DE19960506A1 - Vernetzende Monomere für ein Photoresist und Verfahren zur Herstellung von Photoresist-Polymeren unter Verwendung derselben - Google Patents
Vernetzende Monomere für ein Photoresist und Verfahren zur Herstellung von Photoresist-Polymeren unter Verwendung derselbenInfo
- Publication number
- DE19960506A1 DE19960506A1 DE19960506A DE19960506A DE19960506A1 DE 19960506 A1 DE19960506 A1 DE 19960506A1 DE 19960506 A DE19960506 A DE 19960506A DE 19960506 A DE19960506 A DE 19960506A DE 19960506 A1 DE19960506 A1 DE 19960506A1
- Authority
- DE
- Germany
- Prior art keywords
- branched
- straight
- photoresist
- hydroxyl group
- chemical formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 75
- 239000000178 monomer Substances 0.000 title claims abstract description 32
- 238000004132 cross linking Methods 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims description 15
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 39
- 239000000126 substance Substances 0.000 claims abstract description 33
- 150000002576 ketones Chemical class 0.000 claims abstract description 20
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 claims abstract description 18
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 claims abstract description 18
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims abstract description 16
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 14
- 150000002148 esters Chemical class 0.000 claims abstract description 14
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 11
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims description 20
- 238000006116 polymerization reaction Methods 0.000 claims description 20
- 229920000642 polymer Polymers 0.000 claims description 19
- -1 alicyclic olefin Chemical class 0.000 claims description 16
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2,2'-azo-bis-isobutyronitrile Substances N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 claims description 8
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 8
- PHSXOZKMZYKHLY-UHFFFAOYSA-N 2-hydroxyethyl bicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OCCO)CC1C=C2 PHSXOZKMZYKHLY-UHFFFAOYSA-N 0.000 claims description 7
- FYGUSUBEMUKACF-UHFFFAOYSA-N bicyclo[2.2.1]hept-2-ene-5-carboxylic acid Chemical compound C1C2C(C(=O)O)CC1C=C2 FYGUSUBEMUKACF-UHFFFAOYSA-N 0.000 claims description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 6
- FQMIAEWUVYWVNB-UHFFFAOYSA-N 3-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OC(C)CCOC(=O)C=C FQMIAEWUVYWVNB-UHFFFAOYSA-N 0.000 claims description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 6
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 claims description 5
- 235000010290 biphenyl Nutrition 0.000 claims description 5
- 239000004305 biphenyl Substances 0.000 claims description 5
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 5
- 239000003960 organic solvent Substances 0.000 claims description 5
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 5
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 4
- ZQMIGQNCOMNODD-UHFFFAOYSA-N diacetyl peroxide Chemical compound CC(=O)OOC(C)=O ZQMIGQNCOMNODD-UHFFFAOYSA-N 0.000 claims description 4
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 4
- 239000003505 polymerization initiator Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- BZBMBZJUNPMEBD-UHFFFAOYSA-N tert-butyl bicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OC(C)(C)C)CC1C=C2 BZBMBZJUNPMEBD-UHFFFAOYSA-N 0.000 claims description 4
- OZAIFHULBGXAKX-VAWYXSNFSA-N AIBN Substances N#CC(C)(C)\N=N\C(C)(C)C#N OZAIFHULBGXAKX-VAWYXSNFSA-N 0.000 claims description 3
- 239000012300 argon atmosphere Substances 0.000 claims description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 3
- ITMCEJHCFYSIIV-UHFFFAOYSA-M triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-M 0.000 claims description 3
- FAYMLNNRGCYLSR-UHFFFAOYSA-M triphenylsulfonium triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 FAYMLNNRGCYLSR-UHFFFAOYSA-M 0.000 claims description 3
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 claims description 2
- LGJCFVYMIJLQJO-UHFFFAOYSA-N 1-dodecylperoxydodecane Chemical compound CCCCCCCCCCCCOOCCCCCCCCCCCC LGJCFVYMIJLQJO-UHFFFAOYSA-N 0.000 claims description 2
- VUBUXALTYMBEQO-UHFFFAOYSA-N 2,2,3,3,3-pentafluoro-1-phenylpropan-1-one Chemical compound FC(F)(F)C(F)(F)C(=O)C1=CC=CC=C1 VUBUXALTYMBEQO-UHFFFAOYSA-N 0.000 claims description 2
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 claims description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 2
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 claims description 2
- 239000012953 triphenylsulfonium Substances 0.000 claims description 2
- CYJIAJHBQYSDNE-UHFFFAOYSA-N [4-(2-methylpropyl)-2,3-diphenylphenyl] trifluoromethanesulfonate Chemical compound C=1C=CC=CC=1C=1C(CC(C)C)=CC=C(OS(=O)(=O)C(F)(F)F)C=1C1=CC=CC=C1 CYJIAJHBQYSDNE-UHFFFAOYSA-N 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 claims 1
- 239000000047 product Substances 0.000 claims 1
- 230000003252 repetitive effect Effects 0.000 claims 1
- 239000002253 acid Substances 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- 239000004971 Cross linker Substances 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 2
- WJYYHJOAZPZSQG-UHFFFAOYSA-N (4-methoxy-2,3-diphenylphenyl) trifluoromethanesulfonate Chemical compound C=1C=CC=CC=1C=1C(OC)=CC=C(OS(=O)(=O)C(F)(F)F)C=1C1=CC=CC=C1 WJYYHJOAZPZSQG-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 101100346656 Drosophila melanogaster strat gene Proteins 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 229960003328 benzoyl peroxide Drugs 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- 210000001217 buttock Anatomy 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/52—Esters of acyclic unsaturated carboxylic acids having the esterified carboxyl group bound to an acyclic carbon atom
- C07C69/533—Monocarboxylic acid esters having only one carbon-to-carbon double bond
- C07C69/54—Acrylic acid esters; Methacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F22/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
- C08F22/10—Esters
- C08F22/1006—Esters of polyhydric alcohols or polyhydric phenols, e.g. ethylene glycol dimethacrylate
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-1998-0063793A KR100362937B1 (ko) | 1998-12-31 | 1998-12-31 | 신규의포토레지스트가교제,이를포함하는포토레지스트중합체및포토레지스트조성물 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE19960506A1 true DE19960506A1 (de) | 2000-09-07 |
Family
ID=19570347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19960506A Withdrawn DE19960506A1 (de) | 1998-12-31 | 1999-12-15 | Vernetzende Monomere für ein Photoresist und Verfahren zur Herstellung von Photoresist-Polymeren unter Verwendung derselben |
Country Status (9)
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7208260B2 (en) * | 1998-12-31 | 2007-04-24 | Hynix Semiconductor Inc. | Cross-linking monomers for photoresist, and process for preparing photoresist polymers using the same |
| KR100557608B1 (ko) * | 1999-02-10 | 2006-03-10 | 주식회사 하이닉스반도체 | 신규의 포토레지스트 가교제 및 이를 이용한 포토레지스트 조성물 |
| KR100557609B1 (ko) * | 1999-02-22 | 2006-03-10 | 주식회사 하이닉스반도체 | 신규의 포토레지스트 가교제 및 이를 이용한 포토레지스트 조성물 |
| KR100647379B1 (ko) | 1999-07-30 | 2006-11-17 | 주식회사 하이닉스반도체 | 신규의 포토레지스트용 단량체, 그의 공중합체 및 이를 이용한포토레지스트 조성물 |
| US6818376B2 (en) | 1999-08-23 | 2004-11-16 | Hynix Semiconductor Inc. | Cross-linker monomer comprising double bond and photoresist copolymer containing the same |
| KR100520183B1 (ko) * | 1999-08-23 | 2005-10-10 | 주식회사 하이닉스반도체 | 두 개의 이중결합을 가지는 가교제를 단량체로 포함하는 포토레지스트용 공중합체 |
| KR100546110B1 (ko) * | 2000-01-21 | 2006-01-24 | 주식회사 하이닉스반도체 | 포토레지스트 가교제 및 이를 함유하는 포토레지스트 조성물 |
| US6664022B1 (en) * | 2000-08-25 | 2003-12-16 | Shipley Company, L.L.C. | Photoacid generators and photoresists comprising same |
| KR20020082006A (ko) * | 2001-04-23 | 2002-10-30 | 금호석유화학 주식회사 | 신규한 산-민감성 중합체 및 이를 함유하는 레지스트 조성물 |
| US7138218B2 (en) | 2001-12-18 | 2006-11-21 | Hynix Semiconductor Inc. | Process for forming an ultra fine pattern using a bottom anti-reflective coating film containing an acid generator |
| US7338742B2 (en) | 2003-10-08 | 2008-03-04 | Hynix Semiconductor Inc. | Photoresist polymer and photoresist composition containing the same |
| US7270937B2 (en) | 2003-10-17 | 2007-09-18 | Hynix Semiconductor Inc. | Over-coating composition for photoresist and process for forming photoresist pattern using the same |
| KR100680405B1 (ko) | 2003-11-19 | 2007-02-08 | 주식회사 하이닉스반도체 | Ｅｕｖ용 포토레지스트 조성물 및 이를 이용한포토레지스트 패턴 형성 방법 |
| JP4979477B2 (ja) * | 2004-03-08 | 2012-07-18 | 三菱レイヨン株式会社 | レジスト用重合体、レジスト組成物、およびパターン製造方法、並びにレジスト用重合体用原料化合物 |
| US20070031758A1 (en) * | 2005-08-03 | 2007-02-08 | Jsr Corporation | Positive-type radiation-sensitive resin composition for producing a metal-plating formed material, transcription film and production method of a metal-plating formed material |
| US7745339B2 (en) | 2006-02-24 | 2010-06-29 | Hynix Semiconductor Inc. | Method for forming fine pattern of semiconductor device |
| KR100694412B1 (ko) | 2006-02-24 | 2007-03-12 | 주식회사 하이닉스반도체 | 반도체소자의 미세패턴 형성방법 |
| JP5233985B2 (ja) * | 2007-02-26 | 2013-07-10 | Ｊｓｒ株式会社 | 微細パターン形成用樹脂組成物及び微細パターン形成方法 |
| JP6983766B2 (ja) * | 2015-09-28 | 2021-12-17 | スリーエム イノベイティブ プロパティズ カンパニー | 開裂可能な架橋剤を含むパターン化されたフィルム物品及び方法 |
| CN116102938B (zh) * | 2021-11-09 | 2023-10-20 | 上海新阳半导体材料股份有限公司 | 一种深紫外光刻用底部抗反射涂层及其制备方法和应用 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1275471A (en) * | 1969-06-04 | 1972-05-24 | Du Pont | Improvements relating to photo-resists |
| GB1277674A (en) * | 1969-08-04 | 1972-06-14 | Ford Motor Co | Painting of polyolefins |
| JPS5713444A (en) * | 1980-06-27 | 1982-01-23 | Tamura Kaken Kk | Photosensitive composition |
| US4329419A (en) * | 1980-09-03 | 1982-05-11 | E. I. Du Pont De Nemours And Company | Polymeric heat resistant photopolymerizable composition for semiconductors and capacitors |
| WO1992007022A1 (en) * | 1990-10-23 | 1992-04-30 | Atomic Energy Of Canada Limited | Process for the preparation of cellulosic fibre-reinforced thermoplastic composite materials |
| US5777068A (en) * | 1994-09-13 | 1998-07-07 | Nippon Zeon Co., Ltd. | Photosensitive polyimide resin composition |
-
1998
- 1998-12-31 KR KR10-1998-0063793A patent/KR100362937B1/ko not_active Expired - Fee Related
-
1999
- 1999-12-10 TW TW088121653A patent/TWI222968B/zh not_active IP Right Cessation
- 1999-12-15 GB GB9929650A patent/GB2345286B/en not_active Expired - Fee Related
- 1999-12-15 DE DE19960506A patent/DE19960506A1/de not_active Withdrawn
- 1999-12-21 IT IT1999TO001137A patent/IT1308679B1/it active
- 1999-12-22 JP JP36514699A patent/JP4001445B2/ja not_active Expired - Fee Related
- 1999-12-22 NL NL1013916A patent/NL1013916C2/nl not_active IP Right Cessation
- 1999-12-24 CN CNB991266870A patent/CN1303114C/zh not_active Expired - Lifetime
- 1999-12-29 FR FR9916643A patent/FR2788062B1/fr not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR100362937B1 (ko) | 2003-10-04 |
| FR2788062A1 (fr) | 2000-07-07 |
| JP4001445B2 (ja) | 2007-10-31 |
| FR2788062B1 (fr) | 2004-09-10 |
| KR20000047041A (ko) | 2000-07-25 |
| NL1013916A1 (nl) | 2000-07-03 |
| CN1303114C (zh) | 2007-03-07 |
| NL1013916C2 (nl) | 2002-12-03 |
| JP2000199951A (ja) | 2000-07-18 |
| GB2345286A (en) | 2000-07-05 |
| IT1308679B1 (it) | 2002-01-09 |
| GB9929650D0 (en) | 2000-02-09 |
| ITTO991137A1 (it) | 2001-06-21 |
| CN1258670A (zh) | 2000-07-05 |
| TWI222968B (en) | 2004-11-01 |
| ITTO991137A0 (it) | 1999-12-21 |
| GB2345286B (en) | 2004-06-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE19960506A1 (de) | Vernetzende Monomere für ein Photoresist und Verfahren zur Herstellung von Photoresist-Polymeren unter Verwendung derselben | |
| DE4409220C2 (de) | Musterbildungsmaterial und Musterbildungsverfahren | |
| DE69929879T2 (de) | Herstellung von acetal-derivatisierten hydroxylaromatischen polymeren und ihre verwendung in strahlungsempfindlichen formulierungen | |
| EP0447868B1 (de) | Strahlungsempfindliches Gemisch | |
| DE19956531A1 (de) | Vernetzer für ein Photoresist und diesen enthaltende Photoresistzusammensetzung | |
| EP0342498B1 (de) | Positiv und negativ arbeitende strahlungsempfindliche Gemische sowie Verfahren zur Herstellung von Reliefmustern | |
| DE69726542T2 (de) | Chemisch verstärkte Resistzusammensetzung | |
| DE19637425B4 (de) | Neue N-Vinyllactam-Derivate und deren Polymere | |
| DE69618752T2 (de) | Resistzusammensetzung mit strahlungsempfindlichem Säuergenerator | |
| DE69926963T2 (de) | Chemisch verstärkte Positivphotoresistzusammensetzungen | |
| DE3721741A1 (de) | Strahlungsempfindliches gemisch fuer lichtempfindliche beschichtungsmaterialien | |
| DE19721694B4 (de) | N-Vinyllactamderivate enthaltende Copolymere, Herstellungsverfahren hierfür und hieraus hergestellte Photoresists | |
| DE19860654A1 (de) | Copolymerharz, seine Herstellung und ein Photoresist, welches dieses verwendet | |
| DE69927104T2 (de) | Polymer für lichtempfindichen Resist und dieses Polymer enthaltende Resistzusammensetzung | |
| DE10040963A1 (de) | Vernetzermonomer, umfassend eine Doppelbindung, und ein dieses enthaltendes Photoresist-Copolymer | |
| DE19758244A1 (de) | Verfahren und Vorrichtung unter Verwendung eines ArF-Photoresistlacks | |
| DE19919794A1 (de) | Polymer und dessen Verwendung in einem Verfahren zur Bildung eines Mikromusters | |
| DE19860767A1 (de) | Halbleitervorrichtung unter Verwendung eines polymerhaltigen Photoresists und Verfahren zu dessen Herstellung | |
| DE19753276A1 (de) | Amid- oder Imid- enthaltendes Copolymer, Herstellungsverfahren für das Copolymer und dieses Copolymer enthaltendes Photoresist | |
| DE19725348A1 (de) | Photosensitive Polymerverbindung und diese enthaltende Photoresistzusammensetzung | |
| DE112004000021T5 (de) | Positiv-Photoresist-Zusammensetzung vom chemisch verstärkten Typ und Methode zur Bildung eines Resistmusters | |
| EP0553737B1 (de) | Strahlungsempfindliches Gemisch | |
| DE19907700B4 (de) | Polymermaterial für ein Photoresist, dieses enthaltende Photoresistzusammensetzung und Herstellungsverfahren hierfür | |
| DE69123873T2 (de) | Photoresistzusammensetzung | |
| DE19940515A1 (de) | Neue Monomere für Photoresiste, deren Polymere und Photoresist-Zusammensetzungen, die diese verwenden |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8110 | Request for examination paragraph 44 | ||
| R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee | ||
| R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |
Effective date: 20140701 |