GB1426629A - Circuit board - Google Patents

Circuit board

Info

Publication number
GB1426629A
GB1426629A GB1684673A GB1684673A GB1426629A GB 1426629 A GB1426629 A GB 1426629A GB 1684673 A GB1684673 A GB 1684673A GB 1684673 A GB1684673 A GB 1684673A GB 1426629 A GB1426629 A GB 1426629A
Authority
GB
United Kingdom
Prior art keywords
sites
supporting frame
circuit board
metal
resilient
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1684673A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FINSTERHOELZL RAFI ELEKT
Rafi Raimund Finsterholzl Elektrotechnische Spezialfabrik
Original Assignee
FINSTERHOELZL RAFI ELEKT
Rafi Raimund Finsterholzl Elektrotechnische Spezialfabrik
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FINSTERHOELZL RAFI ELEKT, Rafi Raimund Finsterholzl Elektrotechnische Spezialfabrik filed Critical FINSTERHOELZL RAFI ELEKT
Publication of GB1426629A publication Critical patent/GB1426629A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10053—Switch

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
GB1684673A 1973-02-07 1973-04-09 Circuit board Expired GB1426629A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19732305883 DE2305883A1 (de) 1973-02-07 1973-02-07 Leiterplatte

Publications (1)

Publication Number Publication Date
GB1426629A true GB1426629A (en) 1976-03-03

Family

ID=5871175

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1684673A Expired GB1426629A (en) 1973-02-07 1973-04-09 Circuit board

Country Status (5)

Country Link
JP (1) JPS5018977A (enrdf_load_stackoverflow)
DE (1) DE2305883A1 (enrdf_load_stackoverflow)
FR (1) FR2216750B1 (enrdf_load_stackoverflow)
GB (1) GB1426629A (enrdf_load_stackoverflow)
NL (1) NL7303597A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4556628A (en) * 1983-05-19 1985-12-03 International Business Machines Corporation Process for producing printed circuit boards with metallic conductor structures embedded in the insulating substrate
GB2163906A (en) * 1984-07-28 1986-03-05 Junghans Gmbh Geb A circuit carrier assembly for an electromechanical clock
GB2243479B (en) * 1990-03-05 1994-09-14 Sankyo Seiki Seisakusho Kk Electronic sound generating device
US5407622A (en) * 1985-02-22 1995-04-18 Smith Corona Corporation Process for making metallized plastic articles
EP0836113A3 (en) * 1996-10-14 2000-08-02 Konica Corporation Lens-fitted film unit with electronic flash

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2361007A1 (fr) * 1976-08-06 1978-03-03 Sev Marchal Procede de fabrication d'un circuit electrique notamment pour un pont redresseur d'alternateur de vehicule automobile
JPS5479081U (enrdf_load_stackoverflow) * 1977-11-15 1979-06-05
JPS55111015A (en) * 1979-02-20 1980-08-27 Sanyo Electric Co Feeder for electric equipment and method of manufacturing same
JPS59147448A (ja) * 1983-02-12 1984-08-23 Fujitsu Ltd 半導体素子搭載用リ−ドフレ−ムおよびこれを用いて製造される半導体装置とその製造方法
FR2574222B1 (fr) * 1984-12-04 1987-05-29 Sintra Procede de fabrication d'un substrat pour circuit hybride comportant des connexions faiblement resistives
GB2171355B (en) * 1985-02-22 1989-11-22 Kollmorgen Tech Corp Molded articles suitable for adherent metallization, molded metallized articles and processes for making the same
FR2584862B1 (fr) * 1985-07-12 1988-05-20 Eurotechnique Sa Procede de fabrication en continu de micromodules pour cartes contenant des composants, bande continue de micromodules et micromodules realises selon un tel procede
US4659157A (en) * 1985-09-03 1987-04-21 Molex Incorporated Stamped circuitry assembly
FR2590051B1 (fr) * 1985-11-08 1991-05-17 Eurotechnique Sa Carte comportant un composant et micromodule a contacts de flanc
FR2590052B1 (fr) * 1985-11-08 1991-03-01 Eurotechnique Sa Procede de recyclage d'une carte comportant un composant, carte prevue pour etre recyclee
DE3641995C1 (de) * 1986-12-09 1988-05-19 Philips Patentverwaltung Verfahren zum Herstellen von gedruckten Schaltungen
DE3924176A1 (de) * 1988-07-26 1990-02-01 Steinmueller Kg Atlanta Kabel Verfahren zur herstellung einer leiterplatine
US5343616B1 (en) * 1992-02-14 1998-12-29 Rock Ltd Method of making high density self-aligning conductive networks and contact clusters
US5584120A (en) * 1992-02-14 1996-12-17 Research Organization For Circuit Knowledge Method of manufacturing printed circuits
DE4313006C2 (de) * 1993-04-21 1998-05-20 Duerrwaechter E Dr Doduco Elektrische Leiterbahn, insbesondere aus Bimetall
DE102009012088A1 (de) * 2009-03-06 2010-09-09 Hella Kgaa Hueck & Co. Zündgerät für eine Hochdruckgasentladungslampe

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3177103A (en) * 1961-09-18 1965-04-06 Sauders Associates Inc Two pass etching for fabricating printed circuitry

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4556628A (en) * 1983-05-19 1985-12-03 International Business Machines Corporation Process for producing printed circuit boards with metallic conductor structures embedded in the insulating substrate
GB2163906A (en) * 1984-07-28 1986-03-05 Junghans Gmbh Geb A circuit carrier assembly for an electromechanical clock
US5407622A (en) * 1985-02-22 1995-04-18 Smith Corona Corporation Process for making metallized plastic articles
GB2243479B (en) * 1990-03-05 1994-09-14 Sankyo Seiki Seisakusho Kk Electronic sound generating device
EP0836113A3 (en) * 1996-10-14 2000-08-02 Konica Corporation Lens-fitted film unit with electronic flash

Also Published As

Publication number Publication date
FR2216750B1 (enrdf_load_stackoverflow) 1979-06-22
FR2216750A1 (enrdf_load_stackoverflow) 1974-08-30
NL7303597A (enrdf_load_stackoverflow) 1974-08-09
JPS5018977A (enrdf_load_stackoverflow) 1975-02-27
DE2305883A1 (de) 1974-08-15

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee