AU2947189A - Electrochemical processes - Google Patents

Electrochemical processes

Info

Publication number
AU2947189A
AU2947189A AU29471/89A AU2947189A AU2947189A AU 2947189 A AU2947189 A AU 2947189A AU 29471/89 A AU29471/89 A AU 29471/89A AU 2947189 A AU2947189 A AU 2947189A AU 2947189 A AU2947189 A AU 2947189A
Authority
AU
Australia
Prior art keywords
electrochemical processes
electrochemical
processes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU29471/89A
Inventor
Richard Margrave Ellis
John Francis Houlston
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JCT CONTROLS Ltd
Original Assignee
JCT CONTROLS Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JCT CONTROLS Ltd filed Critical JCT CONTROLS Ltd
Publication of AU2947189A publication Critical patent/AU2947189A/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Hybrid Cells (AREA)
AU29471/89A 1988-01-27 1989-01-18 Electrochemical processes Abandoned AU2947189A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB888801827A GB8801827D0 (en) 1988-01-27 1988-01-27 Improvements in electrochemical processes
GB8801827 1988-01-27

Publications (1)

Publication Number Publication Date
AU2947189A true AU2947189A (en) 1989-08-25

Family

ID=10630626

Family Applications (1)

Application Number Title Priority Date Filing Date
AU29471/89A Abandoned AU2947189A (en) 1988-01-27 1989-01-18 Electrochemical processes

Country Status (5)

Country Link
EP (1) EP0396610A1 (en)
AU (1) AU2947189A (en)
ES (1) ES2010390A6 (en)
GB (2) GB8801827D0 (en)
WO (1) WO1989007162A1 (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19539865A1 (en) * 1995-10-26 1997-04-30 Lea Ronal Gmbh Continuous electroplating system
DE19545231A1 (en) * 1995-11-21 1997-05-22 Atotech Deutschland Gmbh Process for the electrolytic deposition of metal layers
DE19547948C1 (en) * 1995-12-21 1996-11-21 Atotech Deutschland Gmbh Mfg. unipolar or bipolar pulsed current for plating esp. of circuit boards at high current
DE19633796B4 (en) * 1996-08-22 2012-02-02 Hans Höllmüller Maschinenbau GmbH Device for electroplating electronic circuit boards
DE19653681C2 (en) * 1996-12-13 2000-04-06 Atotech Deutschland Gmbh Process for the electrolytic deposition of copper layers with a uniform layer thickness and good optical and metal-physical properties and application of the process
DE19707905C1 (en) 1997-02-27 1998-02-05 Atotech Deutschland Gmbh Bipolar pulsed current supply method for electroplating
MY128333A (en) 1998-09-14 2007-01-31 Ibiden Co Ltd Printed wiring board and its manufacturing method
USRE40386E1 (en) 1998-11-06 2008-06-17 Hitachi Ltd. Chrome plated parts and chrome plating method
JP3918142B2 (en) * 1998-11-06 2007-05-23 株式会社日立製作所 Chrome-plated parts, chromium-plating method, and method of manufacturing chromium-plated parts
ATE282248T1 (en) * 1999-01-21 2004-11-15 Atotech Deutschland Gmbh METHOD FOR GALVANICALLY FORMING CONDUCTOR STRUCTURES FROM HIGH PURITY COPPER IN THE PRODUCTION OF INTEGRATED CIRCUITS
US6297155B1 (en) * 1999-05-03 2001-10-02 Motorola Inc. Method for forming a copper layer over a semiconductor wafer
EP1225972A4 (en) * 1999-09-24 2006-08-30 Semitool Inc Pattern dependent surface profile evolution of electrochemically deposited metal
GB2358194B (en) * 2000-01-17 2004-07-21 Ea Tech Ltd Electrolytic treatment
US20050061674A1 (en) 2002-09-16 2005-03-24 Yan Wang Endpoint compensation in electroprocessing
US7112270B2 (en) * 2002-09-16 2006-09-26 Applied Materials, Inc. Algorithm for real-time process control of electro-polishing
US7842169B2 (en) 2003-03-04 2010-11-30 Applied Materials, Inc. Method and apparatus for local polishing control
DE602005022650D1 (en) 2004-04-26 2010-09-16 Rohm & Haas Elect Mat Improved plating process
SE0403047D0 (en) * 2004-12-14 2004-12-14 Polymer Kompositer I Goeteborg Pulse-plating method and apparatus
EP2072644A1 (en) * 2007-12-21 2009-06-24 ETH Zürich, ETH Transfer Device and method for the electrochemical deposition of chemical compounds and alloys with controlled composition and or stoichiometry

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2524912A (en) * 1945-09-29 1950-10-10 Westinghouse Electric Corp Process of electrodepositing copper, silver, or brass
US2575712A (en) * 1945-09-29 1951-11-20 Westinghouse Electric Corp Electroplating
GB676565A (en) * 1949-07-18 1952-07-30 Du Pont Improvements in current reversal electroplating
GB779906A (en) * 1954-09-30 1957-07-24 Electro Chem Eng Improvements in or relating to electro-plating process and apparatus
GB794930A (en) * 1955-11-25 1958-05-14 Marconi Wireless Telegraph Co Improvements in or relating to methods of electro-depositing metal
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
DE2360892A1 (en) * 1972-12-14 1974-06-20 M & T Chemicals Inc AQUATIC ACID GALVANIC COPPER BATH
US4517059A (en) * 1981-07-31 1985-05-14 The Boeing Company Automated alternating polarity direct current pulse electrolytic processing of metals
US4666567A (en) * 1981-07-31 1987-05-19 The Boeing Company Automated alternating polarity pulse electrolytic processing of electrically conductive substances
US4466864A (en) * 1983-12-16 1984-08-21 At&T Technologies, Inc. Methods of and apparatus for electroplating preselected surface regions of electrical articles
US4555315A (en) * 1984-05-29 1985-11-26 Omi International Corporation High speed copper electroplating process and bath therefor

Also Published As

Publication number Publication date
GB8801827D0 (en) 1988-02-24
WO1989007162A1 (en) 1989-08-10
GB8901091D0 (en) 1989-03-15
GB2214520A (en) 1989-09-06
ES2010390A6 (en) 1989-11-01
EP0396610A1 (en) 1990-11-14

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