DE2202533A1 - Leiteranordnung bei integrierten Schaltbauteilen - Google Patents

Leiteranordnung bei integrierten Schaltbauteilen

Info

Publication number
DE2202533A1
DE2202533A1 DE19722202533 DE2202533A DE2202533A1 DE 2202533 A1 DE2202533 A1 DE 2202533A1 DE 19722202533 DE19722202533 DE 19722202533 DE 2202533 A DE2202533 A DE 2202533A DE 2202533 A1 DE2202533 A1 DE 2202533A1
Authority
DE
Germany
Prior art keywords
conductor
carrier
thickness
conductor ends
arrangement according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19722202533
Other languages
German (de)
English (en)
Inventor
Dupuis Jean M
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Microsystems International Ltd
Original Assignee
Microsystems International Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CA109233A external-priority patent/CA928864A/en
Application filed by Microsystems International Ltd filed Critical Microsystems International Ltd
Publication of DE2202533A1 publication Critical patent/DE2202533A1/de
Pending legal-status Critical Current

Links

Classifications

    • H10W70/60—
    • H10W70/435—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/923—Physical dimension
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/107—Punching and bonding pressure application by punch
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12229—Intermediate article [e.g., blank, etc.]
    • Y10T428/12271—Intermediate article [e.g., blank, etc.] having discrete fastener, marginal fastening, taper, or end structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
DE19722202533 1971-03-31 1972-01-20 Leiteranordnung bei integrierten Schaltbauteilen Pending DE2202533A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CA109223 1971-03-31
CA109233A CA928864A (en) 1971-03-31 1971-03-31 Plastic support means for lead frame ends

Publications (1)

Publication Number Publication Date
DE2202533A1 true DE2202533A1 (de) 1972-10-05

Family

ID=25666764

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19722202533 Pending DE2202533A1 (de) 1971-03-31 1972-01-20 Leiteranordnung bei integrierten Schaltbauteilen

Country Status (5)

Country Link
US (1) US3711625A (enExample)
DE (1) DE2202533A1 (enExample)
FR (1) FR2131952A1 (enExample)
GB (1) GB1308269A (enExample)
NL (1) NL7203581A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0771519A4 (en) * 1994-07-19 1998-02-25 Olin Corp PACKING OF ELECTRONIC COMPONENTS WITH INTEGRATED CONTACT HOLES

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL159818B (nl) * 1972-04-06 1979-03-15 Philips Nv Halfgeleiderinrichting, bevattende een flexibele isolerende folie, die aan een zijde is voorzien van metalen geleider- sporen.
USRE31967E (en) * 1975-07-07 1985-08-13 National Semiconductor Corporation Gang bonding interconnect tape for semiconductive devices and method of making same
US4089733A (en) * 1975-09-12 1978-05-16 Amp Incorporated Method of forming complex shaped metal-plastic composite lead frames for IC packaging
USD257425S (en) 1977-12-08 1980-10-21 Ross Milton I Integrated circuit carrier
JPS5915385B2 (ja) * 1978-11-02 1984-04-09 住友金属鉱山株式会社 テ−プ貼着装置
US4408218A (en) * 1981-03-27 1983-10-04 Amp Incorporated Ceramic chip carrier with lead frame having removable rim
US4362902A (en) * 1981-03-27 1982-12-07 Amp Incorporated Ceramic chip carrier
JPS6038825A (ja) * 1983-08-11 1985-02-28 Sumitomo Metal Mining Co Ltd テ−プ貼着装置
US4650545A (en) * 1985-02-19 1987-03-17 Tektronix, Inc. Polyimide embedded conductor process
JPS61296749A (ja) * 1985-06-25 1986-12-27 Toray Silicone Co Ltd 半導体装置用リードフレームの製造方法
GB2178895B (en) * 1985-08-06 1988-11-23 Gen Electric Co Plc Improved preparation of fragile devices
GB2178894B (en) * 1985-08-06 1988-07-27 Gen Electric Co Plc Preparation of fragile devices
EP0344259A4 (en) * 1987-10-30 1991-04-24 Lsi Logic Corporation Method and means of fabricating a semiconductor device package
JPH02161740A (ja) * 1988-12-15 1990-06-21 Chisso Corp キャリヤーテープの製造方法
US4906314A (en) * 1988-12-30 1990-03-06 Micron Technology, Inc. Process for simultaneously applying precut swatches of precured polyimide film to each semiconductor die on a wafer
JP2676112B2 (ja) * 1989-05-01 1997-11-12 イビデン株式会社 電子部品搭載用基板の製造方法
FR2659495B1 (fr) * 1990-03-06 1997-01-24 Andre Schiltz Connecteur elastomerique pour circuits integres ou analogues, et son procede de fabrication.
JPH04120765A (ja) * 1990-09-12 1992-04-21 Seiko Epson Corp 半導体装置とその製造方法
US5177032A (en) * 1990-10-24 1993-01-05 Micron Technology, Inc. Method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape
KR940008327B1 (ko) * 1991-10-10 1994-09-12 삼성전자 주식회사 반도체 패키지 및 그 실장방법
US5661900A (en) * 1994-03-07 1997-09-02 Texas Instruments Incorporated Method of fabricating an ultrasonically welded plastic support ring
TW398163B (en) * 1996-10-09 2000-07-11 Matsushita Electric Industrial Co Ltd The plate for heat transfer substrate and manufacturing method thereof, the heat-transfer substrate using such plate and manufacturing method thereof
US8513814B2 (en) 2011-05-02 2013-08-20 International Business Machines Corporation Buffer pad in solder bump connections and methods of manufacture
US8546253B1 (en) 2012-03-09 2013-10-01 International Business Machines Corporation Self-aligned polymer passivation/aluminum pad
US9824958B2 (en) * 2013-03-05 2017-11-21 Infineon Technologies Austria Ag Chip carrier structure, chip package and method of manufacturing the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3544857A (en) * 1966-08-16 1970-12-01 Signetics Corp Integrated circuit assembly with lead structure and method
US3537175A (en) * 1966-11-09 1970-11-03 Advalloy Inc Lead frame for semiconductor devices and method for making same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0771519A4 (en) * 1994-07-19 1998-02-25 Olin Corp PACKING OF ELECTRONIC COMPONENTS WITH INTEGRATED CONTACT HOLES

Also Published As

Publication number Publication date
FR2131952A1 (enExample) 1972-11-17
GB1308269A (en) 1973-02-21
US3711625A (en) 1973-01-16
NL7203581A (enExample) 1972-10-03

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