DE2057757C3 - Badlösung zum stromlosen Abscheiden von Metallen - Google Patents

Badlösung zum stromlosen Abscheiden von Metallen

Info

Publication number
DE2057757C3
DE2057757C3 DE19702057757 DE2057757A DE2057757C3 DE 2057757 C3 DE2057757 C3 DE 2057757C3 DE 19702057757 DE19702057757 DE 19702057757 DE 2057757 A DE2057757 A DE 2057757A DE 2057757 C3 DE2057757 C3 DE 2057757C3
Authority
DE
Germany
Prior art keywords
acid
bath
mol
metal
bath solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE19702057757
Other languages
German (de)
English (en)
Other versions
DE2057757B2 (de
DE2057757A1 (de
Inventor
M Paunovic
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of DE2057757A1 publication Critical patent/DE2057757A1/de
Publication of DE2057757B2 publication Critical patent/DE2057757B2/de
Application granted granted Critical
Publication of DE2057757C3 publication Critical patent/DE2057757C3/de
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/42Coating with noble metals
    • C23C18/44Coating with noble metals using reducing agents
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
DE19702057757 1969-11-20 1970-11-17 Badlösung zum stromlosen Abscheiden von Metallen Expired DE2057757C3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US87856569A 1969-11-20 1969-11-20

Publications (3)

Publication Number Publication Date
DE2057757A1 DE2057757A1 (de) 1971-06-24
DE2057757B2 DE2057757B2 (de) 1973-10-11
DE2057757C3 true DE2057757C3 (de) 1974-05-16

Family

ID=25372291

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19702057757 Expired DE2057757C3 (de) 1969-11-20 1970-11-17 Badlösung zum stromlosen Abscheiden von Metallen

Country Status (10)

Country Link
JP (1) JPS503742B1 (en, 2012)
AT (1) AT304219B (en, 2012)
CA (1) CA925252A (en, 2012)
CH (1) CH564093A5 (en, 2012)
DE (1) DE2057757C3 (en, 2012)
DK (1) DK138185B (en, 2012)
FR (1) FR2069551A5 (en, 2012)
GB (1) GB1305468A (en, 2012)
NL (1) NL164905C (en, 2012)
SE (1) SE375334B (en, 2012)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5427848A (en) * 1977-07-29 1979-03-02 Kenji Sawayama Hanger for overcoat and undercoat
DE3148280A1 (de) * 1981-12-05 1983-06-09 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung
GB8703664D0 (en) * 1987-02-17 1987-03-25 Green A Electroless silver plating composition
DE4021681A1 (de) * 1989-07-12 1991-03-14 Kojima Chemicals Co Ltd Nichtelektrolytische goldplattierloesung
AU4929993A (en) * 1992-09-28 1994-04-26 Ducoa L.P. Photoresist stripping process using n,n-dimethyl-bis(2-hydroxyethyl) quaternary ammonium hydroxide
US20160273112A1 (en) * 2013-03-27 2016-09-22 Atotech Deutschland Gmbh Electroless copper plating solution
CN115787003B (zh) * 2022-12-10 2025-01-28 漳州市东龙电子科技有限公司 一种三价铬电镀液

Also Published As

Publication number Publication date
CH564093A5 (en, 2012) 1975-07-15
DK138185C (en, 2012) 1979-01-02
AT304219B (de) 1972-12-27
NL164905C (nl) 1981-02-16
DE2057757B2 (de) 1973-10-11
FR2069551A5 (en, 2012) 1971-09-03
GB1305468A (en, 2012) 1973-01-31
NL164905B (nl) 1980-09-15
DK138185B (da) 1978-07-24
JPS503742B1 (en, 2012) 1975-02-08
CA925252A (en) 1973-05-01
NL7016919A (en, 2012) 1971-05-24
DE2057757A1 (de) 1971-06-24
SE375334B (en, 2012) 1975-04-14

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
E77 Valid patent as to the heymanns-index 1977
8339 Ceased/non-payment of the annual fee