GB2214520A - Electrochemical processes using independently controlled voltages in alternation - Google Patents

Electrochemical processes using independently controlled voltages in alternation Download PDF

Info

Publication number
GB2214520A
GB2214520A GB8901091A GB8901091A GB2214520A GB 2214520 A GB2214520 A GB 2214520A GB 8901091 A GB8901091 A GB 8901091A GB 8901091 A GB8901091 A GB 8901091A GB 2214520 A GB2214520 A GB 2214520A
Authority
GB
United Kingdom
Prior art keywords
voltages
switching means
equipment
electrical power
voltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB8901091A
Other versions
GB8901091D0 (en
Inventor
Richard Margrave Ellis
John Francis Houlston
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JCT CONTROLS Ltd
Original Assignee
JCT CONTROLS Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JCT CONTROLS Ltd filed Critical JCT CONTROLS Ltd
Publication of GB8901091D0 publication Critical patent/GB8901091D0/en
Publication of GB2214520A publication Critical patent/GB2214520A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60Electroplating characterised by the structure or texture of the layers
    • C25D5/615Microstructure of the layers, e.g. mixed structure
    • C25D5/617Crystalline layers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18Electroplating using modulated, pulsed or reversing current
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60Electroplating characterised by the structure or texture of the layers
    • C25D5/623Porosity of the layers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/241Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/423Plated through-holes or plated via connections characterised by electroplating method

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Hybrid Cells (AREA)

Abstract

A method of operating an electrochemical process comprises the application of at least two independently-controlled voltages in alternation, the equipment comprising at least two independently controlled electrical power sources (7, 8) and switching means (9) for applying them in alternation to a cell (4) in which are suspended a workpiece (2) and another electrode (3). If more than two independently controlled voltages are utilised they will be applied cyclicly. Preferably, one of the two or more voltages will be reversed, and may be pulsed, and the electrolyte preferably comprises at least two organic additives, at least one being a polariser the effects of which are inhibited by reverse voltages, and the other being a depolariser that is preferentially adsorbed.

Description

ELECTROCHEMICAL PROCESSES This invention relates to improved means for carrying out electrochemical processes, particularly electrodeposition.
The basic arrangement for a typical electrodeposition process is shown diagrammatically in Figure l(a) of the accompanying drawings, in which a source of electrical power is shown at 1. This is most commonly a transformer-rectifier but may alternatively be a battery or a rotary generator.
Means for varying the output voltage are provided. The current source 1 is connected to a workpiece 2 and another electrode 3 which are suspended in a cell or bath 4 of electrolyte solution forming an electrolytic cell.
In a known technique for operating the process, termed "Periodic Reverse Plating", a reversing switch unit 5 is interposed between the power source 1 and the cell 4. The unit 5 may be a number of switches operated mechanically, appropriate electromechanical relays or solid state devices.
The unit 5 operates at intervals, producing the effect shown in Figure l(b), which is a graph of the voltage applied to the cell against time. The normal voltage V is replaced at intervals by the same voltage in the opposite sense.
Obviously, to obtain a net plating effect, the total time for which forward (+) voltage is applied must be greater than that with reverse (-) voltage.
Another known technique is Pulse Plating". The basic arrangement is shown diagrammatically in the accompanying Figure 2(a). It is the same as that of Figure l(a), except that a pulsing unit 6 replaces the switch unit 5. The unit 6 periodically interrupts one or both of the connections between the power source 1 and the cell but does not reverse them.
This produces the effect shown in Figure 2(b), again a graph showing the relationship between voltage applied to the cell and time. Normally a fairly high frequency is required, up to 5,888 cycles per second or more and the only suitable construction for the unit 6 is a solid state device, such as an array of field-effect transistors which may be controlled by a microprocessor.
Pulse plating can have-various beneficial effects. It can refine the crystal structure of the deposit, reduce its porosity or stress, or improve throwing power. The facility for varying the voltage of the source 1 can be retained and further control of the process is usually provided by adjustment of the frequency at which the unit 6 "chops" this supply or the proportion of each cycle for which it is "on" or "off", that is, the "mark-space ratio".
It is yet further known to combine the functions of periodic reverse and pulsing in one control unit, r so that desired effects such as shown in the accompanying Figure 3 may be produced, in which the voltage is reversed for periodic short intervals and both forward and reverse supplies may be pulsed, but the input supply voltage, though variable at the source, is the same in both senses.
It is true that, by pulsing a supply and altering the mark-space ratio of pulsing, the mean output voltage may be changed. By the use of a smoothing circuit with capacitors and/or inductors a uniform direct current may then be obtained. This is an effective means of providing a variable-voltage direct current supply as required for the unit 1 of Figures 1 or 2, reversal or pulsing being subsequently applied as required. It is important to distinguish such a supply system from pulsing as such, the action of which depends on the square (approximately) wave form of the voltage which must not then be smoothed or the effect will be destroyed.
It must now be noted that most electrochemical processes are critically dependent on the applied voltage.
For example, any pair of dissimilar metals immersed in an electrolyte will generate an inherent voltage and little or no current will flow in the opposing direction until a voltage greater than the inherent voltage is applied. On the other hand, excessive voltage can produce undesirable effects. It is thus often required to control the voltages in the forward and reverse directions independently. No provision for this is available in any arrangement previously known.
It must also be noted that electrolytes used for electrodeposition purposes generally contain, apart from appropriate metal ions, organic additives which are there for the specific purpose of modifying the structure and/or brightness of the metal deposit. These additives are usually adsorbed or diffused onto the deposit surface and cause changes in deposit structures some of which are not always desirable.
The object of the invention is to improve the performance of an electrochemical process, more particularly but not exclusively - electrodeposition.
According to the present invention, a method of operating an electrochemical process comprises the application of at least two independently-controlled voltages in alternation. It will be evident that if more than two independently-controlled voltages are utilised they will be applied cyclicly. Preferably, one of the two or more voltages will be reversed. Alternatively one of the voltages may modulate the other or another voltage. One or each voltage may be pulsed.
Another aspect of the present invention is the provision of equipment for operating an electrochemical process comprising at least two independently-controlled electrical power sources and switching means for applying them in alternation. Alternatively the switching means could be adapted to apply more than two independently-controlled voltages cyclicly. Preferably, the switching means is adapted to reverse one of the two or more applied electrical power sources. Alternatively, the switching means is adapted to cause one electrical power source to modulate the other or another. The switching means may also be adapted to pulse one or each electrical power source.
A third aspect of the invention is the provision of an electrolyte for enhancing the process as operated in accordance with the invention, the electrolyte comprising at least two organic additives, at least one being a polariser the effects of which are inhibited by reverse voltages, and the other being a depolariser that is preferentially adsorbed.
A basic arrangement of equipment in accordance with the invention is shown diagrammatically in Figure 4(a) of the accompanying drawings. There are two variable-voltage sources or supplies 7 and 8 each connected to a control unit 9, which contains a number of solid-state switching devices capable of connecting a pair of conductors 1B leading to the cell 4 to either of the supplies or of isolating them.
Alternatively the unit 9 switches in the source 8 to modulate the output from source 7. Figure 5 shows a typical control arrangement for such a unit.
Similar control could be produced by using known electrical devices or circuits which dissipate some of an input voltage to produce a lower value, but this would only be convenient for instruments or other applications of the invention using a low current; at typical electroplating currents, the power lost would be difficult to dispose of.
Typical effects produced are shown in the further time-base graphs of Figures 4(b) and 4(c), the former showing both forward and reverse voltages being pulsed, and the latter showing simple reversal for a lesser time but with a higher reverse voltage.
The control unit is normally capable of producing pulses of frequency and mark-space ratio which are independently adjustable for each supply and for adjustable periods before switching from one to another. The programme may provide for more than one such setting for either or both supplies. Several different voltages may be applied to the cell in each direction, in which case the control unit may need to provide for connection to more than two power supplies. An example of the use of such a facility would be a requirement for the pulsed voltage to fall not to zero but to some other value during each pulse. The settings of the control unit or the voltages of the power supplies may be arranged to vary with time or with total current passed so as to provide optimum conditions at various stages of a process.
A typical application for the system disclosed is the production of printed circuit boards by deposition of acid copper from an acid electrolyte. Electrodeposited copper is used to provide electrical conduction in through holes used for component connection and for connection between surfaces and intermediate layers.
The conventional process employs an aqueous electrolyte of copper sulphate and sulphuric acid to which are usually added chloride ions and organic additives to assist with anode dissolution and to give deposits with suitable mechanical properties. The current distribution on many boards makes it very difficult to deposit sufficient copper on some parts of the board, eg. high aspect ratio through holes, without excessive thicknesses on other areas, eg. fine tracks and isolated pads. This in itself causes problems with dry film solder resists applied at a subsequent stage.
Therefore, when operating an improved electrodeposition process in accordance with the invention using independently-variable forward and reverse voltages, the electrolyte comprises an acid copper sulphate solution containing high molecular weight polyethers, sulphur propyl sulphide and chloride ions which together change the polarisation characteristics of the solution at different current densities thus effecting an improvement in the distribution of copper over complex shapes such as printed circuit boards.
It is true that the above additives, singly or together, have little or no beneficial effect on the distribution of copper when using direct current. It is also true that singly these additives have no effect on distribution when using pulsed or differential pulse reverse current.
Using the conventional process with uni-directional voltage at low current density the polarisation of the cathode is primarily effected by adsorption of the polyether and sulphide. As the current density increases diffusion effects of the sulphide become dominant. Using independentlyvariable forward and reverse voltages with pulses with precisely controlled length, frequency and amplitude, the diffusion process is blocked at higher current densities.
The polyether has an inhibiting effect on the deposition of copper and the sulphide has a depolarising (stimulating) effect which is therefore diminished at higher current density areas giving an overall improvement in metal distribution.
The acid copper solution which forms part of the invention preferably contains: Copper Sulphate 1B - 35 g/l Free Acid 188 - 35g g/l Chloride ion 4 - 4 ppm A compound of general formula R - (CH2)n - SO3X '(18 - 4ppm) where n is an integer between 2 and 4 X is hydrogen or an alkali metal R is a sulphur containing group eg. mercapto propane sulphonic acid Polyether HO - (CH2 - cH2- )n ~ (CH2 - CH - 0)m - R(10 - 70 ppm) CH3 where n and m are integers whose combined values give a total molecular weight of 18BB to 58888 R is hydrogen or a hydrophobic group.
Example 1 The following additives were added to an acid copper sulphate bath.
70 ppm Oxylube 200 40 ppm Mercapto propane sulphonic acid e ppm Chloride (as hydrochloric acid) Two Hull cell panels were plated as follows: Panel 1.
Uni-directional voltage at 2 amps for 1B minutes.
Panel 2.
Independently-variable reversed voltages applied for a total of 18 minutes, i.e., forward at 2 amps for 18 msec. and reverse at 7 amps for .5 msec.
Using a coulometric technique the copper thickness was measured at 1cm intervals across each panel. The results are shown graphically in Figure 6.
Example 2 In the same solution as that used in Example 1 sample printed circuit panels 3.2mm thick with plated through holes of .5mm diameter were plated as follows: Panel 1.
Uni-directional voltage at 3 amps/Dm for 45 minutes.
Panel 2.
Independently-variable revsersed voltages applied for a total of 45 minutes, i.e. forward at 3 amps/Dm for 18 msec. and reverse at 5 amps/Dm for lmsec.
Copper Thickness (microns) Surface Hole Panel 1. 27 13 Panel 2. 23 27

Claims (15)

1. A method of operating an electrochemical process comprising the application of at least two independentlycontrolled voltages in alternation.
2. -A method as in Claim 1, wherein more than two independently-controlled voltages are applied cyclicly.
3. A method as in Claim 1 or Claim 2, wherein one of the voltages is reversed.
4. A method as in Claim 1 or Claim 2, wherein one of the voltages modulates the other or another voltage.
5. A method as in any one of Claims 1 to 4, wherein one or each voltage is pulsed.
6. Equipment for operating an electrochemical process comprising at least two independently-controlled electrical power sources and switching means for applying them in alternation.
7. Equipment as in Claim 6, wherein the switching means is adapted to apply more than two independentlycontrolled voltages cyclicly.
8. Equipment as in Claim 6 or Claim 7, wherein the switching means'is adapted to reverse one of the two or more applied electrical power sources.
9. Equipment as in Claim 6 or Claim 7, wherein the switching means is adapted to cause one electrical power source to modulate the other or another.
1. Equipment as in any one of Claims 6 to 9, wherein the switching means is adapted to pulse one or each electrical power source.
11. A method as in Claim 3 applied to an electrodeposition process, wherein the electrolyte comprises at least two organic additives, at least one being a polariser the effects of which are inhibited by reverse voltages, and the other being a depolariser that is preferentially adsorbed.
12. A method as in Claim 11, wherein the electrolyte comprises an acid copper sulphate solution containing high molecular weight polyethers, sulphur propyl sulphides and chloride ions which together change the polarisation characteristics of the solution at different current densities thus effecting an improvement in the distribution of copper over complex shapes such as printed circuit boards.
13. A method as in Claim 12, wherein the acid copper solution contains: Copper Sulphate 19 - 359 g/l Free Acid 199 - 359 g/l Chloride ion 49 - 499 ppm A compound of general formula R - (CH2)n - SO3X (19 - 49ppm) where n is an integer between 2 and 4 X is hydrogen or an alkali metal R is a sulphur containing group eg. mercapto propane sulphonic acid Polyether HO - (CH2 - cH2 )n ~ (CH2 - CH - 9m 78ppm) CH3 where n and m are integers whose combined-values give a total molecular weight of 1999 to 59999 R is hydrogen or a hydrophobic group.
14. A method as in Example 1 as applied to Panel 2.
15. A method as in Example 2 as applied to Panel 2.
GB8901091A 1988-01-27 1989-01-18 Electrochemical processes using independently controlled voltages in alternation Withdrawn GB2214520A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB888801827A GB8801827D0 (en) 1988-01-27 1988-01-27 Improvements in electrochemical processes

Publications (2)

Publication Number Publication Date
GB8901091D0 GB8901091D0 (en) 1989-03-15
GB2214520A true GB2214520A (en) 1989-09-06

Family

ID=10630626

Family Applications (2)

Application Number Title Priority Date Filing Date
GB888801827A Pending GB8801827D0 (en) 1988-01-27 1988-01-27 Improvements in electrochemical processes
GB8901091A Withdrawn GB2214520A (en) 1988-01-27 1989-01-18 Electrochemical processes using independently controlled voltages in alternation

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB888801827A Pending GB8801827D0 (en) 1988-01-27 1988-01-27 Improvements in electrochemical processes

Country Status (5)

Country Link
EP (1) EP0396610A1 (en)
AU (1) AU2947189A (en)
ES (1) ES2010390A6 (en)
GB (2) GB8801827D0 (en)
WO (1) WO1989007162A1 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19547948C1 (en) * 1995-12-21 1996-11-21 Atotech Deutschland Gmbh Mfg. unipolar or bipolar pulsed current for plating esp. of circuit boards at high current
DE19539865A1 (en) * 1995-10-26 1997-04-30 Lea Ronal Gmbh Continuous electroplating system
EP1050902A2 (en) * 1999-05-03 2000-11-08 Motorola, Inc. Method for forming a copper layer over a semiconductor wafer
EP1117283A1 (en) * 1998-09-14 2001-07-18 Ibiden Co., Ltd. Printed wiring board and its manufacturing method
GB2358194A (en) * 2000-01-17 2001-07-18 Ea Tech Ltd Electrolytic treatment using non-sinusoidal alternating current
US6793795B1 (en) * 1999-01-21 2004-09-21 Atotech Deutschland Gmbh Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits
WO2004111314A2 (en) * 2003-03-18 2004-12-23 Applied Materials, Inc. Algorithm for real-time process control of electro-polishing
WO2006065220A1 (en) * 2004-12-14 2006-06-22 Polymer Kompositer I Göteborg Ab Pulse-plating method and apparatus
EP2072644A1 (en) * 2007-12-21 2009-06-24 ETH Zürich, ETH Transfer Device and method for the electrochemical deposition of chemical compounds and alloys with controlled composition and or stoichiometry
US7790015B2 (en) 2002-09-16 2010-09-07 Applied Materials, Inc. Endpoint for electroprocessing
US7842169B2 (en) 2003-03-04 2010-11-30 Applied Materials, Inc. Method and apparatus for local polishing control
DE19633796B4 (en) * 1996-08-22 2012-02-02 Hans Höllmüller Maschinenbau GmbH Device for electroplating electronic circuit boards

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19545231A1 (en) * 1995-11-21 1997-05-22 Atotech Deutschland Gmbh Process for the electrolytic deposition of metal layers
DE19653681C2 (en) * 1996-12-13 2000-04-06 Atotech Deutschland Gmbh Process for the electrolytic deposition of copper layers with a uniform layer thickness and good optical and metal-physical properties and application of the process
DE19707905C1 (en) * 1997-02-27 1998-02-05 Atotech Deutschland Gmbh Bipolar pulsed current supply method for electroplating
USRE40386E1 (en) 1998-11-06 2008-06-17 Hitachi Ltd. Chrome plated parts and chrome plating method
JP3918142B2 (en) * 1998-11-06 2007-05-23 株式会社日立製作所 Chrome-plated parts, chromium-plating method, and method of manufacturing chromium-plated parts
EP1225972A4 (en) * 1999-09-24 2006-08-30 Semitool Inc Pattern dependent surface profile evolution of electrochemically deposited metal
DE602005022650D1 (en) 2004-04-26 2010-09-16 Rohm & Haas Elect Mat Improved plating process

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB625989A (en) * 1945-09-29 1949-07-07 Westinghouse Electric Int Co Improvements in or relating to electroplating
GB625990A (en) * 1945-09-29 1949-07-07 Westinghouse Electric Int Co Improvements in or relating to electroplating
GB676565A (en) * 1949-07-18 1952-07-30 Du Pont Improvements in current reversal electroplating
GB794930A (en) * 1955-11-25 1958-05-14 Marconi Wireless Telegraph Co Improvements in or relating to methods of electro-depositing metal
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
GB1433040A (en) * 1972-12-14 1976-04-22 M & T Chemicals Inc Electrodeposition of copper
US4666567A (en) * 1981-07-31 1987-05-19 The Boeing Company Automated alternating polarity pulse electrolytic processing of electrically conductive substances

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB779906A (en) * 1954-09-30 1957-07-24 Electro Chem Eng Improvements in or relating to electro-plating process and apparatus
US4517059A (en) * 1981-07-31 1985-05-14 The Boeing Company Automated alternating polarity direct current pulse electrolytic processing of metals
US4466864A (en) * 1983-12-16 1984-08-21 At&T Technologies, Inc. Methods of and apparatus for electroplating preselected surface regions of electrical articles
US4555315A (en) * 1984-05-29 1985-11-26 Omi International Corporation High speed copper electroplating process and bath therefor

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB625989A (en) * 1945-09-29 1949-07-07 Westinghouse Electric Int Co Improvements in or relating to electroplating
GB625990A (en) * 1945-09-29 1949-07-07 Westinghouse Electric Int Co Improvements in or relating to electroplating
GB676565A (en) * 1949-07-18 1952-07-30 Du Pont Improvements in current reversal electroplating
GB794930A (en) * 1955-11-25 1958-05-14 Marconi Wireless Telegraph Co Improvements in or relating to methods of electro-depositing metal
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
GB1433040A (en) * 1972-12-14 1976-04-22 M & T Chemicals Inc Electrodeposition of copper
US4666567A (en) * 1981-07-31 1987-05-19 The Boeing Company Automated alternating polarity pulse electrolytic processing of electrically conductive substances

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19539865A1 (en) * 1995-10-26 1997-04-30 Lea Ronal Gmbh Continuous electroplating system
DE19547948C1 (en) * 1995-12-21 1996-11-21 Atotech Deutschland Gmbh Mfg. unipolar or bipolar pulsed current for plating esp. of circuit boards at high current
WO1997023665A1 (en) * 1995-12-21 1997-07-03 Atotech Deutschland Gmbh Process and circuitry for generating current pulses for electrolytic metal deposition
US6132584A (en) * 1995-12-21 2000-10-17 Atotech Deutschland Gmbh Process and circuitry for generating current pulses for electrolytic metal deposition
DE19633796B4 (en) * 1996-08-22 2012-02-02 Hans Höllmüller Maschinenbau GmbH Device for electroplating electronic circuit boards
US8065794B2 (en) 1998-09-14 2011-11-29 Ibiden Co., Ltd. Printed wiring board and its manufacturing method
EP1667505A1 (en) * 1998-09-14 2006-06-07 Ibiden Co., Ltd. Electroplating process and process for producing a circuit board by electroplating
EP1117283A1 (en) * 1998-09-14 2001-07-18 Ibiden Co., Ltd. Printed wiring board and its manufacturing method
US7827680B2 (en) 1998-09-14 2010-11-09 Ibiden Co., Ltd. Electroplating process of electroplating an elecrically conductive sustrate
US7691189B2 (en) 1998-09-14 2010-04-06 Ibiden Co., Ltd. Printed wiring board and its manufacturing method
EP1117283A4 (en) * 1998-09-14 2004-06-23 Ibiden Co Ltd Printed wiring board and its manufacturing method
US7230188B1 (en) 1998-09-14 2007-06-12 Ibiden Co., Ltd. Printed wiring board and its manufacturing method
US6793795B1 (en) * 1999-01-21 2004-09-21 Atotech Deutschland Gmbh Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits
EP1050902A3 (en) * 1999-05-03 2001-04-11 Motorola, Inc. Method for forming a copper layer over a semiconductor wafer
US6297155B1 (en) * 1999-05-03 2001-10-02 Motorola Inc. Method for forming a copper layer over a semiconductor wafer
JP2000353675A (en) * 1999-05-03 2000-12-19 Motorola Inc Formation of copper layer on semiconductor wafer
EP1050902A2 (en) * 1999-05-03 2000-11-08 Motorola, Inc. Method for forming a copper layer over a semiconductor wafer
GB2358194B (en) * 2000-01-17 2004-07-21 Ea Tech Ltd Electrolytic treatment
GB2358194A (en) * 2000-01-17 2001-07-18 Ea Tech Ltd Electrolytic treatment using non-sinusoidal alternating current
US7790015B2 (en) 2002-09-16 2010-09-07 Applied Materials, Inc. Endpoint for electroprocessing
US7842169B2 (en) 2003-03-04 2010-11-30 Applied Materials, Inc. Method and apparatus for local polishing control
WO2004111314A3 (en) * 2003-03-18 2005-06-09 Applied Materials Inc Algorithm for real-time process control of electro-polishing
WO2004111314A2 (en) * 2003-03-18 2004-12-23 Applied Materials, Inc. Algorithm for real-time process control of electro-polishing
WO2006065220A1 (en) * 2004-12-14 2006-06-22 Polymer Kompositer I Göteborg Ab Pulse-plating method and apparatus
EP2072644A1 (en) * 2007-12-21 2009-06-24 ETH Zürich, ETH Transfer Device and method for the electrochemical deposition of chemical compounds and alloys with controlled composition and or stoichiometry

Also Published As

Publication number Publication date
AU2947189A (en) 1989-08-25
GB8801827D0 (en) 1988-02-24
GB8901091D0 (en) 1989-03-15
EP0396610A1 (en) 1990-11-14
ES2010390A6 (en) 1989-11-01
WO1989007162A1 (en) 1989-08-10

Similar Documents

Publication Publication Date Title
GB2214520A (en) Electrochemical processes using independently controlled voltages in alternation
KR100572433B1 (en) Programmed Pulse Electroplating Method
US6210555B1 (en) Electrodeposition of metals in small recesses for manufacture of high density interconnects using reverse pulse plating
DE3307748C2 (en)
MY107259A (en) Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing the same.
ES2015906B3 (en) SELECTIVE ELECTROLYTIC CLEANING OF SUBSTRATE METAL COATINGS WITH BASE METAL.
MY112930A (en) Method of surface-roughening treatment of copper foil
CA2275214A1 (en) Process to electrolytically deposit copper layers
KR100596992B1 (en) Method for depositing lead-free tin alloy
MY119378A (en) A copper foil for a printed circuit board, a process and an apparatus for producing the same
JP4148895B2 (en) Hole copper plating method
BR9812387A (en) Electroplating process
US3812020A (en) Electrolyte and method for electroplating an indium-copper alloy and printed circuits so plated
JPS644091A (en) Plating
GB2070647A (en) Selective chemical deposition and/or electrodeposition of metal coatings, especially for the production of printed circuits
Kalantary et al. Unipolar and bipolar pulsed current electrodeposition for PCB production
US3562117A (en) Method of copper electroplating printed circuit boards
DE10209365C1 (en) Process for electrolytically metallizing the walls of holes in e.g. circuit boards, conductor foils and strips comprises inserting the material into a working container, contacting with an electrolyte, and further processing
KR0156989B1 (en) High strength electrolytic copper foil
DE1071840B (en) Process for the production of electrodes on semiconductor bodies of semiconductor arrangements
Ellis et al. Electrochemical Processes Using Independently Controlled Voltages in Alternation
JPS6482598A (en) Copper plating method for printed board
ES2002169A6 (en) Method of manufacturing electrical circuit boards.
JP3071586B2 (en) Copper sulfate plating method
CN114836808A (en) Electroplating device and electroplating method

Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)