-07-23 Hitachi Ltd 半導体装置およびその製造方法
DE4222402A1 (de) * 1992-07-08 1994-01-13 Daimler Benz Ag Anordnung für die Mehrfachverdrahtung von Mulichipmodulen
US5454160A (en) * 1993-12-03 1995-10-03 Ncr Corporation Apparatus and method for stacking integrated circuit devices
FR2718571B1 (fr) * 1994-04-08 1996-05-15 Thomson Csf Composant hybride semiconducteur.
US6870272B2 (en) * 1994-09-20 2005-03-22 Tessera, Inc. Methods of making microelectronic assemblies including compliant interfaces
US6826827B1 (en) * 1994-12-29 2004-12-07 Tessera, Inc. Forming conductive posts by selective removal of conductive material
JPH08298269A (ja) * 1995-04-25 1996-11-12 Toshiba Microelectron Corp 半導体装置及びその製造方法
US6284563B1 (en) * 1995-10-31 2001-09-04 Tessera, Inc. Method of making compliant microelectronic assemblies
US6211572B1 (en) * 1995-10-31 2001-04-03 Tessera, Inc. Semiconductor chip package with fan-in leads
US5773897A (en) * 1997-02-21 1998-06-30 Raytheon Company Flip chip monolithic microwave integrated circuit with mushroom-shaped, solder-capped, plated metal bumps
US5815427A (en) * 1997-04-02 1998-09-29 Micron Technology, Inc. Modular memory circuit and method for forming same
US6687842B1 (en) 1997-04-02 2004-02-03 Tessera, Inc. Off-chip signal routing between multiply-connected on-chip electronic elements via external multiconductor transmission line on a dielectric element
WO1998044564A1 (en) * 1997-04-02 1998-10-08 Tessera, Inc. Chip with internal signal routing in external element
US6539484B1 (en) * 1997-12-18 2003-03-25 Intel Corporation Configurable power distribution circuit
US6310400B1 (en) * 1997-12-29 2001-10-30 Intel Corporation Apparatus for capacitively coupling electronic devices
JP3957237B2 (ja) * 1998-01-19 2007-08-15 富士通株式会社 集積回路装置モジュール
US6423623B1 (en) 1998-06-09 2002-07-23 Fairchild Semiconductor Corporation Low Resistance package for semiconductor devices
US6133634A (en) * 1998-08-05 2000-10-17 Fairchild Semiconductor Corporation High performance flip chip package
US6303423B1 (en) * 1998-12-21 2001-10-16 Megic Corporation Method for forming high performance system-on-chip using post passivation process
US6965165B2 (en) 1998-12-21 2005-11-15 Mou-Shiung Lin Top layers of metal for high performance IC's
US7531417B2 (en) * 1998-12-21 2009-05-12 Megica Corporation High performance system-on-chip passive device using post passivation process
US8421158B2 (en) * 1998-12-21 2013-04-16 Megica Corporation Chip structure with a passive device and method for forming the same
US8178435B2 (en) 1998-12-21 2012-05-15 Megica Corporation High performance system-on-chip inductor using post passivation process
US6869870B2 (en) * 1998-12-21 2005-03-22 Megic Corporation High performance system-on-chip discrete components using post passivation process
US6077766A (en) * 1999-06-25 2000-06-20 International Business Machines Corporation Variable thickness pads on a substrate surface
US6611050B1 (en) 2000-03-30 2003-08-26 International Business Machines Corporation Chip edge interconnect apparatus and method
US6624522B2 (en) 2000-04-04 2003-09-23 International Rectifier Corporation Chip scale surface mounted device and process of manufacture
US6930397B2 (en) * 2001-03-28 2005-08-16 International Rectifier Corporation Surface mounted package with die bottom spaced from support board
US7119447B2 (en) 2001-03-28 2006-10-10 International Rectifier Corporation Direct fet device for high frequency application
US7476964B2 (en) * 2001-06-18 2009-01-13 International Rectifier Corporation High voltage semiconductor device housing with increased clearance between housing can and die for improved flux flushing
US6582990B2 (en) 2001-08-24 2003-06-24 International Rectifier Corporation Wafer level underfill and interconnect process
US6759275B1 (en) * 2001-09-04 2004-07-06 Megic Corporation Method for making high-performance RF integrated circuits
US6784540B2 (en) 2001-10-10 2004-08-31 International Rectifier Corp. Semiconductor device package with improved cooling
US6673698B1 (en) 2002-01-19 2004-01-06 Megic Corporation Thin film semiconductor package utilizing a glass substrate with composite polymer/metal interconnect layers
TW584950B (en) * 2001-12-31 2004-04-21 Megic Corp Chip packaging structure and process thereof
TW544882B (en) * 2001-12-31 2003-08-01 Megic Corp Chip package structure and process thereof
TW503496B (en) * 2001-12-31 2002-09-21 Megic Corp Chip packaging structure and manufacturing process of the same
US6617679B2 (en) * 2002-02-08 2003-09-09 Advanced Energy Industries, Inc. Semiconductor package for multiple high power transistors
US7579697B2 (en) 2002-07-15 2009-08-25 International Rectifier Corporation Arrangement for high frequency application
US7397137B2 (en) * 2002-07-15 2008-07-08 International Rectifier Corporation Direct FET device for high frequency application
JP3828473B2 (ja) * 2002-09-30 2006-10-04 株式会社東芝 積層型半導体装置及びその製造方法
US6841865B2 (en) * 2002-11-22 2005-01-11 International Rectifier Corporation Semiconductor device having clips for connecting to external elements
JP2006518944A (ja) * 2003-02-25 2006-08-17 テッセラ，インコーポレイテッド バンプを有するボールグリッドアレー
US8368150B2 (en) * 2003-03-17 2013-02-05 Megica Corporation High performance IC chip having discrete decoupling capacitors attached to its IC surface
TWI236763B (en) * 2003-05-27 2005-07-21 Megic Corp High performance system-on-chip inductor using post passivation process
US20050269677A1 (en) * 2004-05-28 2005-12-08 Martin Standing Preparation of front contact for surface mounting
US7453157B2 (en) 2004-06-25 2008-11-18 Tessera, Inc. Microelectronic packages and methods therefor
US7423346B2 (en) * 2004-09-09 2008-09-09 Megica Corporation Post passivation interconnection process and structures
US8008775B2 (en) 2004-09-09 2011-08-30 Megica Corporation Post passivation interconnection structures
US7355282B2 (en) * 2004-09-09 2008-04-08 Megica Corporation Post passivation interconnection process and structures
US7999379B2 (en) * 2005-02-25 2011-08-16 Tessera, Inc. Microelectronic assemblies having compliancy
US8384189B2 (en) * 2005-03-29 2013-02-26 Megica Corporation High performance system-on-chip using post passivation process
US7524701B2 (en) * 2005-04-20 2009-04-28 International Rectifier Corporation Chip-scale package
US7230333B2 (en) 2005-04-21 2007-06-12 International Rectifier Corporation Semiconductor package
TWI365516B (en) 2005-04-22 2012-06-01 Int Rectifier Corp Chip-scale package
TWI330863B (en) * 2005-05-18 2010-09-21 Megica Corp Semiconductor chip with coil element over passivation layer
TWI320219B (en) 2005-07-22 2010-02-01 Method for forming a double embossing structure
US7473999B2 (en) * 2005-09-23 2009-01-06 Megica Corporation Semiconductor chip and process for forming the same
JP4795883B2 (ja) * 2006-07-21 2011-10-19 株式会社日立ハイテクノロジーズ パターン検査・計測装置
JP4116055B2 (ja) * 2006-12-04 2008-07-09 シャープ株式会社 半導体装置
US7749886B2 (en) 2006-12-20 2010-07-06 Tessera, Inc. Microelectronic assemblies having compliancy and methods therefor
US20080150101A1 (en) * 2006-12-20 2008-06-26 Tessera, Inc. Microelectronic packages having improved input/output connections and methods therefor
US8749021B2 (en) * 2006-12-26 2014-06-10 Megit Acquisition Corp. Voltage regulator integrated with semiconductor chip
JP5102726B2 (ja) * 2008-09-08 2012-12-19 ラピスセミコンダクタ株式会社 半導体装置の製造方法
US8729474B1 (en) * 2009-10-09 2014-05-20 Flir Systems, Inc. Microbolometer contact systems and methods
US9658111B2 (en) * 2009-10-09 2017-05-23 Flir Systems, Inc. Microbolometer contact systems and methods
US9137903B2 (en) 2010-12-21 2015-09-15 Tessera, Inc. Semiconductor chip assembly and method for making same
US8810006B2 (en) * 2012-08-10 2014-08-19 Taiwan Semiconductor Manufacturing Company, Ltd. Interposer system and method
KR20190117789A (ko) * 2017-05-17 2019-10-16 가부시키가이샤 노다스크린 박막 캐패시터 구조, 및 당해 박막 캐패시터 구조를 구비한 반도체 장치

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FR1564787A (cg-RX-API-DMAC10.html) * 1968-03-04 1969-04-25
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US3947840A (en) * 1974-08-16 1976-03-30 Monsanto Company Integrated semiconductor light-emitting display array

Also Published As

Publication number Publication date
IT1042696B (it) 1980-01-30
SE401754B (sv) 1978-05-22
CH594290A5 (cg-RX-API-DMAC10.html) 1978-01-13
CA1038086A (en) 1978-09-05
SE7511787L (sv) 1976-05-21
ES442615A1 (es) 1977-04-16
GB1487945A (en) 1977-10-05
US4021838A (en) 1977-05-03
DE2542518B2 (de) 1977-05-12
JPS572183B2 (cg-RX-API-DMAC10.html) 1982-01-14
FR2292336B1 (cg-RX-API-DMAC10.html) 1977-12-16
FR2292336A1 (fr) 1976-06-18
JPS5171790A (cg-RX-API-DMAC10.html) 1976-06-21
NL7513483A (nl) 1976-05-24
DE2542518A1 (de) 1976-08-12

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
8339 Ceased/non-payment of the annual fee