SE0403047D0 - Pulse-plating method and apparatus - Google Patents

Pulse-plating method and apparatus

Info

Publication number
SE0403047D0
SE0403047D0 SE0403047A SE0403047A SE0403047D0 SE 0403047 D0 SE0403047 D0 SE 0403047D0 SE 0403047 A SE0403047 A SE 0403047A SE 0403047 A SE0403047 A SE 0403047A SE 0403047 D0 SE0403047 D0 SE 0403047D0
Authority
SE
Sweden
Prior art keywords
electrical circuit
current
time period
applying
constant
Prior art date
Application number
SE0403047A
Other languages
Swedish (sv)
Inventor
Anders Remgaard
Original Assignee
Polymer Kompositer I Goeteborg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polymer Kompositer I Goeteborg filed Critical Polymer Kompositer I Goeteborg
Priority to SE0403047A priority Critical patent/SE0403047D0/en
Publication of SE0403047D0 publication Critical patent/SE0403047D0/en
Priority to EP05819032A priority patent/EP1828440B1/en
Priority to PCT/SE2005/001928 priority patent/WO2006065220A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The present invention provides a method for plating an object with a metal coating, allowing uniform coatings to be applied, even inside cavities in the object. The method comprises the steps of: bringing the object into contact with a solution comprising metal ions; bringing a counter electrode into contact with said solution comprising metal ions; connecting an electrical circuit between the object and the counter electrode; applying a constant DC current I1 to the electrical circuit for a time period t-, so as to provide a current density A-i on the surface of the object so that the object becomes plated with a metal coating; applying a second constant DC current I2 in the opposite direction as I1 to the electrical circuit for a time period t2 so as to provide a current density A2 on the surface of the object; applying a third constant DC current I3 in the same direction as Ii to the electrical circuit for a time period t3 so as to provide a current density A3 on the surface of the object. The plating steps may be repeated until the object is plated with the required profile of the metal. The invention further relates to an object plated according to the described method, and to an apparatus for carrying out the method. The invention also relates to the pulse sequence of the described method, and a set of instructions for carrying out the pulse sequence of the described method.
SE0403047A 2004-12-14 2004-12-14 Pulse-plating method and apparatus SE0403047D0 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE0403047A SE0403047D0 (en) 2004-12-14 2004-12-14 Pulse-plating method and apparatus
EP05819032A EP1828440B1 (en) 2004-12-14 2005-12-14 Pulse-plating method and apparatus
PCT/SE2005/001928 WO2006065220A1 (en) 2004-12-14 2005-12-14 Pulse-plating method and apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0403047A SE0403047D0 (en) 2004-12-14 2004-12-14 Pulse-plating method and apparatus

Publications (1)

Publication Number Publication Date
SE0403047D0 true SE0403047D0 (en) 2004-12-14

Family

ID=33563210

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0403047A SE0403047D0 (en) 2004-12-14 2004-12-14 Pulse-plating method and apparatus

Country Status (3)

Country Link
EP (1) EP1828440B1 (en)
SE (1) SE0403047D0 (en)
WO (1) WO2006065220A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT506583B9 (en) * 2008-10-23 2009-12-15 Happy Plating Gmbh ELECTROCHEMICAL COATING PROCESS

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1396436A (en) * 1973-01-08 1975-06-04 Akad Wissenschaften Ddr Process for the electrolytic production of hard-magnetic layers
US4666567A (en) * 1981-07-31 1987-05-19 The Boeing Company Automated alternating polarity pulse electrolytic processing of electrically conductive substances
NL8105150A (en) * 1981-11-13 1983-06-01 Veco Beheer Bv METHOD FOR MANUFACTURING SCREEN MATERIAL, SCREENING MATERIAL OBTAINED, AND APPARATUS FOR CARRYING OUT THE METHOD
US4608138A (en) * 1984-02-16 1986-08-26 Mitsubishi Denki Kabushiki Kaisha Electrolytic method and apparatus
GB8801827D0 (en) * 1988-01-27 1988-02-24 Jct Controls Ltd Improvements in electrochemical processes
DE19547948C1 (en) * 1995-12-21 1996-11-21 Atotech Deutschland Gmbh Mfg. unipolar or bipolar pulsed current for plating esp. of circuit boards at high current
US6071398A (en) * 1997-10-06 2000-06-06 Learonal, Inc. Programmed pulse electroplating process
JP2001267726A (en) * 2000-03-22 2001-09-28 Toyota Autom Loom Works Ltd Electrolytic plating method and device for wiring board
AU2002224434A1 (en) * 2000-10-18 2002-04-29 Tecnu, Inc. Electrochemical processing power device
JP2002235189A (en) * 2001-02-05 2002-08-23 Sansha Electric Mfg Co Ltd Power unit for feeding plating current
JP4148895B2 (en) * 2001-10-16 2008-09-10 新光電気工業株式会社 Hole copper plating method

Also Published As

Publication number Publication date
EP1828440A1 (en) 2007-09-05
WO2006065220A1 (en) 2006-06-22
EP1828440B1 (en) 2012-09-19
EP1828440A4 (en) 2011-08-03

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