JPS556468A - Electroplating method of metal wire - Google Patents
Electroplating method of metal wireInfo
- Publication number
- JPS556468A JPS556468A JP7837178A JP7837178A JPS556468A JP S556468 A JPS556468 A JP S556468A JP 7837178 A JP7837178 A JP 7837178A JP 7837178 A JP7837178 A JP 7837178A JP S556468 A JPS556468 A JP S556468A
- Authority
- JP
- Japan
- Prior art keywords
- lines
- plating
- current
- wire
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To make possible the use of low capacity small rectifiers by providing a wire accumulating part for the wire to be plated between plating lines, series-connecting all the plating lines to a DC power source and applying voltages to all the plating lines at nearly equal potential differences.
CONSTITUTION: Loads of all lines A1, A2 ... are nearly constant and the voltage of a DC power source D is dividedly applied at a fixed potential difference E to each line. Hence, the potential difference between the wires to be plated is E and the current flowing in the wire to be plated of the wire accumulating part B is E/R because the electric resistance of the accumulated wire to be plated is R. If this electric resistance R is considerably increased, the current E/R becomes substantially zero. If the number of electrolytic cells per line is made n and the plating currrent required per unit of electrolytic cell I, then the plating current required for 1 line is nI and since all the lines are series-connected, the plating current to be supplied to all the lines is nI. The current capacity of the rectifier for obtaining DC may be made to the low capacity corresponding to the current per line.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7837178A JPS556468A (en) | 1978-06-27 | 1978-06-27 | Electroplating method of metal wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7837178A JPS556468A (en) | 1978-06-27 | 1978-06-27 | Electroplating method of metal wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS556468A true JPS556468A (en) | 1980-01-17 |
Family
ID=13660142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7837178A Pending JPS556468A (en) | 1978-06-27 | 1978-06-27 | Electroplating method of metal wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS556468A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04108940U (en) * | 1991-03-05 | 1992-09-21 | 三菱マテリアル株式会社 | Work sending device |
-
1978
- 1978-06-27 JP JP7837178A patent/JPS556468A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04108940U (en) * | 1991-03-05 | 1992-09-21 | 三菱マテリアル株式会社 | Work sending device |
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