DE2305883A1 - Leiterplatte - Google Patents

Leiterplatte

Info

Publication number
DE2305883A1
DE2305883A1 DE19732305883 DE2305883A DE2305883A1 DE 2305883 A1 DE2305883 A1 DE 2305883A1 DE 19732305883 DE19732305883 DE 19732305883 DE 2305883 A DE2305883 A DE 2305883A DE 2305883 A1 DE2305883 A1 DE 2305883A1
Authority
DE
Germany
Prior art keywords
conductor tracks
circuit board
carrier plate
tracks
punched
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19732305883
Other languages
German (de)
English (en)
Inventor
Rudolf Hubrich
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FINSTERHOELZL RAFI ELEKT
Rafi Raimund Finsterholzl Elektrotechnische Spezialfabrik
Original Assignee
FINSTERHOELZL RAFI ELEKT
Rafi Raimund Finsterholzl Elektrotechnische Spezialfabrik
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FINSTERHOELZL RAFI ELEKT, Rafi Raimund Finsterholzl Elektrotechnische Spezialfabrik filed Critical FINSTERHOELZL RAFI ELEKT
Priority to DE19732305883 priority Critical patent/DE2305883A1/de
Priority to NL7303597A priority patent/NL7303597A/xx
Priority to JP3151273A priority patent/JPS5018977A/ja
Priority to FR7311825A priority patent/FR2216750B1/fr
Priority to GB1684673A priority patent/GB1426629A/en
Publication of DE2305883A1 publication Critical patent/DE2305883A1/de
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09118Moulded substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10053Switch

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)
DE19732305883 1973-02-07 1973-02-07 Leiterplatte Pending DE2305883A1 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE19732305883 DE2305883A1 (de) 1973-02-07 1973-02-07 Leiterplatte
NL7303597A NL7303597A (enrdf_load_stackoverflow) 1973-02-07 1973-03-15
JP3151273A JPS5018977A (enrdf_load_stackoverflow) 1973-02-07 1973-03-20
FR7311825A FR2216750B1 (enrdf_load_stackoverflow) 1973-02-07 1973-04-02
GB1684673A GB1426629A (en) 1973-02-07 1973-04-09 Circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19732305883 DE2305883A1 (de) 1973-02-07 1973-02-07 Leiterplatte

Publications (1)

Publication Number Publication Date
DE2305883A1 true DE2305883A1 (de) 1974-08-15

Family

ID=5871175

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19732305883 Pending DE2305883A1 (de) 1973-02-07 1973-02-07 Leiterplatte

Country Status (5)

Country Link
JP (1) JPS5018977A (enrdf_load_stackoverflow)
DE (1) DE2305883A1 (enrdf_load_stackoverflow)
FR (1) FR2216750B1 (enrdf_load_stackoverflow)
GB (1) GB1426629A (enrdf_load_stackoverflow)
NL (1) NL7303597A (enrdf_load_stackoverflow)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2735124A1 (de) * 1976-08-06 1978-02-09 Sev Alternateurs Verfahren zur herstellung einer elektrischen schaltung, nach dem verfahren hergestellte schaltungsplatte und anwendung einer nach dem verfahren hergestellten schaltungsplatte fuer automobilgleichrichter
EP0127689A1 (de) * 1983-05-19 1984-12-12 Ibm Deutschland Gmbh Verfahren zum Herstellen von gedruckten Schaltungen mit in das Isolierstoffsubstrat eingebetteten metallischen Leiterzugstrukturen
DE3605342A1 (de) * 1985-02-22 1986-09-04 AMP-Akzo Corp., Newark, Del. Fuer das aufbringen festhaftender metallbelaege geeignete formkoerper, metallisierte formkoerper sowie verfahren zu deren herstellung
EP0216466A3 (en) * 1985-09-03 1988-04-06 Molex Incorporated Stamped circuitry assembly
DE3641995C1 (de) * 1986-12-09 1988-05-19 Philips Patentverwaltung Verfahren zum Herstellen von gedruckten Schaltungen
DE3924176A1 (de) * 1988-07-26 1990-02-01 Steinmueller Kg Atlanta Kabel Verfahren zur herstellung einer leiterplatine
DE4313006A1 (de) * 1993-04-21 1994-11-03 Duerrwaechter E Dr Doduco Elektrische Leiterbahn aus Metall
US5407622A (en) * 1985-02-22 1995-04-18 Smith Corona Corporation Process for making metallized plastic articles
DE102009012088A1 (de) * 2009-03-06 2010-09-09 Hella Kgaa Hueck & Co. Zündgerät für eine Hochdruckgasentladungslampe

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5479081U (enrdf_load_stackoverflow) * 1977-11-15 1979-06-05
JPS55111015A (en) * 1979-02-20 1980-08-27 Sanyo Electric Co Feeder for electric equipment and method of manufacturing same
JPS59147448A (ja) * 1983-02-12 1984-08-23 Fujitsu Ltd 半導体素子搭載用リ−ドフレ−ムおよびこれを用いて製造される半導体装置とその製造方法
DE3427908C2 (de) * 1984-07-28 1986-10-02 Gebrüder Junghans GmbH, 7230 Schramberg Verfahren zum Herstellen des Schaltungsträgers eines elektromechanischen Uhrwerks und nach solchem Verfahren herstellbarer Schaltungsträger
FR2574222B1 (fr) * 1984-12-04 1987-05-29 Sintra Procede de fabrication d'un substrat pour circuit hybride comportant des connexions faiblement resistives
FR2584862B1 (fr) * 1985-07-12 1988-05-20 Eurotechnique Sa Procede de fabrication en continu de micromodules pour cartes contenant des composants, bande continue de micromodules et micromodules realises selon un tel procede
FR2590051B1 (fr) * 1985-11-08 1991-05-17 Eurotechnique Sa Carte comportant un composant et micromodule a contacts de flanc
FR2590052B1 (fr) * 1985-11-08 1991-03-01 Eurotechnique Sa Procede de recyclage d'une carte comportant un composant, carte prevue pour etre recyclee
KR0165544B1 (ko) * 1990-03-05 1999-03-20 야마다 로꾸이찌 전자발음장치
US5343616B1 (en) * 1992-02-14 1998-12-29 Rock Ltd Method of making high density self-aligning conductive networks and contact clusters
US5584120A (en) * 1992-02-14 1996-12-17 Research Organization For Circuit Knowledge Method of manufacturing printed circuits
EP0836113A3 (en) * 1996-10-14 2000-08-02 Konica Corporation Lens-fitted film unit with electronic flash

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3177103A (en) * 1961-09-18 1965-04-06 Sauders Associates Inc Two pass etching for fabricating printed circuitry

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2735124A1 (de) * 1976-08-06 1978-02-09 Sev Alternateurs Verfahren zur herstellung einer elektrischen schaltung, nach dem verfahren hergestellte schaltungsplatte und anwendung einer nach dem verfahren hergestellten schaltungsplatte fuer automobilgleichrichter
EP0127689A1 (de) * 1983-05-19 1984-12-12 Ibm Deutschland Gmbh Verfahren zum Herstellen von gedruckten Schaltungen mit in das Isolierstoffsubstrat eingebetteten metallischen Leiterzugstrukturen
DE3605342A1 (de) * 1985-02-22 1986-09-04 AMP-Akzo Corp., Newark, Del. Fuer das aufbringen festhaftender metallbelaege geeignete formkoerper, metallisierte formkoerper sowie verfahren zu deren herstellung
US5407622A (en) * 1985-02-22 1995-04-18 Smith Corona Corporation Process for making metallized plastic articles
EP0216466A3 (en) * 1985-09-03 1988-04-06 Molex Incorporated Stamped circuitry assembly
DE3641995C1 (de) * 1986-12-09 1988-05-19 Philips Patentverwaltung Verfahren zum Herstellen von gedruckten Schaltungen
EP0271163A3 (en) * 1986-12-09 1988-12-28 Philips Patentverwaltung Gmbh Manufacturing method of electrical circuit boards
DE3924176A1 (de) * 1988-07-26 1990-02-01 Steinmueller Kg Atlanta Kabel Verfahren zur herstellung einer leiterplatine
DE4313006A1 (de) * 1993-04-21 1994-11-03 Duerrwaechter E Dr Doduco Elektrische Leiterbahn aus Metall
DE4313006C2 (de) * 1993-04-21 1998-05-20 Duerrwaechter E Dr Doduco Elektrische Leiterbahn, insbesondere aus Bimetall
DE102009012088A1 (de) * 2009-03-06 2010-09-09 Hella Kgaa Hueck & Co. Zündgerät für eine Hochdruckgasentladungslampe

Also Published As

Publication number Publication date
FR2216750B1 (enrdf_load_stackoverflow) 1979-06-22
FR2216750A1 (enrdf_load_stackoverflow) 1974-08-30
GB1426629A (en) 1976-03-03
NL7303597A (enrdf_load_stackoverflow) 1974-08-09
JPS5018977A (enrdf_load_stackoverflow) 1975-02-27

Similar Documents

Publication Publication Date Title
DE2305883A1 (de) Leiterplatte
DE69131712T2 (de) Lottragender anschlussdraht
DE2634452A1 (de) Programmierbares dip-steckgehaeuse
DE2532727A1 (de) Verbindungsvorrichtung
DE3213884A1 (de) Anschlussvorrichtung fuer ein plattenfoermiges elektrisches geraet
DE60128537T2 (de) Zusammenbau zur verbindung von mindestens zwei gedruckten schaltungen
DE8912914U1 (de) Leiteranordnung aus gestanzten Leiterbahnen
DE2247498A1 (de) Anklemmbares kontaktplaettchen fuer flexible schaltkreise
DE1204297B (de) Steckeraufnahmekontakt fuer Schaltkarten
DE2618994A1 (de) Verfahren zur herstellung eines unterteils fuer ein elektromagnetisches relais
DE1233038B (de) Elektrisches Geraet, bei dem die elektrischen Verbindungen zwischen seinen Bauelementen mittels Schaltungsplatten hergestellt sind
DE102010027149A1 (de) Verbiegbare Metallkernleiterplatte
EP0076292B1 (de) Elektrische kontaktvorrichtung, insbesondere für mit leiterplatten ausgestattete elektrische kleingeräte
DE3540639A1 (de) Verfahren zum herstellen eines schalters
DE3511802A1 (de) Schwingeinheit eines dynamischen lautsprechers
DE202019003587U1 (de) Einpress-Kontakt
DE19749119C2 (de) Elektrisches Verbindungssystem
DE2206401A1 (de) Steckerleiste
DE7506594U (de) Kontaktkörper für elektrische Leiter
DE69807950T2 (de) Verbinder und Schaltungsanordnung für hohe Ströme
DE7304574U (de) Leiterplatte
AT365376B (de) Loetfreier elektrischer kontakt und verfahren zu seiner herstellung
DE1845841U (de) Isolierstoffplatte mit gedruckter schaltung.
DE2362143B2 (de) Drehschalter mit n schaltstellungen fuer den einbau in gedruckte schaltungen
DE2019884A1 (de) Plattenfoermige gedruckte Schaltung

Legal Events

Date Code Title Description
OHN Withdrawal