JPS5018977A - - Google Patents

Info

Publication number
JPS5018977A
JPS5018977A JP3151273A JP3151273A JPS5018977A JP S5018977 A JPS5018977 A JP S5018977A JP 3151273 A JP3151273 A JP 3151273A JP 3151273 A JP3151273 A JP 3151273A JP S5018977 A JPS5018977 A JP S5018977A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3151273A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5018977A publication Critical patent/JPS5018977A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09118Moulded substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10053Switch

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)
JP3151273A 1973-02-07 1973-03-20 Pending JPS5018977A (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19732305883 DE2305883A1 (de) 1973-02-07 1973-02-07 Leiterplatte

Publications (1)

Publication Number Publication Date
JPS5018977A true JPS5018977A (enrdf_load_stackoverflow) 1975-02-27

Family

ID=5871175

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3151273A Pending JPS5018977A (enrdf_load_stackoverflow) 1973-02-07 1973-03-20

Country Status (5)

Country Link
JP (1) JPS5018977A (enrdf_load_stackoverflow)
DE (1) DE2305883A1 (enrdf_load_stackoverflow)
FR (1) FR2216750B1 (enrdf_load_stackoverflow)
GB (1) GB1426629A (enrdf_load_stackoverflow)
NL (1) NL7303597A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5479081U (enrdf_load_stackoverflow) * 1977-11-15 1979-06-05
JPS55111015A (en) * 1979-02-20 1980-08-27 Sanyo Electric Co Feeder for electric equipment and method of manufacturing same

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2361007A1 (fr) * 1976-08-06 1978-03-03 Sev Marchal Procede de fabrication d'un circuit electrique notamment pour un pont redresseur d'alternateur de vehicule automobile
JPS59147448A (ja) * 1983-02-12 1984-08-23 Fujitsu Ltd 半導体素子搭載用リ−ドフレ−ムおよびこれを用いて製造される半導体装置とその製造方法
DE3373256D1 (en) * 1983-05-19 1987-10-01 Ibm Deutschland Process for manufacturing printed circuits with metallic conductor patterns embedded in the isolating substrate
DE3427908C2 (de) * 1984-07-28 1986-10-02 Gebrüder Junghans GmbH, 7230 Schramberg Verfahren zum Herstellen des Schaltungsträgers eines elektromechanischen Uhrwerks und nach solchem Verfahren herstellbarer Schaltungsträger
FR2574222B1 (fr) * 1984-12-04 1987-05-29 Sintra Procede de fabrication d'un substrat pour circuit hybride comportant des connexions faiblement resistives
US5407622A (en) * 1985-02-22 1995-04-18 Smith Corona Corporation Process for making metallized plastic articles
GB2171355B (en) * 1985-02-22 1989-11-22 Kollmorgen Tech Corp Molded articles suitable for adherent metallization, molded metallized articles and processes for making the same
FR2584862B1 (fr) * 1985-07-12 1988-05-20 Eurotechnique Sa Procede de fabrication en continu de micromodules pour cartes contenant des composants, bande continue de micromodules et micromodules realises selon un tel procede
US4659157A (en) * 1985-09-03 1987-04-21 Molex Incorporated Stamped circuitry assembly
FR2590051B1 (fr) * 1985-11-08 1991-05-17 Eurotechnique Sa Carte comportant un composant et micromodule a contacts de flanc
FR2590052B1 (fr) * 1985-11-08 1991-03-01 Eurotechnique Sa Procede de recyclage d'une carte comportant un composant, carte prevue pour etre recyclee
DE3641995C1 (de) * 1986-12-09 1988-05-19 Philips Patentverwaltung Verfahren zum Herstellen von gedruckten Schaltungen
DE3924176A1 (de) * 1988-07-26 1990-02-01 Steinmueller Kg Atlanta Kabel Verfahren zur herstellung einer leiterplatine
KR0165544B1 (ko) * 1990-03-05 1999-03-20 야마다 로꾸이찌 전자발음장치
US5343616B1 (en) * 1992-02-14 1998-12-29 Rock Ltd Method of making high density self-aligning conductive networks and contact clusters
US5584120A (en) * 1992-02-14 1996-12-17 Research Organization For Circuit Knowledge Method of manufacturing printed circuits
DE4313006C2 (de) * 1993-04-21 1998-05-20 Duerrwaechter E Dr Doduco Elektrische Leiterbahn, insbesondere aus Bimetall
EP0836113A3 (en) * 1996-10-14 2000-08-02 Konica Corporation Lens-fitted film unit with electronic flash
DE102009012088A1 (de) * 2009-03-06 2010-09-09 Hella Kgaa Hueck & Co. Zündgerät für eine Hochdruckgasentladungslampe

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3177103A (en) * 1961-09-18 1965-04-06 Sauders Associates Inc Two pass etching for fabricating printed circuitry

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5479081U (enrdf_load_stackoverflow) * 1977-11-15 1979-06-05
JPS55111015A (en) * 1979-02-20 1980-08-27 Sanyo Electric Co Feeder for electric equipment and method of manufacturing same

Also Published As

Publication number Publication date
FR2216750B1 (enrdf_load_stackoverflow) 1979-06-22
FR2216750A1 (enrdf_load_stackoverflow) 1974-08-30
GB1426629A (en) 1976-03-03
NL7303597A (enrdf_load_stackoverflow) 1974-08-09
DE2305883A1 (de) 1974-08-15

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