NL7203581A - - Google Patents

Info

Publication number
NL7203581A
NL7203581A NL7203581A NL7203581A NL7203581A NL 7203581 A NL7203581 A NL 7203581A NL 7203581 A NL7203581 A NL 7203581A NL 7203581 A NL7203581 A NL 7203581A NL 7203581 A NL7203581 A NL 7203581A
Authority
NL
Netherlands
Application number
NL7203581A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CA109233A external-priority patent/CA928864A/en
Application filed filed Critical
Publication of NL7203581A publication Critical patent/NL7203581A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49558—Insulating layers on lead frames, e.g. bridging members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/923—Physical dimension
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/107—Punching and bonding pressure application by punch
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12229—Intermediate article [e.g., blank, etc.]
    • Y10T428/12271—Intermediate article [e.g., blank, etc.] having discrete fastener, marginal fastening, taper, or end structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
NL7203581A 1971-03-31 1972-03-17 NL7203581A (xx)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CA109233A CA928864A (en) 1971-03-31 1971-03-31 Plastic support means for lead frame ends
CA109223 1971-03-31

Publications (1)

Publication Number Publication Date
NL7203581A true NL7203581A (xx) 1972-10-03

Family

ID=25666764

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7203581A NL7203581A (xx) 1971-03-31 1972-03-17

Country Status (5)

Country Link
US (1) US3711625A (xx)
DE (1) DE2202533A1 (xx)
FR (1) FR2131952A1 (xx)
GB (1) GB1308269A (xx)
NL (1) NL7203581A (xx)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL159818B (nl) * 1972-04-06 1979-03-15 Philips Nv Halfgeleiderinrichting, bevattende een flexibele isolerende folie, die aan een zijde is voorzien van metalen geleider- sporen.
USRE31967E (en) * 1975-07-07 1985-08-13 National Semiconductor Corporation Gang bonding interconnect tape for semiconductive devices and method of making same
US4089733A (en) * 1975-09-12 1978-05-16 Amp Incorporated Method of forming complex shaped metal-plastic composite lead frames for IC packaging
JPS5915385B2 (ja) * 1978-11-02 1984-04-09 住友金属鉱山株式会社 テ−プ貼着装置
US4362902A (en) * 1981-03-27 1982-12-07 Amp Incorporated Ceramic chip carrier
US4408218A (en) * 1981-03-27 1983-10-04 Amp Incorporated Ceramic chip carrier with lead frame having removable rim
JPS6038825A (ja) * 1983-08-11 1985-02-28 Sumitomo Metal Mining Co Ltd テ−プ貼着装置
US4650545A (en) * 1985-02-19 1987-03-17 Tektronix, Inc. Polyimide embedded conductor process
JPS61296749A (ja) * 1985-06-25 1986-12-27 Toray Silicone Co Ltd 半導体装置用リードフレームの製造方法
GB2178895B (en) * 1985-08-06 1988-11-23 Gen Electric Co Plc Improved preparation of fragile devices
GB2178894B (en) * 1985-08-06 1988-07-27 Gen Electric Co Plc Preparation of fragile devices
EP0344259A4 (en) * 1987-10-30 1991-04-24 Lsi Logic Corporation Method and means of fabricating a semiconductor device package
JPH02161740A (ja) * 1988-12-15 1990-06-21 Chisso Corp キャリヤーテープの製造方法
US4906314A (en) * 1988-12-30 1990-03-06 Micron Technology, Inc. Process for simultaneously applying precut swatches of precured polyimide film to each semiconductor die on a wafer
JP2676112B2 (ja) * 1989-05-01 1997-11-12 イビデン株式会社 電子部品搭載用基板の製造方法
FR2659495B1 (fr) * 1990-03-06 1997-01-24 Andre Schiltz Connecteur elastomerique pour circuits integres ou analogues, et son procede de fabrication.
JPH04120765A (ja) * 1990-09-12 1992-04-21 Seiko Epson Corp 半導体装置とその製造方法
US5177032A (en) * 1990-10-24 1993-01-05 Micron Technology, Inc. Method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape
KR940008327B1 (ko) * 1991-10-10 1994-09-12 삼성전자 주식회사 반도체 패키지 및 그 실장방법
US5661900A (en) * 1994-03-07 1997-09-02 Texas Instruments Incorporated Method of fabricating an ultrasonically welded plastic support ring
US5629835A (en) * 1994-07-19 1997-05-13 Olin Corporation Metal ball grid array package with improved thermal conductivity
TW398163B (en) * 1996-10-09 2000-07-11 Matsushita Electric Ind Co Ltd The plate for heat transfer substrate and manufacturing method thereof, the heat-transfer substrate using such plate and manufacturing method thereof
US8513814B2 (en) 2011-05-02 2013-08-20 International Business Machines Corporation Buffer pad in solder bump connections and methods of manufacture
US8546253B1 (en) 2012-03-09 2013-10-01 International Business Machines Corporation Self-aligned polymer passivation/aluminum pad
US9824958B2 (en) * 2013-03-05 2017-11-21 Infineon Technologies Austria Ag Chip carrier structure, chip package and method of manufacturing the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3544857A (en) * 1966-08-16 1970-12-01 Signetics Corp Integrated circuit assembly with lead structure and method
US3537175A (en) * 1966-11-09 1970-11-03 Advalloy Inc Lead frame for semiconductor devices and method for making same

Also Published As

Publication number Publication date
DE2202533A1 (de) 1972-10-05
GB1308269A (en) 1973-02-21
US3711625A (en) 1973-01-16
FR2131952A1 (xx) 1972-11-17

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