CH594290A5 - - Google Patents

Info

Publication number
CH594290A5
CH594290A5 CH1484175A CH1484175A CH594290A5 CH 594290 A5 CH594290 A5 CH 594290A5 CH 1484175 A CH1484175 A CH 1484175A CH 1484175 A CH1484175 A CH 1484175A CH 594290 A5 CH594290 A5 CH 594290A5
Authority
CH
Switzerland
Application number
CH1484175A
Inventor
William Arthur Warwick
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of CH594290A5 publication Critical patent/CH594290A5/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0214—Particular design considerations for integrated circuits for internal polarisation, e.g. I2L
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01056—Barium [Ba]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01061—Promethium [Pm]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12033—Gunn diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
CH1484175A 1974-11-20 1975-11-17 CH594290A5 (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB50342/74A GB1487945A (en) 1974-11-20 1974-11-20 Semiconductor integrated circuit devices

Publications (1)

Publication Number Publication Date
CH594290A5 true CH594290A5 (xx) 1978-01-13

Family

ID=10455562

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1484175A CH594290A5 (xx) 1974-11-20 1975-11-17

Country Status (11)

Country Link
US (1) US4021838A (xx)
JP (1) JPS572183B2 (xx)
CA (1) CA1038086A (xx)
CH (1) CH594290A5 (xx)
DE (1) DE2542518B2 (xx)
ES (1) ES442615A1 (xx)
FR (1) FR2292336A1 (xx)
GB (1) GB1487945A (xx)
IT (1) IT1042696B (xx)
NL (1) NL7513483A (xx)
SE (1) SE401754B (xx)

Families Citing this family (96)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5915183B2 (ja) * 1976-08-16 1984-04-07 株式会社日立製作所 マトリツクス配線基板
EP0007993A1 (de) * 1978-07-12 1980-02-20 Siemens Aktiengesellschaft Leiterplatte zur Halterung und elektrischen Verbindung von Halbleiterchips
US4516123A (en) * 1982-12-27 1985-05-07 At&T Bell Laboratories Integrated circuit including logic array with distributed ground connections
GB2137807B (en) * 1983-04-05 1987-08-12 Plessey Co Plc A semiconductor component and method of manufacture
US4575745A (en) * 1983-06-21 1986-03-11 Rca Corporation Tailorable standard cells and method for tailoring the performance of IC designs
US4583111A (en) * 1983-09-09 1986-04-15 Fairchild Semiconductor Corporation Integrated circuit chip wiring arrangement providing reduced circuit inductance and controlled voltage gradients
US4847732A (en) * 1983-09-15 1989-07-11 Mosaic Systems, Inc. Wafer and method of making same
US4920454A (en) * 1983-09-15 1990-04-24 Mosaic Systems, Inc. Wafer scale package system and header and method of manufacture thereof
US4649417A (en) * 1983-09-22 1987-03-10 International Business Machines Corporation Multiple voltage integrated circuit packaging substrate
US4833521A (en) * 1983-12-13 1989-05-23 Fairchild Camera & Instrument Corp. Means for reducing signal propagation losses in very large scale integrated circuits
JPS61501295A (ja) * 1984-02-21 1986-06-26 エンバィアロンメンタル・リサーチ・インスティテュート・オブ・ミシガン ウェハスケールパッケージシステム
EP0173733B1 (en) * 1984-02-21 1992-08-05 Environmental Research Institute of Michigan Capacitive device
JPS61111561A (ja) * 1984-10-05 1986-05-29 Fujitsu Ltd 半導体装置
US4996584A (en) * 1985-01-31 1991-02-26 Gould, Inc. Thin-film electrical connections for integrated circuits
US4845542A (en) * 1987-03-19 1989-07-04 Unisys Corporation Interconnect for layered integrated circuit assembly
US4910574A (en) * 1987-04-30 1990-03-20 Ibm Corporation Porous circuit macro for semiconductor integrated circuits
US4901136A (en) * 1987-07-14 1990-02-13 General Electric Company Multi-chip interconnection package
JPH01225137A (ja) * 1988-03-04 1989-09-08 Toshiba Corp 半導体集積回路装置
GB2249428A (en) * 1988-08-11 1992-05-06 Plessey Co Plc Connections for led arrays
US5191405A (en) * 1988-12-23 1993-03-02 Matsushita Electric Industrial Co., Ltd. Three-dimensional stacked lsi
US5021869A (en) * 1988-12-27 1991-06-04 Hewlett-Packard Company Monolithic semiconductor chip interconnection technique and arrangement
EP0393220B1 (en) * 1989-04-20 1994-07-13 International Business Machines Corporation Integrated circuit package
JP2585799B2 (ja) * 1989-06-30 1997-02-26 株式会社東芝 半導体メモリ装置及びそのバーンイン方法
AU634334B2 (en) * 1990-01-23 1993-02-18 Sumitomo Electric Industries, Ltd. Packaging structure and method for packaging a semiconductor device
US5068715A (en) * 1990-06-29 1991-11-26 Digital Equipment Corporation High-power, high-performance integrated circuit chip package
US5434453A (en) * 1991-04-26 1995-07-18 Hitachi, Ltd. Semiconductor integrated circuit device and computer system using the same
US5185652A (en) * 1991-05-28 1993-02-09 Ncr Corporation Electrical connection between buses on a semiconductor integrated circuit
JPH05183019A (ja) * 1991-12-27 1993-07-23 Hitachi Ltd 半導体装置およびその製造方法
DE4222402A1 (de) * 1992-07-08 1994-01-13 Daimler Benz Ag Anordnung für die Mehrfachverdrahtung von Mulichipmodulen
US5454160A (en) * 1993-12-03 1995-10-03 Ncr Corporation Apparatus and method for stacking integrated circuit devices
FR2718571B1 (fr) * 1994-04-08 1996-05-15 Thomson Csf Composant hybride semiconducteur.
US6870272B2 (en) * 1994-09-20 2005-03-22 Tessera, Inc. Methods of making microelectronic assemblies including compliant interfaces
US6826827B1 (en) * 1994-12-29 2004-12-07 Tessera, Inc. Forming conductive posts by selective removal of conductive material
JPH08298269A (ja) * 1995-04-25 1996-11-12 Toshiba Microelectron Corp 半導体装置及びその製造方法
US6211572B1 (en) * 1995-10-31 2001-04-03 Tessera, Inc. Semiconductor chip package with fan-in leads
US6284563B1 (en) * 1995-10-31 2001-09-04 Tessera, Inc. Method of making compliant microelectronic assemblies
US5773897A (en) * 1997-02-21 1998-06-30 Raytheon Company Flip chip monolithic microwave integrated circuit with mushroom-shaped, solder-capped, plated metal bumps
US6687842B1 (en) 1997-04-02 2004-02-03 Tessera, Inc. Off-chip signal routing between multiply-connected on-chip electronic elements via external multiconductor transmission line on a dielectric element
US5815427A (en) * 1997-04-02 1998-09-29 Micron Technology, Inc. Modular memory circuit and method for forming same
WO1998044564A1 (en) * 1997-04-02 1998-10-08 Tessera, Inc. Chip with internal signal routing in external element
US6539484B1 (en) * 1997-12-18 2003-03-25 Intel Corporation Configurable power distribution circuit
US6310400B1 (en) * 1997-12-29 2001-10-30 Intel Corporation Apparatus for capacitively coupling electronic devices
JP3957237B2 (ja) * 1998-01-19 2007-08-15 富士通株式会社 集積回路装置モジュール
US6423623B1 (en) 1998-06-09 2002-07-23 Fairchild Semiconductor Corporation Low Resistance package for semiconductor devices
US6133634A (en) * 1998-08-05 2000-10-17 Fairchild Semiconductor Corporation High performance flip chip package
US6303423B1 (en) * 1998-12-21 2001-10-16 Megic Corporation Method for forming high performance system-on-chip using post passivation process
US8178435B2 (en) 1998-12-21 2012-05-15 Megica Corporation High performance system-on-chip inductor using post passivation process
US8421158B2 (en) * 1998-12-21 2013-04-16 Megica Corporation Chip structure with a passive device and method for forming the same
US6965165B2 (en) 1998-12-21 2005-11-15 Mou-Shiung Lin Top layers of metal for high performance IC's
US6869870B2 (en) * 1998-12-21 2005-03-22 Megic Corporation High performance system-on-chip discrete components using post passivation process
US7531417B2 (en) * 1998-12-21 2009-05-12 Megica Corporation High performance system-on-chip passive device using post passivation process
US6077766A (en) * 1999-06-25 2000-06-20 International Business Machines Corporation Variable thickness pads on a substrate surface
US6611050B1 (en) 2000-03-30 2003-08-26 International Business Machines Corporation Chip edge interconnect apparatus and method
US6624522B2 (en) * 2000-04-04 2003-09-23 International Rectifier Corporation Chip scale surface mounted device and process of manufacture
US7119447B2 (en) 2001-03-28 2006-10-10 International Rectifier Corporation Direct fet device for high frequency application
US6930397B2 (en) * 2001-03-28 2005-08-16 International Rectifier Corporation Surface mounted package with die bottom spaced from support board
US7476964B2 (en) * 2001-06-18 2009-01-13 International Rectifier Corporation High voltage semiconductor device housing with increased clearance between housing can and die for improved flux flushing
US6582990B2 (en) 2001-08-24 2003-06-24 International Rectifier Corporation Wafer level underfill and interconnect process
US6759275B1 (en) * 2001-09-04 2004-07-06 Megic Corporation Method for making high-performance RF integrated circuits
US6784540B2 (en) 2001-10-10 2004-08-31 International Rectifier Corp. Semiconductor device package with improved cooling
TW584950B (en) 2001-12-31 2004-04-21 Megic Corp Chip packaging structure and process thereof
US6673698B1 (en) 2002-01-19 2004-01-06 Megic Corporation Thin film semiconductor package utilizing a glass substrate with composite polymer/metal interconnect layers
TW544882B (en) * 2001-12-31 2003-08-01 Megic Corp Chip package structure and process thereof
TW503496B (en) * 2001-12-31 2002-09-21 Megic Corp Chip packaging structure and manufacturing process of the same
US6617679B2 (en) * 2002-02-08 2003-09-09 Advanced Energy Industries, Inc. Semiconductor package for multiple high power transistors
US7579697B2 (en) 2002-07-15 2009-08-25 International Rectifier Corporation Arrangement for high frequency application
US7397137B2 (en) * 2002-07-15 2008-07-08 International Rectifier Corporation Direct FET device for high frequency application
JP3828473B2 (ja) * 2002-09-30 2006-10-04 株式会社東芝 積層型半導体装置及びその製造方法
US6841865B2 (en) * 2002-11-22 2005-01-11 International Rectifier Corporation Semiconductor device having clips for connecting to external elements
US20040222518A1 (en) * 2003-02-25 2004-11-11 Tessera, Inc. Ball grid array with bumps
US8368150B2 (en) * 2003-03-17 2013-02-05 Megica Corporation High performance IC chip having discrete decoupling capacitors attached to its IC surface
TWI236763B (en) * 2003-05-27 2005-07-21 Megic Corp High performance system-on-chip inductor using post passivation process
US20050269677A1 (en) * 2004-05-28 2005-12-08 Martin Standing Preparation of front contact for surface mounting
US7453157B2 (en) 2004-06-25 2008-11-18 Tessera, Inc. Microelectronic packages and methods therefor
US7355282B2 (en) * 2004-09-09 2008-04-08 Megica Corporation Post passivation interconnection process and structures
US7423346B2 (en) * 2004-09-09 2008-09-09 Megica Corporation Post passivation interconnection process and structures
US8008775B2 (en) 2004-09-09 2011-08-30 Megica Corporation Post passivation interconnection structures
EP1851798B1 (en) * 2005-02-25 2016-08-03 Tessera, Inc. Microelectronic assemblies having compliancy
US8384189B2 (en) * 2005-03-29 2013-02-26 Megica Corporation High performance system-on-chip using post passivation process
US7524701B2 (en) * 2005-04-20 2009-04-28 International Rectifier Corporation Chip-scale package
US7230333B2 (en) 2005-04-21 2007-06-12 International Rectifier Corporation Semiconductor package
TWI365516B (en) 2005-04-22 2012-06-01 Int Rectifier Corp Chip-scale package
US7470927B2 (en) * 2005-05-18 2008-12-30 Megica Corporation Semiconductor chip with coil element over passivation layer
TWI305951B (en) 2005-07-22 2009-02-01 Megica Corp Method for forming a double embossing structure
US7473999B2 (en) * 2005-09-23 2009-01-06 Megica Corporation Semiconductor chip and process for forming the same
JP4795883B2 (ja) * 2006-07-21 2011-10-19 株式会社日立ハイテクノロジーズ パターン検査・計測装置
JP4116055B2 (ja) * 2006-12-04 2008-07-09 シャープ株式会社 半導体装置
US7749886B2 (en) * 2006-12-20 2010-07-06 Tessera, Inc. Microelectronic assemblies having compliancy and methods therefor
US20080150101A1 (en) * 2006-12-20 2008-06-26 Tessera, Inc. Microelectronic packages having improved input/output connections and methods therefor
US8749021B2 (en) * 2006-12-26 2014-06-10 Megit Acquisition Corp. Voltage regulator integrated with semiconductor chip
JP5102726B2 (ja) * 2008-09-08 2012-12-19 ラピスセミコンダクタ株式会社 半導体装置の製造方法
US9658111B2 (en) * 2009-10-09 2017-05-23 Flir Systems, Inc. Microbolometer contact systems and methods
US8729474B1 (en) * 2009-10-09 2014-05-20 Flir Systems, Inc. Microbolometer contact systems and methods
US9137903B2 (en) 2010-12-21 2015-09-15 Tessera, Inc. Semiconductor chip assembly and method for making same
US8810006B2 (en) * 2012-08-10 2014-08-19 Taiwan Semiconductor Manufacturing Company, Ltd. Interposer system and method
WO2018211614A1 (ja) * 2017-05-17 2018-11-22 株式会社野田スクリーン 薄膜キャパシタ構造、および当該薄膜キャパシタ構造を備えた半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1112992A (en) * 1964-08-18 1968-05-08 Texas Instruments Inc Three-dimensional integrated circuits and methods of making same
FR1564787A (xx) * 1968-03-04 1969-04-25
US3638202A (en) * 1970-03-19 1972-01-25 Bell Telephone Labor Inc Access circuit arrangement for equalized loading in integrated circuit arrays
US3947840A (en) * 1974-08-16 1976-03-30 Monsanto Company Integrated semiconductor light-emitting display array

Also Published As

Publication number Publication date
IT1042696B (it) 1980-01-30
GB1487945A (en) 1977-10-05
DE2542518B2 (de) 1977-05-12
CA1038086A (en) 1978-09-05
DE2542518A1 (de) 1976-08-12
JPS5171790A (xx) 1976-06-21
DE2542518C3 (xx) 1980-04-30
SE401754B (sv) 1978-05-22
JPS572183B2 (xx) 1982-01-14
FR2292336A1 (fr) 1976-06-18
SE7511787L (sv) 1976-05-21
US4021838A (en) 1977-05-03
ES442615A1 (es) 1977-04-16
FR2292336B1 (xx) 1977-12-16
NL7513483A (nl) 1976-05-24

Similar Documents

Publication Publication Date Title
JPS572183B2 (xx)
FR2286356B1 (xx)
JPS50149298A (xx)
FR2261981A1 (xx)
JPS50155846U (xx)
JPS50131521A (xx)
FR2258645B1 (xx)
JPS5136279U (xx)
JPS50135886A (xx)
FR2259383B1 (xx)
JPS50156547U (xx)
JPS5117919U (xx)
JPS50148109A (xx)
JPS5159810U (xx)
JPS5132507U (xx)
JPS5145844U (xx)
JPS5151779A (xx)
JPS50144563A (xx)
AU480622A (xx)
CH586120A5 (xx)
CH581549A5 (xx)
BG21058A1 (xx)
BG20685A1 (xx)
BG20473A1 (xx)
BG20141A1 (xx)

Legal Events

Date Code Title Description
PL Patent ceased