JP2006519931A5 - - Google Patents

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JP2006519931A5
JP2006519931A5 JP2006504539A JP2006504539A JP2006519931A5 JP 2006519931 A5 JP2006519931 A5 JP 2006519931A5 JP 2006504539 A JP2006504539 A JP 2006504539A JP 2006504539 A JP2006504539 A JP 2006504539A JP 2006519931 A5 JP2006519931 A5 JP 2006519931A5
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Prior art keywords
circuit board
printed circuit
current pulse
pulse
reverse current
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JP2006504539A
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Japanese (ja)
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JP2006519931A (en
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Priority claimed from DE10311575A external-priority patent/DE10311575B4/en
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Publication of JP2006519931A publication Critical patent/JP2006519931A/en
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Claims (13)

高アスペクト比のホールを備えて成るプリント回路基板を電気めっきする方法であって、
ａ．０．１ｍｍより大きい直径から１．０ｍｍまでの直径を有する高アスペクト比のホールを備えて成るプリント回路基板を提供することと、
ｂ．プリント回路基板及び少なくとも一つの陽極を金属めっき電解液と接触させ、当該プリント回路基板は、プリント回路基板の表面に対する電解液流速で金属めっき電解液をプリント回路基板の表面に向かって送ることで接触させられ、プリント回路基板の表面での電解液流速は、プリント回路基板の表面に垂直な速度成分で少なくとも１ｍ／ｓであることと、
ｃ．プリント回路基板と陽極との間に電圧を印加することで、その結果、電流の流れがプリント回路基板に生じ、そこで、電流の流れが、それぞれの周期時間中に、少なくとも一つの順電流パルスと少なくとも一つの逆電流パルスとを有する最大でも６Ｈｚの周波数を有したパルス逆電流流れとなり、一周期の逆電流パルスの持続時間に対する順電流パルスの持続時間の比率は、５から７５までの範囲に設定され、加工品での順電流パルスのピーク電流密度は、３Ａ／ｄｍ２から１５Ａ／ｄｍ２までの範囲に設定され、プリント回路基板での逆電流パルスのピーク電流密度は、１０Ａ／ｄｍ２から６０Ａ／ｄｍ２までの範囲に設定されることとを、備えて成る方法。 A method of electroplating a printed circuit board comprising high aspect ratio holes, comprising:
a. Providing a printed circuit board comprising high aspect ratio holes having a diameter of greater than 0.1 mm to 1.0 mm;
b. The printed circuit board and at least one anode are contacted with a metal plating electrolyte and the printed circuit board is contacted by sending the metal plating electrolyte toward the surface of the printed circuit board at an electrolyte flow rate relative to the surface of the printed circuit board. The electrolyte flow rate at the surface of the printed circuit board is at least 1 m / s with a velocity component perpendicular to the surface of the printed circuit board;
c. Application of a voltage between the printed circuit board and the anode results in a current flow in the printed circuit board, where the current flow is at least one forward current pulse during each cycle time. The pulse reverse current flow has a frequency of at most 6 Hz with at least one reverse current pulse, and the ratio of the duration of the forward current pulse to the duration of one cycle of the reverse current pulse is in the range of 5 to 75 The peak current density of the forward current pulse in the processed product is set in a range from 3 A / dm 2 to 15 A / dm 2, and the peak current density of the reverse current pulse in the printed circuit board is 10 A / dm 2. To 60 A / dm 2 . 一周期の順電流パルスの持続時間を少なくとも１００ｍｓに設定することを備えて成る、請求項１に記載の方法。   The method of claim 1, comprising setting the duration of a period of forward current pulses to at least 100 ms. 一周期の逆電流パルスの持続時間を少なくとも０．５ｍｓに設定することを備えて成る、請求項１〜２のいずれか一項に記載の方法。   3. A method according to any one of claims 1-2, comprising setting the duration of one period of reverse current pulses to at least 0.5 ms. ａ．第一電圧をプリント回路基板の第一側面と少なくとも一つの第一陽極の間に印加し、その結果、各周期時間に少なくとも一つの第一順電流パルスと少なくとも一つの第一逆電流パルスの流れを有する第一パルス逆電流の流れがプリント回路基板の第一側面に生じることと、
ｂ．第二電圧をプリント回路基板の第二側面と少なくとも一つの第二陽極の間に印加し、その結果、各周期時間に少なくとも一つの第二順電流パルスと少なくとも一つの第二逆電流パルスの流れを有する第二パルス逆電流の流れがプリント回路基板の第二側面に生じることを備えて成る、請求項１〜３のいずれか一項に記載の方法。 a. A first voltage is applied between the first side of the printed circuit board and the at least one first anode, so that at least one first forward current pulse and at least one first reverse current pulse flow in each cycle time. A flow of a first pulse reverse current having occurs on the first side of the printed circuit board;
b. A second voltage is applied between the second side of the printed circuit board and at least one second anode, so that at least one second forward current pulse and at least one second reverse current pulse flow at each cycle time. 4. The method according to any one of claims 1 to 3, comprising generating a second pulsed reverse current flow having a second side of the printed circuit board. 第二順及び逆電流パルスに対して第一順及び逆電流パルスをそれぞれ相殺することを備えて成る、請求項４に記載の方法。   The method of claim 4, comprising canceling the first forward and reverse current pulses respectively with respect to the second forward and reverse current pulses. およそ１８０度で第二電流パルスに対して第一電流パルスを相殺することを備えて成る、請求項５に記載の方法。   6. The method of claim 5, comprising canceling the first current pulse with respect to the second current pulse at approximately 180 degrees. 各周期時間に、二つの順電流パルス及び、これら二つの順電流パルス間に一つのゼロ電流遮断を伴う一つの逆電流パルスを有する電流の流れが生じることを備えて成る、請求項１〜６のいずれか一項に記載の方法。   A current flow having two forward current pulses and one reverse current pulse with one zero current interruption between the two forward current pulses occurs in each cycle time. The method as described in any one of. プリント回路基板を金属めっきしているうちに、パルス逆電流の流れの少なくとも一つのパラメーターであって、一周期の逆電流パルスの持続時間に対する順電流パルスの持続時間の比率と、逆電流パルスのピーク電流密度に対する順電流パルスのピーク電流密度の比率を備えるグループから選択されたパラメーターが変化することを備えて成る、請求項１〜７のいずれか一項に記載の方法。   While the printed circuit board is metal-plated, it is at least one parameter of the pulse reverse current flow, the ratio of the duration of the forward current pulse to the duration of the reverse current pulse of one cycle, and the reverse current pulse 8. A method according to any one of the preceding claims, comprising changing a parameter selected from the group comprising the ratio of the forward current pulse peak current density to the peak current density. プリント回路基板を金属めっきしているうちに、逆電流パルスのピーク電流密度に対する順電流パルスのピーク電流密度の比率を増加させること、及び／又は、プリント回路基板を金属めっきしているうちに、一周期の逆電流パルスの持続時間に対する順電流パルスの持続時間の比率を減少させることを備えて成る、請求項８に記載の方法。   While the printed circuit board is metal plated, increasing the ratio of the forward current pulse peak current density to the reverse current pulse peak current density, and / or while the printed circuit board is metal plated, 9. The method of claim 8, comprising reducing the ratio of the duration of the forward current pulse to the duration of the reverse current pulse of one cycle. 陽極が不活性で且つ寸法安定である、請求項１〜９のいずれか一項に記載の方法。   10. A method according to any one of the preceding claims, wherein the anode is inert and dimensionally stable. 金属めっき電解液が銅めっき電解液である、請求項１〜１０のいずれか一項に記載の方法。   The method according to any one of claims 1 to 10, wherein the metal plating electrolyte is a copper plating electrolyte. 銅めっき電解液が、金属銅を銅イオンへ酸化させることの出来る少なくとも一種の化合物を含有し、付加された金属銅片が銅めっき電解液と接触させられる、請求項１１に記載の方法。   The method according to claim 11, wherein the copper plating electrolyte contains at least one compound capable of oxidizing metal copper to copper ions, and the added metal copper piece is brought into contact with the copper plating electrolyte. 金属銅を銅イオンへ酸化させることの出来る化合物が鉄化合物である、請求項１２に記載の方法。   The method of Claim 12 that the compound which can oxidize metallic copper to a copper ion is an iron compound.
JP2006504539A 2003-03-10 2004-03-04 Method of electroplating processed products having high aspect ratio holes Ceased JP2006519931A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10311575A DE10311575B4 (en) 2003-03-10 2003-03-10 Process for the electrolytic metallization of workpieces with high aspect ratio holes
PCT/EP2004/002208 WO2004081262A1 (en) 2003-03-10 2004-02-04 Method of electroplating a workpiece having high-aspect ratio holes

Publications (2)

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JP2006519931A JP2006519931A (en) 2006-08-31
JP2006519931A5 true JP2006519931A5 (en) 2007-05-24

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US (1) US20060151328A1 (en)
EP (1) EP1601822A1 (en)
JP (1) JP2006519931A (en)
KR (1) KR20050105280A (en)
DE (1) DE10311575B4 (en)
TW (1) TW200502443A (en)
WO (1) WO2004081262A1 (en)

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