DE2414117A1 - Monolithisches halbleiter-anzeigegeraet - Google Patents
Monolithisches halbleiter-anzeigegeraetInfo
- Publication number
- DE2414117A1 DE2414117A1 DE2414117A DE2414117A DE2414117A1 DE 2414117 A1 DE2414117 A1 DE 2414117A1 DE 2414117 A DE2414117 A DE 2414117A DE 2414117 A DE2414117 A DE 2414117A DE 2414117 A1 DE2414117 A1 DE 2414117A1
- Authority
- DE
- Germany
- Prior art keywords
- conductivity type
- display device
- strips
- areas
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 10
- 239000000758 substrate Substances 0.000 claims description 48
- 239000000463 material Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 229910005540 GaP Inorganic materials 0.000 claims description 7
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 238000002955 isolation Methods 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- -1 zinc activated gallium phosphide Chemical class 0.000 claims 1
- 230000000873 masking effect Effects 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000004922 lacquer Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000012047 saturated solution Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- ZVNPWFOVUDMGRP-UHFFFAOYSA-N 4-methylaminophenol sulfate Chemical compound OS(O)(=O)=O.CNC1=CC=C(O)C=C1.CNC1=CC=C(O)C=C1 ZVNPWFOVUDMGRP-UHFFFAOYSA-N 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910000927 Ge alloy Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- BYDQGSVXQDOSJJ-UHFFFAOYSA-N [Ge].[Au] Chemical compound [Ge].[Au] BYDQGSVXQDOSJJ-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
Landscapes
- Led Devices (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US34509973A | 1973-03-26 | 1973-03-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE2414117A1 true DE2414117A1 (de) | 1974-10-03 |
Family
ID=23353515
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2414117A Pending DE2414117A1 (de) | 1973-03-26 | 1974-03-23 | Monolithisches halbleiter-anzeigegeraet |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS5028287A (enrdf_load_stackoverflow) |
DE (1) | DE2414117A1 (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5961554U (ja) * | 1982-10-19 | 1984-04-23 | 三洋電機株式会社 | マトリクス型発光ダイオ−ド |
JPH0631807Y2 (ja) * | 1987-11-13 | 1994-08-22 | 三洋電機株式会社 | 高圧安定化回路 |
-
1974
- 1974-03-23 DE DE2414117A patent/DE2414117A1/de active Pending
- 1974-03-25 JP JP3269774A patent/JPS5028287A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JPS5028287A (enrdf_load_stackoverflow) | 1975-03-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE1614283C3 (de) | Verfahren zum Herstellen einer Halbleiteranordnung | |
DE2640525C2 (de) | Verfahren zur Herstellung einer MIS-Halbleiterschaltungsanordnung | |
DE1903961C3 (de) | Integrierte Halbleiterschaltung und Verfahren zu ihrer Herstellung | |
DE1439935A1 (de) | Halbleitereinrichtung und Verfahren zu deren Herstellung | |
DE2826486A1 (de) | Lichtemittierende halbleitervorrichtung und verfahren zu ihrer herstellung | |
DE2142146B2 (de) | Verfahren zum gleichzeitigen Herstellen mehrerer Halbleiterbauelemente | |
DE2554398A1 (de) | Lichtemissionsdiodenelement und -anordnung | |
DE2031333C3 (de) | Verfahren zum Herstellen eines Halbleiterbauelementes | |
EP0005185A1 (de) | Verfahren zum gleichzeitigen Herstellen von Schottky-Sperrschichtdioden und ohmschen Kontakten nach dotierten Halbleiterzonen | |
DE1564191A1 (de) | Verfahren zum elektrischen Isolieren verschiedener in einer integrierten oder monolithischen Halbleitervorrichtung zusammengefasster Schaltelemente gegeneinander und gegen das gemeinsame Substrat | |
EP0012220A1 (de) | Verfahren zur Herstellung eines Schottky-Kontakts mit selbstjustierter Schutzringzone | |
DE1302005B (enrdf_load_stackoverflow) | ||
DE2823973A1 (de) | Verfahren zur herstellung eines halbleiters und nach diesem verfahren hergestellter halbleiter | |
DE1814747C2 (de) | Verfahren zum Herstellen von Feldefekttransistoren | |
DE2147447B2 (de) | Halbleiterbauelement | |
DE1564534A1 (de) | Transistor und Verfahren zu seiner Herstellung | |
DE1812130B2 (de) | Verfahren zum herstellen einer halbleiter- oder dickfilmanordnung | |
DE2247911C2 (de) | Monolithisch integrierte Schaltungsanordnung | |
DE2414117A1 (de) | Monolithisches halbleiter-anzeigegeraet | |
DE2039027C3 (de) | Halbleiteranordnung mit einem Träger aus Isoliermaterial, einem Halbleiterbauelement und einem Anschlußfleck | |
DE2501074A1 (de) | Transistoreinrichtung und verfahren zu ihrer herstellung | |
DE3234925A1 (de) | Duennschichtvorrichtung und verfahren zu deren herstellung | |
DE2207057A1 (de) | Monolithische Halbleiter-Anzeigevorrichtung | |
DE1771344A1 (de) | Verfahren zum Zertrennen eines Materialstueckes durch Tiefenaetzung | |
DE1927876C3 (de) | Halbleiteranordnung |