DE19547948C1 - Verfahren und Schaltungsanordnung zur Erzeugung von Strompulsen zur elektrolytischen Metallabscheidung - Google Patents
Verfahren und Schaltungsanordnung zur Erzeugung von Strompulsen zur elektrolytischen MetallabscheidungInfo
- Publication number
- DE19547948C1 DE19547948C1 DE19547948A DE19547948A DE19547948C1 DE 19547948 C1 DE19547948 C1 DE 19547948C1 DE 19547948 A DE19547948 A DE 19547948A DE 19547948 A DE19547948 A DE 19547948A DE 19547948 C1 DE19547948 C1 DE 19547948C1
- Authority
- DE
- Germany
- Prior art keywords
- current
- electroplating
- pulse
- bath
- compensation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007747 plating Methods 0.000 title abstract description 12
- 238000009713 electroplating Methods 0.000 claims abstract description 51
- 238000000034 method Methods 0.000 claims abstract description 25
- 238000004804 winding Methods 0.000 claims abstract description 23
- 239000003990 capacitor Substances 0.000 claims abstract description 17
- 238000005246 galvanizing Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 6
- 230000001939 inductive effect Effects 0.000 claims description 4
- 230000010363 phase shift Effects 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 238000001208 nuclear magnetic resonance pulse sequence Methods 0.000 claims 3
- 230000005611 electricity Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 4
- 229910052770 Uranium Inorganic materials 0.000 description 3
- 230000002378 acidificating effect Effects 0.000 description 3
- 239000003792 electrolyte Substances 0.000 description 3
- 230000002441 reversible effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 238000007743 anodising Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000002739 metals Chemical group 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Metals (AREA)
- Ac-Ac Conversion (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (14)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19547948A DE19547948C1 (de) | 1995-12-21 | 1995-12-21 | Verfahren und Schaltungsanordnung zur Erzeugung von Strompulsen zur elektrolytischen Metallabscheidung |
| AT96934478T ATE186081T1 (de) | 1995-12-21 | 1996-09-27 | Verfahren und schaltungsanordnung zur erzeugung von strompulsen zur elektrolytischen metallabscheidung |
| PCT/EP1996/004232 WO1997023665A1 (de) | 1995-12-21 | 1996-09-27 | Verfahren und schaltungsanordnung zur erzeugung von strompulsen zur elektrolytischen metallabscheidung |
| US09/091,136 US6132584A (en) | 1995-12-21 | 1996-09-27 | Process and circuitry for generating current pulses for electrolytic metal deposition |
| DE59603510T DE59603510D1 (de) | 1995-12-21 | 1996-09-27 | Verfahren und schaltungsanordnung zur erzeugung von strompulsen zur elektrolytischen metallabscheidung |
| EP96934478A EP0868545B1 (de) | 1995-12-21 | 1996-09-27 | Verfahren und schaltungsanordnung zur erzeugung von strompulsen zur elektrolytischen metallabscheidung |
| ES96934478T ES2139388T3 (es) | 1995-12-21 | 1996-09-27 | Procedimientos y circuito para la generacion de impulsos de corriente para la precipitacion electrolitica de metales. |
| CZ19981700A CZ290052B6 (cs) | 1995-12-21 | 1996-09-27 | Způsob a zapojení pro vytváření proudových impulzů pro elektrolytické vylučování kovů |
| JP52324197A JP4028892B2 (ja) | 1995-12-21 | 1996-09-27 | 電解金属析出のために電流パルスを発生するための方法と回路配置 |
| CN96199166A CN1093337C (zh) | 1995-12-21 | 1996-09-27 | 用于产生电解金属电镀电流脉冲的方法及电路结构 |
| CA002241055A CA2241055A1 (en) | 1995-12-21 | 1996-09-27 | Method and circuit arrangement for generating current pulses for electrolytic metal deposition |
| KR10-1998-0704072A KR100465545B1 (ko) | 1995-12-21 | 1996-09-27 | 전해금속침착용전류펄스를발생시키기위한방법및회로배치 |
| BR9612163A BR9612163A (pt) | 1995-12-21 | 1996-09-27 | Processo e disposição de circuitos para a produção de pulsos de corrente para a precipitação eletrolitica de metal |
| HK99102336.1A HK1017392B (en) | 1995-12-21 | 1996-09-27 | Process and circuitry for generating current pulses for electrolytic metal deposition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19547948A DE19547948C1 (de) | 1995-12-21 | 1995-12-21 | Verfahren und Schaltungsanordnung zur Erzeugung von Strompulsen zur elektrolytischen Metallabscheidung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE19547948C1 true DE19547948C1 (de) | 1996-11-21 |
Family
ID=7780889
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19547948A Expired - Fee Related DE19547948C1 (de) | 1995-12-21 | 1995-12-21 | Verfahren und Schaltungsanordnung zur Erzeugung von Strompulsen zur elektrolytischen Metallabscheidung |
| DE59603510T Expired - Fee Related DE59603510D1 (de) | 1995-12-21 | 1996-09-27 | Verfahren und schaltungsanordnung zur erzeugung von strompulsen zur elektrolytischen metallabscheidung |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE59603510T Expired - Fee Related DE59603510D1 (de) | 1995-12-21 | 1996-09-27 | Verfahren und schaltungsanordnung zur erzeugung von strompulsen zur elektrolytischen metallabscheidung |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US6132584A (https=) |
| EP (1) | EP0868545B1 (https=) |
| JP (1) | JP4028892B2 (https=) |
| KR (1) | KR100465545B1 (https=) |
| CN (1) | CN1093337C (https=) |
| AT (1) | ATE186081T1 (https=) |
| BR (1) | BR9612163A (https=) |
| CA (1) | CA2241055A1 (https=) |
| CZ (1) | CZ290052B6 (https=) |
| DE (2) | DE19547948C1 (https=) |
| ES (1) | ES2139388T3 (https=) |
| WO (1) | WO1997023665A1 (https=) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2763343A1 (fr) * | 1997-05-14 | 1998-11-20 | Motorola Inc | Procede de depot d'une couche de matiere sur un substrat a l'aide d'un systeme de placage |
| US6231743B1 (en) | 2000-01-03 | 2001-05-15 | Motorola, Inc. | Method for forming a semiconductor device |
| DE10259365A1 (de) * | 2002-04-08 | 2003-10-30 | Siemens Ag | Vorrichtung und Verfahren zur Entfernung von Oberflächenbereichen eines Bauteils |
| RU2248416C1 (ru) * | 2003-11-04 | 2005-03-20 | Никифоров Алексей Александрович | Устройство для микродугового оксидирования |
| US8603864B2 (en) | 2008-09-11 | 2013-12-10 | Infineon Technologies Ag | Method of fabricating a semiconductor device |
| US8673405B2 (en) | 2006-08-08 | 2014-03-18 | Siemens Aktiengesellschaft | Method for producing a wear layer |
| RU2722754C1 (ru) * | 2019-04-23 | 2020-06-03 | Общество с ограниченной ответственностью "Керамик тех" (ООО "Керамик тех") | Устройство для формирования электрохимическим оксидированием покрытий на вентильных металлах или сплавах |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6793796B2 (en) | 1998-10-26 | 2004-09-21 | Novellus Systems, Inc. | Electroplating process for avoiding defects in metal features of integrated circuit devices |
| US6946065B1 (en) * | 1998-10-26 | 2005-09-20 | Novellus Systems, Inc. | Process for electroplating metal into microscopic recessed features |
| US6344419B1 (en) | 1999-12-03 | 2002-02-05 | Applied Materials, Inc. | Pulsed-mode RF bias for sidewall coverage improvement |
| KR20020078307A (ko) | 2001-04-09 | 2002-10-18 | 주식회사 하이닉스반도체 | 반도체 소자의 커패시터 제조 방법 |
| NL1022786C2 (nl) * | 2003-02-26 | 2004-08-30 | Tendris Solutions Bv | Omzetschakeling, systeem en werkwijze voor het uitvoeren van een elektrochemisch proces. |
| DE10311575B4 (de) * | 2003-03-10 | 2007-03-22 | Atotech Deutschland Gmbh | Verfahren zum elektrolytischen Metallisieren von Werkstücken mit Bohrungen mit einem hohen Aspektverhältnis |
| US20070068821A1 (en) * | 2005-09-27 | 2007-03-29 | Takahisa Hirasawa | Method of manufacturing chromium plated article and chromium plating apparatus |
| US20050157475A1 (en) * | 2004-01-15 | 2005-07-21 | Endicott Interconnect Technologies, Inc. | Method of making printed circuit board with electroplated conductive through holes and board resulting therefrom |
| DE102004045451B4 (de) | 2004-09-20 | 2007-05-03 | Atotech Deutschland Gmbh | Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer |
| SE0403047D0 (sv) * | 2004-12-14 | 2004-12-14 | Polymer Kompositer I Goeteborg | Pulse-plating method and apparatus |
| PL377451A1 (pl) * | 2005-10-05 | 2007-04-16 | Instytut Wysokich Ciśnień PAN | Sposób prowadzenia reakcji i reaktor chemiczny |
| DE102006044416A1 (de) * | 2006-09-18 | 2008-03-27 | Siemens Ag | Verfahren zum elektrochemischen Be- oder Entschichten von Bauteilen |
| US20080271995A1 (en) * | 2007-05-03 | 2008-11-06 | Sergey Savastiouk | Agitation of electrolytic solution in electrodeposition |
| US11225727B2 (en) | 2008-11-07 | 2022-01-18 | Lam Research Corporation | Control of current density in an electroplating apparatus |
| US10011917B2 (en) | 2008-11-07 | 2018-07-03 | Lam Research Corporation | Control of current density in an electroplating apparatus |
| US9011706B2 (en) * | 2008-12-16 | 2015-04-21 | City University Of Hong Kong | Method of making foraminous microstructures |
| US9385035B2 (en) | 2010-05-24 | 2016-07-05 | Novellus Systems, Inc. | Current ramping and current pulsing entry of substrates for electroplating |
| JP6161863B2 (ja) * | 2010-12-28 | 2017-07-12 | 株式会社荏原製作所 | 電気めっき方法 |
| US9028666B2 (en) | 2011-05-17 | 2015-05-12 | Novellus Systems, Inc. | Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath |
| CN102277603A (zh) * | 2011-08-03 | 2011-12-14 | 深圳大学 | 一种感应热/电沉积制备涂层或薄膜的装置及方法 |
| CA2929515C (en) * | 2013-11-19 | 2019-12-31 | Hecker Electronica Potencia Y Procesos S.A. | Process for superimposing ac over dc used in copper, or other products, electrowinning or electrorefining processes, wherein the ac source is connected between two consecutive cells from the group of electrolytic cells using an inductor to inject ac and a capacitor to close the electrical circuit |
| EP3029178A1 (en) | 2014-12-05 | 2016-06-08 | ATOTECH Deutschland GmbH | Method and apparatus for electroplating a metal onto a substrate |
| JP7358238B2 (ja) | 2016-07-13 | 2023-10-10 | イオントラ インコーポレイテッド | 電気化学的方法、装置及び組成物 |
| CN114836797B (zh) * | 2022-05-12 | 2023-08-29 | 广州市慧科高新材料科技有限公司 | 一种基于脉冲搭桥的通孔填孔电镀工艺 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2739427A1 (de) * | 1976-09-01 | 1978-03-02 | Inoue Japax Res | Verfahren und vorrichtung fuer galvanischen niederschlag |
| GB2214520A (en) * | 1988-01-27 | 1989-09-06 | Jct Controls Ltd | Electrochemical processes using independently controlled voltages in alternation |
| DE4005346A1 (de) * | 1990-02-20 | 1991-08-22 | Siemens Ag | Verfahren zur erzeugung von hochfrequenten strompulsen mit steilen pulsflanken in galvanikanlagen und versorgungsschaltung zur durchfuehrung des verfahrens |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3616434A (en) * | 1968-04-18 | 1971-10-26 | Novachrome Inc | Apparatus with power source for plating |
| US3959088A (en) * | 1975-03-19 | 1976-05-25 | The United States Of America As Represented By The Secretary Of The Army | Method and apparatus for generating high amperage pulses from an A-C power source |
| US4208254A (en) * | 1976-09-22 | 1980-06-17 | Satoshi Ichioka | Method of plating an iron-cobalt alloy on a substrate |
| US4517059A (en) * | 1981-07-31 | 1985-05-14 | The Boeing Company | Automated alternating polarity direct current pulse electrolytic processing of metals |
-
1995
- 1995-12-21 DE DE19547948A patent/DE19547948C1/de not_active Expired - Fee Related
-
1996
- 1996-09-27 WO PCT/EP1996/004232 patent/WO1997023665A1/de not_active Ceased
- 1996-09-27 US US09/091,136 patent/US6132584A/en not_active Expired - Fee Related
- 1996-09-27 EP EP96934478A patent/EP0868545B1/de not_active Expired - Lifetime
- 1996-09-27 CA CA002241055A patent/CA2241055A1/en not_active Abandoned
- 1996-09-27 DE DE59603510T patent/DE59603510D1/de not_active Expired - Fee Related
- 1996-09-27 JP JP52324197A patent/JP4028892B2/ja not_active Expired - Fee Related
- 1996-09-27 BR BR9612163A patent/BR9612163A/pt not_active Application Discontinuation
- 1996-09-27 ES ES96934478T patent/ES2139388T3/es not_active Expired - Lifetime
- 1996-09-27 CZ CZ19981700A patent/CZ290052B6/cs not_active IP Right Cessation
- 1996-09-27 KR KR10-1998-0704072A patent/KR100465545B1/ko not_active Expired - Fee Related
- 1996-09-27 CN CN96199166A patent/CN1093337C/zh not_active Expired - Fee Related
- 1996-09-27 AT AT96934478T patent/ATE186081T1/de not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2739427A1 (de) * | 1976-09-01 | 1978-03-02 | Inoue Japax Res | Verfahren und vorrichtung fuer galvanischen niederschlag |
| GB2214520A (en) * | 1988-01-27 | 1989-09-06 | Jct Controls Ltd | Electrochemical processes using independently controlled voltages in alternation |
| DE4005346A1 (de) * | 1990-02-20 | 1991-08-22 | Siemens Ag | Verfahren zur erzeugung von hochfrequenten strompulsen mit steilen pulsflanken in galvanikanlagen und versorgungsschaltung zur durchfuehrung des verfahrens |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2763343A1 (fr) * | 1997-05-14 | 1998-11-20 | Motorola Inc | Procede de depot d'une couche de matiere sur un substrat a l'aide d'un systeme de placage |
| NL1009157C2 (nl) * | 1997-05-14 | 2000-01-10 | Motorola Inc | Werkwijze voor het aanbrengen van een materiaallaag op een substraat en een plateringssysteem. |
| US6174425B1 (en) | 1997-05-14 | 2001-01-16 | Motorola, Inc. | Process for depositing a layer of material over a substrate |
| US6500324B1 (en) | 1997-05-14 | 2002-12-31 | Motorola, Inc. | Process for depositing a layer of material on a substrate |
| US7323094B2 (en) | 1997-05-14 | 2008-01-29 | Freescale Semiconductor, Inc. | Process for depositing a layer of material on a substrate |
| US6231743B1 (en) | 2000-01-03 | 2001-05-15 | Motorola, Inc. | Method for forming a semiconductor device |
| DE10259365A1 (de) * | 2002-04-08 | 2003-10-30 | Siemens Ag | Vorrichtung und Verfahren zur Entfernung von Oberflächenbereichen eines Bauteils |
| US7569133B2 (en) | 2002-04-08 | 2009-08-04 | Siemens Aktiengesellschaft | Device and method for removing surface areas of a component |
| RU2248416C1 (ru) * | 2003-11-04 | 2005-03-20 | Никифоров Алексей Александрович | Устройство для микродугового оксидирования |
| US8673405B2 (en) | 2006-08-08 | 2014-03-18 | Siemens Aktiengesellschaft | Method for producing a wear layer |
| US8603864B2 (en) | 2008-09-11 | 2013-12-10 | Infineon Technologies Ag | Method of fabricating a semiconductor device |
| RU2722754C1 (ru) * | 2019-04-23 | 2020-06-03 | Общество с ограниченной ответственностью "Керамик тех" (ООО "Керамик тех") | Устройство для формирования электрохимическим оксидированием покрытий на вентильных металлах или сплавах |
Also Published As
| Publication number | Publication date |
|---|---|
| HK1017392A1 (en) | 1999-11-19 |
| CN1205745A (zh) | 1999-01-20 |
| KR100465545B1 (ko) | 2005-02-28 |
| CA2241055A1 (en) | 1997-07-03 |
| EP0868545B1 (de) | 1999-10-27 |
| KR19990071793A (ko) | 1999-09-27 |
| ES2139388T3 (es) | 2000-02-01 |
| JP4028892B2 (ja) | 2007-12-26 |
| CZ170098A3 (cs) | 1998-10-14 |
| BR9612163A (pt) | 1999-07-13 |
| JP2000505145A (ja) | 2000-04-25 |
| DE59603510D1 (de) | 1999-12-02 |
| CN1093337C (zh) | 2002-10-23 |
| CZ290052B6 (cs) | 2002-05-15 |
| US6132584A (en) | 2000-10-17 |
| ATE186081T1 (de) | 1999-11-15 |
| EP0868545A1 (de) | 1998-10-07 |
| WO1997023665A1 (de) | 1997-07-03 |
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Legal Events
| Date | Code | Title | Description |
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