NL1013916C2 - Verknopende monomeren voor een fotobeschermlaag en werkwijze voor het bereiden van fotobeschermlaag-polymeren waarbij deze gebruikt worden. - Google Patents
Verknopende monomeren voor een fotobeschermlaag en werkwijze voor het bereiden van fotobeschermlaag-polymeren waarbij deze gebruikt worden. Download PDFInfo
- Publication number
- NL1013916C2 NL1013916C2 NL1013916A NL1013916A NL1013916C2 NL 1013916 C2 NL1013916 C2 NL 1013916C2 NL 1013916 A NL1013916 A NL 1013916A NL 1013916 A NL1013916 A NL 1013916A NL 1013916 C2 NL1013916 C2 NL 1013916C2
- Authority
- NL
- Netherlands
- Prior art keywords
- straight
- branched chain
- hydroxyl group
- photo
- branched
- Prior art date
Links
- 230000003711 photoprotective effect Effects 0.000 title claims description 68
- 229920000642 polymer Polymers 0.000 title claims description 45
- 239000000178 monomer Substances 0.000 title claims description 33
- 238000004132 cross linking Methods 0.000 title claims description 30
- 238000000034 method Methods 0.000 title claims description 26
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 41
- 239000011241 protective layer Substances 0.000 claims description 36
- 239000010410 layer Substances 0.000 claims description 33
- 239000000126 substance Substances 0.000 claims description 32
- 238000006116 polymerization reaction Methods 0.000 claims description 24
- -1 alicyclic olefin Chemical class 0.000 claims description 19
- 239000000203 mixture Substances 0.000 claims description 17
- 125000000217 alkyl group Chemical group 0.000 claims description 13
- 229920001577 copolymer Polymers 0.000 claims description 13
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 12
- 150000002148 esters Chemical class 0.000 claims description 12
- 239000002253 acid Substances 0.000 claims description 11
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 claims description 10
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 claims description 10
- 235000010290 biphenyl Nutrition 0.000 claims description 10
- 239000004305 biphenyl Substances 0.000 claims description 10
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 10
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 claims description 9
- 150000002576 ketones Chemical class 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 8
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical group O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 8
- 229920002120 photoresistant polymer Polymers 0.000 claims description 8
- FYGUSUBEMUKACF-UHFFFAOYSA-N bicyclo[2.2.1]hept-2-ene-5-carboxylic acid Chemical compound C1C2C(C(=O)O)CC1C=C2 FYGUSUBEMUKACF-UHFFFAOYSA-N 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 6
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 6
- 239000003960 organic solvent Substances 0.000 claims description 6
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 5
- 239000003505 polymerization initiator Substances 0.000 claims description 5
- BZBMBZJUNPMEBD-UHFFFAOYSA-N tert-butyl bicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OC(C)(C)C)CC1C=C2 BZBMBZJUNPMEBD-UHFFFAOYSA-N 0.000 claims description 5
- PHSXOZKMZYKHLY-UHFFFAOYSA-N 2-hydroxyethyl bicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OCCO)CC1C=C2 PHSXOZKMZYKHLY-UHFFFAOYSA-N 0.000 claims description 4
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 claims description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 4
- ZQMIGQNCOMNODD-UHFFFAOYSA-N diacetyl peroxide Chemical compound CC(=O)OOC(C)=O ZQMIGQNCOMNODD-UHFFFAOYSA-N 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- OZAIFHULBGXAKX-VAWYXSNFSA-N AIBN Substances N#CC(C)(C)\N=N\C(C)(C)C#N OZAIFHULBGXAKX-VAWYXSNFSA-N 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 3
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 3
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 claims description 2
- LGJCFVYMIJLQJO-UHFFFAOYSA-N 1-dodecylperoxydodecane Chemical compound CCCCCCCCCCCCOOCCCCCCCCCCCC LGJCFVYMIJLQJO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052786 argon Inorganic materials 0.000 claims description 2
- 239000012298 atmosphere Substances 0.000 claims description 2
- 125000006267 biphenyl group Chemical group 0.000 claims description 2
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 claims description 2
- 238000010894 electron beam technology Methods 0.000 claims description 2
- 150000002431 hydrogen Chemical class 0.000 claims description 2
- 239000002685 polymerization catalyst Substances 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims description 2
- FAYMLNNRGCYLSR-UHFFFAOYSA-M triphenylsulfonium triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 FAYMLNNRGCYLSR-UHFFFAOYSA-M 0.000 claims description 2
- 125000002723 alicyclic group Chemical group 0.000 claims 2
- ITMCEJHCFYSIIV-UHFFFAOYSA-M triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-M 0.000 claims 2
- CPNBXOGOMSMGCF-UHFFFAOYSA-N (4-tert-butyl-2,3-diphenylphenyl) trifluoromethanesulfonate Chemical compound C=1C=CC=CC=1C=1C(C(C)(C)C)=CC=C(OS(=O)(=O)C(F)(F)F)C=1C1=CC=CC=C1 CPNBXOGOMSMGCF-UHFFFAOYSA-N 0.000 claims 1
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 claims 1
- 239000007864 aqueous solution Substances 0.000 claims 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 claims 1
- BJAARRARQJZURR-UHFFFAOYSA-N trimethylazanium;hydroxide Chemical compound O.CN(C)C BJAARRARQJZURR-UHFFFAOYSA-N 0.000 claims 1
- 238000002360 preparation method Methods 0.000 description 7
- FQMIAEWUVYWVNB-UHFFFAOYSA-N 3-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OC(C)CCOC(=O)C=C FQMIAEWUVYWVNB-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 2
- 125000006290 2-hydroxybenzyl group Chemical group [H]OC1=C(C([H])=C([H])C([H])=C1[H])C([H])([H])* 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- QGHDLJAZIIFENW-UHFFFAOYSA-N 4-[1,1,1,3,3,3-hexafluoro-2-(4-hydroxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenol Chemical group C1=C(CC=C)C(O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(O)C(CC=C)=C1 QGHDLJAZIIFENW-UHFFFAOYSA-N 0.000 description 1
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 1
- DJHGAFSJWGLOIV-UHFFFAOYSA-K Arsenate3- Chemical compound [O-][As]([O-])([O-])=O DJHGAFSJWGLOIV-UHFFFAOYSA-K 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- CYJIAJHBQYSDNE-UHFFFAOYSA-N [4-(2-methylpropyl)-2,3-diphenylphenyl] trifluoromethanesulfonate Chemical compound C=1C=CC=CC=1C=1C(CC(C)C)=CC=C(OS(=O)(=O)C(F)(F)F)C=1C1=CC=CC=C1 CYJIAJHBQYSDNE-UHFFFAOYSA-N 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 229940000489 arsenate Drugs 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000004224 protection Effects 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- VJIAQJAACYACCX-UHFFFAOYSA-M sulfanium trifluoromethanesulfonate triphenylsulfanium Chemical compound FC(S(=O)(=O)[O-])(F)F.[SH3+].C1(=CC=CC=C1)[S+](C1=CC=CC=C1)C1=CC=CC=C1.FC(S(=O)(=O)[O-])(F)F VJIAQJAACYACCX-UHFFFAOYSA-M 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 239000012953 triphenylsulfonium Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/52—Esters of acyclic unsaturated carboxylic acids having the esterified carboxyl group bound to an acyclic carbon atom
- C07C69/533—Monocarboxylic acid esters having only one carbon-to-carbon double bond
- C07C69/54—Acrylic acid esters; Methacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F22/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
- C08F22/10—Esters
- C08F22/1006—Esters of polyhydric alcohols or polyhydric phenols, e.g. ethylene glycol dimethacrylate
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR19980063793 | 1998-12-31 | ||
| KR10-1998-0063793A KR100362937B1 (ko) | 1998-12-31 | 1998-12-31 | 신규의포토레지스트가교제,이를포함하는포토레지스트중합체및포토레지스트조성물 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| NL1013916A1 NL1013916A1 (nl) | 2000-07-03 |
| NL1013916C2 true NL1013916C2 (nl) | 2002-12-03 |
Family
ID=19570347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL1013916A NL1013916C2 (nl) | 1998-12-31 | 1999-12-22 | Verknopende monomeren voor een fotobeschermlaag en werkwijze voor het bereiden van fotobeschermlaag-polymeren waarbij deze gebruikt worden. |
Country Status (9)
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7208260B2 (en) * | 1998-12-31 | 2007-04-24 | Hynix Semiconductor Inc. | Cross-linking monomers for photoresist, and process for preparing photoresist polymers using the same |
| KR100557608B1 (ko) * | 1999-02-10 | 2006-03-10 | 주식회사 하이닉스반도체 | 신규의 포토레지스트 가교제 및 이를 이용한 포토레지스트 조성물 |
| KR100557609B1 (ko) * | 1999-02-22 | 2006-03-10 | 주식회사 하이닉스반도체 | 신규의 포토레지스트 가교제 및 이를 이용한 포토레지스트 조성물 |
| KR100647379B1 (ko) | 1999-07-30 | 2006-11-17 | 주식회사 하이닉스반도체 | 신규의 포토레지스트용 단량체, 그의 공중합체 및 이를 이용한포토레지스트 조성물 |
| US6818376B2 (en) | 1999-08-23 | 2004-11-16 | Hynix Semiconductor Inc. | Cross-linker monomer comprising double bond and photoresist copolymer containing the same |
| KR100520183B1 (ko) * | 1999-08-23 | 2005-10-10 | 주식회사 하이닉스반도체 | 두 개의 이중결합을 가지는 가교제를 단량체로 포함하는 포토레지스트용 공중합체 |
| KR100546110B1 (ko) * | 2000-01-21 | 2006-01-24 | 주식회사 하이닉스반도체 | 포토레지스트 가교제 및 이를 함유하는 포토레지스트 조성물 |
| US6664022B1 (en) * | 2000-08-25 | 2003-12-16 | Shipley Company, L.L.C. | Photoacid generators and photoresists comprising same |
| KR20020082006A (ko) * | 2001-04-23 | 2002-10-30 | 금호석유화학 주식회사 | 신규한 산-민감성 중합체 및 이를 함유하는 레지스트 조성물 |
| US7138218B2 (en) | 2001-12-18 | 2006-11-21 | Hynix Semiconductor Inc. | Process for forming an ultra fine pattern using a bottom anti-reflective coating film containing an acid generator |
| US7338742B2 (en) | 2003-10-08 | 2008-03-04 | Hynix Semiconductor Inc. | Photoresist polymer and photoresist composition containing the same |
| US7270937B2 (en) | 2003-10-17 | 2007-09-18 | Hynix Semiconductor Inc. | Over-coating composition for photoresist and process for forming photoresist pattern using the same |
| KR100680405B1 (ko) | 2003-11-19 | 2007-02-08 | 주식회사 하이닉스반도체 | Ｅｕｖ용 포토레지스트 조성물 및 이를 이용한포토레지스트 패턴 형성 방법 |
| JP4979477B2 (ja) * | 2004-03-08 | 2012-07-18 | 三菱レイヨン株式会社 | レジスト用重合体、レジスト組成物、およびパターン製造方法、並びにレジスト用重合体用原料化合物 |
| US20070031758A1 (en) * | 2005-08-03 | 2007-02-08 | Jsr Corporation | Positive-type radiation-sensitive resin composition for producing a metal-plating formed material, transcription film and production method of a metal-plating formed material |
| US7745339B2 (en) | 2006-02-24 | 2010-06-29 | Hynix Semiconductor Inc. | Method for forming fine pattern of semiconductor device |
| KR100694412B1 (ko) | 2006-02-24 | 2007-03-12 | 주식회사 하이닉스반도체 | 반도체소자의 미세패턴 형성방법 |
| JP5233985B2 (ja) * | 2007-02-26 | 2013-07-10 | Ｊｓｒ株式会社 | 微細パターン形成用樹脂組成物及び微細パターン形成方法 |
| JP6983766B2 (ja) * | 2015-09-28 | 2021-12-17 | スリーエム イノベイティブ プロパティズ カンパニー | 開裂可能な架橋剤を含むパターン化されたフィルム物品及び方法 |
| CN116102938B (zh) * | 2021-11-09 | 2023-10-20 | 上海新阳半导体材料股份有限公司 | 一种深紫外光刻用底部抗反射涂层及其制备方法和应用 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1275471A (en) * | 1969-06-04 | 1972-05-24 | Du Pont | Improvements relating to photo-resists |
| US4293636A (en) * | 1980-06-27 | 1981-10-06 | Tamura Kaken Co., Ltd. | Photopolymerizable polyester containing compositions |
| EP0047184A2 (en) * | 1980-09-03 | 1982-03-10 | E.I. Du Pont De Nemours And Company | Radiation polymerizable composition for forming heat-resistant relief structures on electrical devices such as semiconductors and capacitors |
| EP0702270A2 (en) * | 1994-09-13 | 1996-03-20 | Nippon Zeon Co., Ltd. | Photosensitive polyimide resin composition |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1277674A (en) * | 1969-08-04 | 1972-06-14 | Ford Motor Co | Painting of polyolefins |
| WO1992007022A1 (en) * | 1990-10-23 | 1992-04-30 | Atomic Energy Of Canada Limited | Process for the preparation of cellulosic fibre-reinforced thermoplastic composite materials |
-
1998
- 1998-12-31 KR KR10-1998-0063793A patent/KR100362937B1/ko not_active Expired - Fee Related
-
1999
- 1999-12-10 TW TW088121653A patent/TWI222968B/zh not_active IP Right Cessation
- 1999-12-15 GB GB9929650A patent/GB2345286B/en not_active Expired - Fee Related
- 1999-12-15 DE DE19960506A patent/DE19960506A1/de not_active Withdrawn
- 1999-12-21 IT IT1999TO001137A patent/IT1308679B1/it active
- 1999-12-22 JP JP36514699A patent/JP4001445B2/ja not_active Expired - Fee Related
- 1999-12-22 NL NL1013916A patent/NL1013916C2/nl not_active IP Right Cessation
- 1999-12-24 CN CNB991266870A patent/CN1303114C/zh not_active Expired - Lifetime
- 1999-12-29 FR FR9916643A patent/FR2788062B1/fr not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1275471A (en) * | 1969-06-04 | 1972-05-24 | Du Pont | Improvements relating to photo-resists |
| US4293636A (en) * | 1980-06-27 | 1981-10-06 | Tamura Kaken Co., Ltd. | Photopolymerizable polyester containing compositions |
| EP0047184A2 (en) * | 1980-09-03 | 1982-03-10 | E.I. Du Pont De Nemours And Company | Radiation polymerizable composition for forming heat-resistant relief structures on electrical devices such as semiconductors and capacitors |
| EP0702270A2 (en) * | 1994-09-13 | 1996-03-20 | Nippon Zeon Co., Ltd. | Photosensitive polyimide resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100362937B1 (ko) | 2003-10-04 |
| DE19960506A1 (de) | 2000-09-07 |
| FR2788062A1 (fr) | 2000-07-07 |
| JP4001445B2 (ja) | 2007-10-31 |
| FR2788062B1 (fr) | 2004-09-10 |
| KR20000047041A (ko) | 2000-07-25 |
| NL1013916A1 (nl) | 2000-07-03 |
| CN1303114C (zh) | 2007-03-07 |
| JP2000199951A (ja) | 2000-07-18 |
| GB2345286A (en) | 2000-07-05 |
| IT1308679B1 (it) | 2002-01-09 |
| GB9929650D0 (en) | 2000-02-09 |
| ITTO991137A1 (it) | 2001-06-21 |
| CN1258670A (zh) | 2000-07-05 |
| TWI222968B (en) | 2004-11-01 |
| ITTO991137A0 (it) | 1999-12-21 |
| GB2345286B (en) | 2004-06-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| NL1013916C2 (nl) | Verknopende monomeren voor een fotobeschermlaag en werkwijze voor het bereiden van fotobeschermlaag-polymeren waarbij deze gebruikt worden. | |
| NL1013685C2 (nl) | Verknopingsmiddel voor fotolaklaag en fotolaklaagsamenstelling welke deze omvat. | |
| JP3847991B2 (ja) | 共重合体樹脂とその製造方法、この共重合体樹脂を含むフォトレジスト、および半導体素子 | |
| NL1008001C2 (nl) | Werkwijze en inrichting waarin ArF fotoresist wordt gebruikt. | |
| DE69926532T2 (de) | Photoresists, polymere und verfahren für die mikrolithographie | |
| TWI229782B (en) | Resist composition suitable for short wavelength exposure and resist pattern forming method | |
| JP5687442B2 (ja) | 光酸発生剤およびこれを含むフォトレジスト | |
| JP4402304B2 (ja) | フッ素化ポリマー、フォトレジストおよびミクロリソグラフィーのための方法 | |
| KR100520183B1 (ko) | 두 개의 이중결합을 가지는 가교제를 단량체로 포함하는 포토레지스트용 공중합체 | |
| JPH04219757A (ja) | 感放射線性混合物 | |
| KR100557609B1 (ko) | 신규의 포토레지스트 가교제 및 이를 이용한 포토레지스트 조성물 | |
| KR100562205B1 (ko) | 2차 히드록실기를 갖는 알킬 환상 올레핀과 아크릴화합물의 중합체 및 이를 포함하는 화학증폭형 레지스트조성물 | |
| TW594385B (en) | Fluorinated polymers having ester groups useful as photoresists and processes for microlithography | |
| US6291131B1 (en) | Monomers for photoresist, polymers thereof, and photoresist compositions using the same | |
| US6482565B1 (en) | Photoresist cross-linker and photoresist composition comprising the same | |
| Ito | Advances in chemical amplification resist systems | |
| KR100647379B1 (ko) | 신규의 포토레지스트용 단량체, 그의 공중합체 및 이를 이용한포토레지스트 조성물 | |
| US6737217B2 (en) | Photoresist monomers containing fluorine-substituted benzylcarboxylate and photoresist polymers comprising the same | |
| JPH1115159A (ja) | ネガ型フォトレジスト材料、およびそれを用いたパターン形成方法 | |
| US20020160301A1 (en) | Cross-linker monomer comprising double bond and photoresist copolymer containing the same | |
| US20030013037A1 (en) | Maleimide-photoresist monomers containing halogen, polymers thereof and photoresist compositions comprising the same | |
| US7208260B2 (en) | Cross-linking monomers for photoresist, and process for preparing photoresist polymers using the same | |
| TWI307451B (en) | Photoresist composition | |
| JP4295937B2 (ja) | 活性成分及びそれを用いた感光性樹脂組成物 | |
| JP4041335B2 (ja) | フォトレジスト重合体、フォトレジスト重合体の製造方法、フォトレジスト組成物、フォトレジストパターン形成方法及び半導体素子 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AD1A | A request for search or an international type search has been filed | ||
| RD2N | Patents in respect of which a decision has been taken or a report has been made (novelty report) |
Effective date: 20020923 |
|
| PD2B | A search report has been drawn up | ||
| MM | Lapsed because of non-payment of the annual fee |
Effective date: 20160101 |