WO2004081262A8 - Method of electroplating a workpiece having high-aspect ratio holes - Google Patents

Method of electroplating a workpiece having high-aspect ratio holes

Info

Publication number
WO2004081262A8
WO2004081262A8 PCT/EP2004/002208 EP2004002208W WO2004081262A8 WO 2004081262 A8 WO2004081262 A8 WO 2004081262A8 EP 2004002208 W EP2004002208 W EP 2004002208W WO 2004081262 A8 WO2004081262 A8 WO 2004081262A8
Authority
WO
WIPO (PCT)
Prior art keywords
workpiece
aspect ratio
electroplating
ratio holes
current flow
Prior art date
Application number
PCT/EP2004/002208
Other languages
French (fr)
Other versions
WO2004081262A1 (en
Inventor
Bert Reents
Tafadzwa Magaya
Original Assignee
Atotech Deutschland Gmbh
Bert Reents
Tafadzwa Magaya
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh, Bert Reents, Tafadzwa Magaya filed Critical Atotech Deutschland Gmbh
Priority to EP04707942A priority Critical patent/EP1601822A1/en
Priority to US10/544,252 priority patent/US20060151328A1/en
Priority to JP2006504539A priority patent/JP2006519931A/en
Publication of WO2004081262A1 publication Critical patent/WO2004081262A1/en
Publication of WO2004081262A8 publication Critical patent/WO2004081262A8/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1492—Periodical treatments, e.g. pulse plating of through-holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Abstract

In order to electroplate workpieces comprising high-aspect ratio holes a method is disclosed comprising the steps bringing the workpiece and at least one anode into contact with a metal plating electrolyte, and applying a voltage between the workpiece and the anodes, to the effect that a current flow is provided to the workpiece. The current flow is a pulse reverse current flow having a frequency of at most about 6 Hertz. According to the frequency each cycle time comprises at least one forward current pulse and at least one reverse current pulse.
PCT/EP2004/002208 2003-03-10 2004-02-04 Method of electroplating a workpiece having high-aspect ratio holes WO2004081262A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP04707942A EP1601822A1 (en) 2003-03-10 2004-02-04 Method of electroplating a workpiece having high-aspect ratio holes
US10/544,252 US20060151328A1 (en) 2003-03-10 2004-02-04 Method of electroplating a workpiece having high-aspect ratio holes
JP2006504539A JP2006519931A (en) 2003-03-10 2004-03-04 Method of electroplating processed products having high aspect ratio holes

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10311575A DE10311575B4 (en) 2003-03-10 2003-03-10 Process for the electrolytic metallization of workpieces with high aspect ratio holes
DE10311575.7 2003-03-10

Publications (2)

Publication Number Publication Date
WO2004081262A1 WO2004081262A1 (en) 2004-09-23
WO2004081262A8 true WO2004081262A8 (en) 2004-12-16

Family

ID=32892263

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2004/002208 WO2004081262A1 (en) 2003-03-10 2004-02-04 Method of electroplating a workpiece having high-aspect ratio holes

Country Status (7)

Country Link
US (1) US20060151328A1 (en)
EP (1) EP1601822A1 (en)
JP (1) JP2006519931A (en)
KR (1) KR20050105280A (en)
DE (1) DE10311575B4 (en)
TW (1) TW200502443A (en)
WO (1) WO2004081262A1 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7947161B2 (en) * 2004-03-19 2011-05-24 Faraday Technology, Inc. Method of operating an electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes
US7553401B2 (en) * 2004-03-19 2009-06-30 Faraday Technology, Inc. Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating
DE102004045451B4 (en) 2004-09-20 2007-05-03 Atotech Deutschland Gmbh Galvanic process for filling through-holes with metals, in particular printed circuit boards with copper
US20070063521A1 (en) * 2004-12-03 2007-03-22 Lancashire Christopher L Method and apparatus for plating automotive bumpers
EP2000013B1 (en) * 2006-03-30 2010-10-13 ATOTECH Deutschland GmbH Electrolytic method for filling holes and cavities with metals
US8062496B2 (en) * 2008-04-18 2011-11-22 Integran Technologies Inc. Electroplating method and apparatus
JP5425440B2 (en) * 2008-10-20 2014-02-26 株式会社Ｊｃｕ Whisker suppression method in copper plating
US20100206737A1 (en) * 2009-02-17 2010-08-19 Preisser Robert F Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv)
JP5504147B2 (en) 2010-12-21 2014-05-28 株式会社荏原製作所 Electroplating method
US9816193B2 (en) 2011-01-07 2017-11-14 Novellus Systems, Inc. Configuration and method of operation of an electrodeposition system for improved process stability and performance
ES2644268T3 (en) 2011-01-26 2017-11-28 Macdermid Enthone Inc. Process for filling contact grooves in microelectronics
CN103179806B (en) * 2011-12-21 2019-05-28 奥特斯有限公司 The method of combined through-hole plating and hole filling
US9816196B2 (en) 2012-04-27 2017-11-14 Novellus Systems, Inc. Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte
US9435048B2 (en) * 2013-02-27 2016-09-06 Taiwan Semiconductor Manufacturing Co., Ltd. Layer by layer electro chemical plating (ECP) process
DE102013021586A1 (en) * 2013-12-19 2015-06-25 Ludy Galvanosysteme Gmbh Method and device for the electrochemical treatment of flat items to be treated
US10154598B2 (en) 2014-10-13 2018-12-11 Rohm And Haas Electronic Materials Llc Filling through-holes
EP3029178A1 (en) 2014-12-05 2016-06-08 ATOTECH Deutschland GmbH Method and apparatus for electroplating a metal onto a substrate
SG11202106509UA (en) * 2018-12-28 2021-07-29 Acm Res Shanghai Inc Plating apparatus and plating method
CN110699725A (en) * 2019-11-21 2020-01-17 上海江南轧辊有限公司 In-liquid discharge deposition system and use method thereof
WO2021245766A1 (en) * 2020-06-02 2021-12-09 奥野製薬工業株式会社 Intermittent electroplating method
CN114554727A (en) * 2022-03-31 2022-05-27 生益电子股份有限公司 Electroplating method for realizing high-aspect-ratio through blind hole and PCB

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH629542A5 (en) * 1976-09-01 1982-04-30 Inoue Japax Res METHOD AND DEVICE FOR GALVANIC MATERIAL DEPOSITION.
DE4134632C1 (en) * 1991-10-19 1993-04-01 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
DE4225961C5 (en) * 1992-08-06 2011-01-27 Atotech Deutschland Gmbh Apparatus for electroplating, in particular copper plating, flat plate or arched objects
DE4344387C2 (en) * 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Process for the electrolytic deposition of copper and arrangement for carrying out the process
DE19547948C1 (en) * 1995-12-21 1996-11-21 Atotech Deutschland Gmbh Mfg. unipolar or bipolar pulsed current for plating esp. of circuit boards at high current
DE19717512C3 (en) * 1997-04-25 2003-06-18 Atotech Deutschland Gmbh Device for electroplating circuit boards under constant conditions in continuous systems
US6071398A (en) * 1997-10-06 2000-06-06 Learonal, Inc. Programmed pulse electroplating process
US6210555B1 (en) * 1999-01-29 2001-04-03 Faraday Technology Marketing Group, Llc Electrodeposition of metals in small recesses for manufacture of high density interconnects using reverse pulse plating
DE19915146C1 (en) * 1999-01-21 2000-07-06 Atotech Deutschland Gmbh Production of highly pure copper wiring trace on semiconductor wafer for integrated circuit by applying metal base coat, plating and structurization uses dimensionally-stable insoluble counter-electrode in electroplating
US6444110B2 (en) * 1999-05-17 2002-09-03 Shipley Company, L.L.C. Electrolytic copper plating method
JP2001152386A (en) * 1999-07-12 2001-06-05 Applied Materials Inc Electrochemical deposition method and system using electric pulse modulation for high aspect ratio structure
US20040045832A1 (en) * 1999-10-14 2004-03-11 Nicholas Martyak Electrolytic copper plating solutions
US6652727B2 (en) * 1999-10-15 2003-11-25 Faraday Technology Marketing Group, Llc Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes
US6881318B2 (en) * 2001-07-26 2005-04-19 Applied Materials, Inc. Dynamic pulse plating for high aspect ratio features

Also Published As

Publication number Publication date
DE10311575B4 (en) 2007-03-22
WO2004081262A1 (en) 2004-09-23
JP2006519931A (en) 2006-08-31
TW200502443A (en) 2005-01-16
EP1601822A1 (en) 2005-12-07
DE10311575A1 (en) 2004-09-23
KR20050105280A (en) 2005-11-03
US20060151328A1 (en) 2006-07-13

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