ES2139388T3 - Procedimientos y circuito para la generacion de impulsos de corriente para la precipitacion electrolitica de metales. - Google Patents
Procedimientos y circuito para la generacion de impulsos de corriente para la precipitacion electrolitica de metales.Info
- Publication number
- ES2139388T3 ES2139388T3 ES96934478T ES96934478T ES2139388T3 ES 2139388 T3 ES2139388 T3 ES 2139388T3 ES 96934478 T ES96934478 T ES 96934478T ES 96934478 T ES96934478 T ES 96934478T ES 2139388 T3 ES2139388 T3 ES 2139388T3
- Authority
- ES
- Spain
- Prior art keywords
- current
- electroplating
- pct
- pulse
- pulses
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Metals (AREA)
- Ac-Ac Conversion (AREA)
- Physical Vapour Deposition (AREA)
Abstract
LA INVENCION SE REFIERE A UN PROCEDIMIENTO PARA LA GENERACION DE CORRIENTES PULSIFORMES UNIPOLARES O BIPOLARES CORTAS QUE SE REPITEN CICLICAMENTE IG, IE, PARA LA GALVANIZACION, ASI COMO UNA CIRCUITERIA PARA LA GALVANIZACION CON LA QUE SE PUEDEN GENERAR DICHAS CORRIENTES PULSIFORMES, I G, I E . DICHOS PROCEDIMIENTOS DE GALVANIZACION SE CONOCEN COMO PROCEDIMIENTOS DE DEPOSICION POR IMPULSOS. SEGUN LA INVENCION SE CONECTA EN SERIE LA BOBINA SECUNDARIA (6) DE UN TRANSFORMADOR DE CORRIENTE (1) AL CIRCUITO DE CORRIENTE CONTINUA DE GALVANIZACION (5), COMPUESTO DE UNA FUENTE DE CORRIENTE CONTINUA PARA EL BAÑO (2) Y UNA RESISTENCIA DEL BAÑO RB , QUE ESTA CONSTITUIDA POR UNA CELULA DE GALVANIZACION (4). LA BOBINA PRIMARIA (7) DEL TRANSFORMADOR TIENE UN NUMERO DE ESPIRAS MAYOR QUE LA BOBINA SECUNDARIA. LA BOBINA PRIMARIA SE DIRIGE CON PULSOS DE ALTO VOLTAJE Y COMPARATIVAMENTE DE PEQUEÑA POTENCIA. LA ELEVADA CORRIENTE PULSIFORME EN EL LADO SECUNDARIO COMPENSA TEMPORALMENTE LA CORRIENTE CONTINUA DE GALVANIZACION. LA COMPENSACION PUEDE SER UN MULTIPLO DE LA CORRIENTE DE GALVANIZACION, DE FORMA QUE LOS PULSOS DE DESMETALIZACION SE ORIGINAN CON UNA MAYOR AMPLITUD. EL CONDENSADOR (10) PRODUCE LA CORRIENTE DE COMPENSACION MEDIANTE CARGA Y DESCARGA. GRACIAS A LA INVENCION SE EVITA UTILIZAR DURANTE LA ELECTRODEPOSICION POR IMPULSOS LOS CONOCIDOS DISYUNTORES DE SOBRECORRIENTE ELECTRONICA QUE RESULTAN CAROS DEBIDO A LAS GRANDES PERDIDAS DE CORRIENTE.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19547948A DE19547948C1 (de) | 1995-12-21 | 1995-12-21 | Verfahren und Schaltungsanordnung zur Erzeugung von Strompulsen zur elektrolytischen Metallabscheidung |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2139388T3 true ES2139388T3 (es) | 2000-02-01 |
Family
ID=7780889
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES96934478T Expired - Lifetime ES2139388T3 (es) | 1995-12-21 | 1996-09-27 | Procedimientos y circuito para la generacion de impulsos de corriente para la precipitacion electrolitica de metales. |
Country Status (13)
Country | Link |
---|---|
US (1) | US6132584A (es) |
EP (1) | EP0868545B1 (es) |
JP (1) | JP4028892B2 (es) |
KR (1) | KR100465545B1 (es) |
CN (1) | CN1093337C (es) |
AT (1) | ATE186081T1 (es) |
BR (1) | BR9612163A (es) |
CA (1) | CA2241055A1 (es) |
CZ (1) | CZ290052B6 (es) |
DE (2) | DE19547948C1 (es) |
ES (1) | ES2139388T3 (es) |
HK (1) | HK1017392A1 (es) |
WO (1) | WO1997023665A1 (es) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6174425B1 (en) | 1997-05-14 | 2001-01-16 | Motorola, Inc. | Process for depositing a layer of material over a substrate |
US6793796B2 (en) | 1998-10-26 | 2004-09-21 | Novellus Systems, Inc. | Electroplating process for avoiding defects in metal features of integrated circuit devices |
US6946065B1 (en) * | 1998-10-26 | 2005-09-20 | Novellus Systems, Inc. | Process for electroplating metal into microscopic recessed features |
US6344419B1 (en) | 1999-12-03 | 2002-02-05 | Applied Materials, Inc. | Pulsed-mode RF bias for sidewall coverage improvement |
US6231743B1 (en) | 2000-01-03 | 2001-05-15 | Motorola, Inc. | Method for forming a semiconductor device |
KR20020078307A (ko) | 2001-04-09 | 2002-10-18 | 주식회사 하이닉스반도체 | 반도체 소자의 커패시터 제조 방법 |
DE10259365A1 (de) | 2002-04-08 | 2003-10-30 | Siemens Ag | Vorrichtung und Verfahren zur Entfernung von Oberflächenbereichen eines Bauteils |
NL1022786C2 (nl) * | 2003-02-26 | 2004-08-30 | Tendris Solutions Bv | Omzetschakeling, systeem en werkwijze voor het uitvoeren van een elektrochemisch proces. |
DE10311575B4 (de) * | 2003-03-10 | 2007-03-22 | Atotech Deutschland Gmbh | Verfahren zum elektrolytischen Metallisieren von Werkstücken mit Bohrungen mit einem hohen Aspektverhältnis |
US20070068821A1 (en) * | 2005-09-27 | 2007-03-29 | Takahisa Hirasawa | Method of manufacturing chromium plated article and chromium plating apparatus |
US20050157475A1 (en) * | 2004-01-15 | 2005-07-21 | Endicott Interconnect Technologies, Inc. | Method of making printed circuit board with electroplated conductive through holes and board resulting therefrom |
DE102004045451B4 (de) * | 2004-09-20 | 2007-05-03 | Atotech Deutschland Gmbh | Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer |
SE0403047D0 (sv) * | 2004-12-14 | 2004-12-14 | Polymer Kompositer I Goeteborg | Pulse-plating method and apparatus |
PL377451A1 (pl) * | 2005-10-05 | 2007-04-16 | Instytut Wysokich Ciśnień PAN | Sposób prowadzenia reakcji i reaktor chemiczny |
EP1890004A1 (de) | 2006-08-08 | 2008-02-20 | Siemens Aktiengesellschaft | Verfahren zum Herstellen einer Nutzschicht aus wiederverwendetem Schichtmaterial |
DE102006044416A1 (de) * | 2006-09-18 | 2008-03-27 | Siemens Ag | Verfahren zum elektrochemischen Be- oder Entschichten von Bauteilen |
US20080271995A1 (en) * | 2007-05-03 | 2008-11-06 | Sergey Savastiouk | Agitation of electrolytic solution in electrodeposition |
US8603864B2 (en) | 2008-09-11 | 2013-12-10 | Infineon Technologies Ag | Method of fabricating a semiconductor device |
US10011917B2 (en) | 2008-11-07 | 2018-07-03 | Lam Research Corporation | Control of current density in an electroplating apparatus |
US11225727B2 (en) | 2008-11-07 | 2022-01-18 | Lam Research Corporation | Control of current density in an electroplating apparatus |
US9011706B2 (en) * | 2008-12-16 | 2015-04-21 | City University Of Hong Kong | Method of making foraminous microstructures |
US9385035B2 (en) | 2010-05-24 | 2016-07-05 | Novellus Systems, Inc. | Current ramping and current pulsing entry of substrates for electroplating |
JP6161863B2 (ja) * | 2010-12-28 | 2017-07-12 | 株式会社荏原製作所 | 電気めっき方法 |
US9028666B2 (en) | 2011-05-17 | 2015-05-12 | Novellus Systems, Inc. | Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath |
CN102277603A (zh) * | 2011-08-03 | 2011-12-14 | 深圳大学 | 一种感应热/电沉积制备涂层或薄膜的装置及方法 |
MX361776B (es) * | 2013-11-19 | 2018-12-17 | Hecker Electronica Potencia Y Procesos S A | Proceso de superposicion de corriente alterna sobre la corriente continua en procesos electroliticos. |
EP3029178A1 (en) * | 2014-12-05 | 2016-06-08 | ATOTECH Deutschland GmbH | Method and apparatus for electroplating a metal onto a substrate |
SG11202005062SA (en) | 2016-07-13 | 2020-06-29 | Alligant Scientific Llc | Electrochemical methods, devices and compositions |
RU2722754C1 (ru) * | 2019-04-23 | 2020-06-03 | Общество с ограниченной ответственностью "Керамик тех" (ООО "Керамик тех") | Устройство для формирования электрохимическим оксидированием покрытий на вентильных металлах или сплавах |
CN114836797B (zh) * | 2022-05-12 | 2023-08-29 | 广州市慧科高新材料科技有限公司 | 一种基于脉冲搭桥的通孔填孔电镀工艺 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3616434A (en) * | 1968-04-18 | 1971-10-26 | Novachrome Inc | Apparatus with power source for plating |
US3959088A (en) * | 1975-03-19 | 1976-05-25 | The United States Of America As Represented By The Secretary Of The Army | Method and apparatus for generating high amperage pulses from an A-C power source |
CH629542A5 (de) * | 1976-09-01 | 1982-04-30 | Inoue Japax Res | Verfahren und vorrichtung zur galvanischen materialablagerung. |
US4208254A (en) * | 1976-09-22 | 1980-06-17 | Satoshi Ichioka | Method of plating an iron-cobalt alloy on a substrate |
US4517059A (en) * | 1981-07-31 | 1985-05-14 | The Boeing Company | Automated alternating polarity direct current pulse electrolytic processing of metals |
GB8801827D0 (en) * | 1988-01-27 | 1988-02-24 | Jct Controls Ltd | Improvements in electrochemical processes |
DE4005346A1 (de) * | 1990-02-20 | 1991-08-22 | Siemens Ag | Verfahren zur erzeugung von hochfrequenten strompulsen mit steilen pulsflanken in galvanikanlagen und versorgungsschaltung zur durchfuehrung des verfahrens |
-
1995
- 1995-12-21 DE DE19547948A patent/DE19547948C1/de not_active Expired - Fee Related
-
1996
- 1996-09-27 CN CN96199166A patent/CN1093337C/zh not_active Expired - Fee Related
- 1996-09-27 CZ CZ19981700A patent/CZ290052B6/cs not_active IP Right Cessation
- 1996-09-27 BR BR9612163A patent/BR9612163A/pt not_active Application Discontinuation
- 1996-09-27 CA CA002241055A patent/CA2241055A1/en not_active Abandoned
- 1996-09-27 WO PCT/EP1996/004232 patent/WO1997023665A1/de active IP Right Grant
- 1996-09-27 AT AT96934478T patent/ATE186081T1/de not_active IP Right Cessation
- 1996-09-27 KR KR10-1998-0704072A patent/KR100465545B1/ko not_active IP Right Cessation
- 1996-09-27 ES ES96934478T patent/ES2139388T3/es not_active Expired - Lifetime
- 1996-09-27 EP EP96934478A patent/EP0868545B1/de not_active Expired - Lifetime
- 1996-09-27 US US09/091,136 patent/US6132584A/en not_active Expired - Fee Related
- 1996-09-27 DE DE59603510T patent/DE59603510D1/de not_active Expired - Fee Related
- 1996-09-27 JP JP52324197A patent/JP4028892B2/ja not_active Expired - Fee Related
-
1999
- 1999-05-25 HK HK99102336A patent/HK1017392A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
BR9612163A (pt) | 1999-07-13 |
DE59603510D1 (de) | 1999-12-02 |
US6132584A (en) | 2000-10-17 |
JP4028892B2 (ja) | 2007-12-26 |
WO1997023665A1 (de) | 1997-07-03 |
ATE186081T1 (de) | 1999-11-15 |
JP2000505145A (ja) | 2000-04-25 |
EP0868545B1 (de) | 1999-10-27 |
KR100465545B1 (ko) | 2005-02-28 |
CZ290052B6 (cs) | 2002-05-15 |
CN1093337C (zh) | 2002-10-23 |
EP0868545A1 (de) | 1998-10-07 |
CZ170098A3 (cs) | 1998-10-14 |
KR19990071793A (ko) | 1999-09-27 |
CA2241055A1 (en) | 1997-07-03 |
DE19547948C1 (de) | 1996-11-21 |
HK1017392A1 (en) | 1999-11-19 |
CN1205745A (zh) | 1999-01-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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