GB8901091D0 - Electrochemical processes - Google Patents
Electrochemical processesInfo
- Publication number
- GB8901091D0 GB8901091D0 GB898901091A GB8901091A GB8901091D0 GB 8901091 D0 GB8901091 D0 GB 8901091D0 GB 898901091 A GB898901091 A GB 898901091A GB 8901091 A GB8901091 A GB 8901091A GB 8901091 D0 GB8901091 D0 GB 8901091D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- electrochemical processes
- electrochemical
- processes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/623—Porosity of the layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Hybrid Cells (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB888801827A GB8801827D0 (en) | 1988-01-27 | 1988-01-27 | Improvements in electrochemical processes |
Publications (2)
Publication Number | Publication Date |
---|---|
GB8901091D0 true GB8901091D0 (en) | 1989-03-15 |
GB2214520A GB2214520A (en) | 1989-09-06 |
Family
ID=10630626
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB888801827A Pending GB8801827D0 (en) | 1988-01-27 | 1988-01-27 | Improvements in electrochemical processes |
GB8901091A Withdrawn GB2214520A (en) | 1988-01-27 | 1989-01-18 | Electrochemical processes using independently controlled voltages in alternation |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB888801827A Pending GB8801827D0 (en) | 1988-01-27 | 1988-01-27 | Improvements in electrochemical processes |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0396610A1 (en) |
AU (1) | AU2947189A (en) |
ES (1) | ES2010390A6 (en) |
GB (2) | GB8801827D0 (en) |
WO (1) | WO1989007162A1 (en) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19539865A1 (en) * | 1995-10-26 | 1997-04-30 | Lea Ronal Gmbh | Continuous electroplating system |
DE19545231A1 (en) * | 1995-11-21 | 1997-05-22 | Atotech Deutschland Gmbh | Process for the electrolytic deposition of metal layers |
DE19547948C1 (en) * | 1995-12-21 | 1996-11-21 | Atotech Deutschland Gmbh | Mfg. unipolar or bipolar pulsed current for plating esp. of circuit boards at high current |
DE19633796B4 (en) * | 1996-08-22 | 2012-02-02 | Hans Höllmüller Maschinenbau GmbH | Device for electroplating electronic circuit boards |
DE19653681C2 (en) * | 1996-12-13 | 2000-04-06 | Atotech Deutschland Gmbh | Process for the electrolytic deposition of copper layers with a uniform layer thickness and good optical and metal-physical properties and application of the process |
DE19707905C1 (en) | 1997-02-27 | 1998-02-05 | Atotech Deutschland Gmbh | Bipolar pulsed current supply method for electroplating |
MY128333A (en) | 1998-09-14 | 2007-01-31 | Ibiden Co Ltd | Printed wiring board and its manufacturing method |
USRE40386E1 (en) | 1998-11-06 | 2008-06-17 | Hitachi Ltd. | Chrome plated parts and chrome plating method |
JP3918142B2 (en) * | 1998-11-06 | 2007-05-23 | 株式会社日立製作所 | Chrome-plated parts, chromium-plating method, and method of manufacturing chromium-plated parts |
JP3374130B2 (en) * | 1999-01-21 | 2003-02-04 | アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング | Method for electrolytically forming high-purity copper conductor structures in integrated circuit fabrication |
US6297155B1 (en) * | 1999-05-03 | 2001-10-02 | Motorola Inc. | Method for forming a copper layer over a semiconductor wafer |
EP1225972A4 (en) * | 1999-09-24 | 2006-08-30 | Semitool Inc | Pattern dependent surface profile evolution of electrochemically deposited metal |
GB2358194B (en) * | 2000-01-17 | 2004-07-21 | Ea Tech Ltd | Electrolytic treatment |
US20050061674A1 (en) | 2002-09-16 | 2005-03-24 | Yan Wang | Endpoint compensation in electroprocessing |
US7112270B2 (en) * | 2002-09-16 | 2006-09-26 | Applied Materials, Inc. | Algorithm for real-time process control of electro-polishing |
US7842169B2 (en) | 2003-03-04 | 2010-11-30 | Applied Materials, Inc. | Method and apparatus for local polishing control |
DE602005022650D1 (en) | 2004-04-26 | 2010-09-16 | Rohm & Haas Elect Mat | Improved plating process |
SE0403047D0 (en) * | 2004-12-14 | 2004-12-14 | Polymer Kompositer I Goeteborg | Pulse-plating method and apparatus |
EP2072644A1 (en) * | 2007-12-21 | 2009-06-24 | ETH Zürich, ETH Transfer | Device and method for the electrochemical deposition of chemical compounds and alloys with controlled composition and or stoichiometry |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2524912A (en) * | 1945-09-29 | 1950-10-10 | Westinghouse Electric Corp | Process of electrodepositing copper, silver, or brass |
US2575712A (en) * | 1945-09-29 | 1951-11-20 | Westinghouse Electric Corp | Electroplating |
GB676565A (en) * | 1949-07-18 | 1952-07-30 | Du Pont | Improvements in current reversal electroplating |
GB779906A (en) * | 1954-09-30 | 1957-07-24 | Electro Chem Eng | Improvements in or relating to electro-plating process and apparatus |
GB794930A (en) * | 1955-11-25 | 1958-05-14 | Marconi Wireless Telegraph Co | Improvements in or relating to methods of electro-depositing metal |
US3328273A (en) * | 1966-08-15 | 1967-06-27 | Udylite Corp | Electro-deposition of copper from acidic baths |
ZA739310B (en) * | 1972-12-14 | 1974-11-27 | M & T Chemicals Inc | Electrode position of copper |
US4666567A (en) * | 1981-07-31 | 1987-05-19 | The Boeing Company | Automated alternating polarity pulse electrolytic processing of electrically conductive substances |
US4517059A (en) * | 1981-07-31 | 1985-05-14 | The Boeing Company | Automated alternating polarity direct current pulse electrolytic processing of metals |
US4466864A (en) * | 1983-12-16 | 1984-08-21 | At&T Technologies, Inc. | Methods of and apparatus for electroplating preselected surface regions of electrical articles |
US4555315A (en) * | 1984-05-29 | 1985-11-26 | Omi International Corporation | High speed copper electroplating process and bath therefor |
-
1988
- 1988-01-27 GB GB888801827A patent/GB8801827D0/en active Pending
-
1989
- 1989-01-18 AU AU29471/89A patent/AU2947189A/en not_active Abandoned
- 1989-01-18 EP EP89901720A patent/EP0396610A1/en not_active Withdrawn
- 1989-01-18 GB GB8901091A patent/GB2214520A/en not_active Withdrawn
- 1989-01-18 WO PCT/GB1989/000042 patent/WO1989007162A1/en not_active Application Discontinuation
- 1989-01-26 ES ES8900270A patent/ES2010390A6/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
AU2947189A (en) | 1989-08-25 |
EP0396610A1 (en) | 1990-11-14 |
WO1989007162A1 (en) | 1989-08-10 |
GB2214520A (en) | 1989-09-06 |
ES2010390A6 (en) | 1989-11-01 |
GB8801827D0 (en) | 1988-02-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |