DE19530856A1 - Vorrichtung zum Laden und Entladen einer Zwischenmaske - Google Patents

Vorrichtung zum Laden und Entladen einer Zwischenmaske

Info

Publication number
DE19530856A1
DE19530856A1 DE19530856A DE19530856A DE19530856A1 DE 19530856 A1 DE19530856 A1 DE 19530856A1 DE 19530856 A DE19530856 A DE 19530856A DE 19530856 A DE19530856 A DE 19530856A DE 19530856 A1 DE19530856 A1 DE 19530856A1
Authority
DE
Germany
Prior art keywords
cassette
intermediate mask
sensor
opening
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19530856A
Other languages
German (de)
English (en)
Inventor
Won-Ho Jee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hanwha Aerospace Co Ltd
Original Assignee
Samsung Aerospace Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Aerospace Industries Ltd filed Critical Samsung Aerospace Industries Ltd
Publication of DE19530856A1 publication Critical patent/DE19530856A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Library & Information Science (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Warehouses Or Storage Devices (AREA)
DE19530856A 1994-08-25 1995-08-22 Vorrichtung zum Laden und Entladen einer Zwischenmaske Withdrawn DE19530856A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940021085A KR0144945B1 (ko) 1994-08-25 1994-08-25 레티클 검출장치

Publications (1)

Publication Number Publication Date
DE19530856A1 true DE19530856A1 (de) 1996-02-29

Family

ID=19391159

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19530856A Withdrawn DE19530856A1 (de) 1994-08-25 1995-08-22 Vorrichtung zum Laden und Entladen einer Zwischenmaske

Country Status (6)

Country Link
JP (1) JPH0878325A (ko)
KR (1) KR0144945B1 (ko)
CN (1) CN1130260A (ko)
DE (1) DE19530856A1 (ko)
FR (1) FR2723929B1 (ko)
GB (1) GB2292636B (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6142722A (en) * 1998-06-17 2000-11-07 Genmark Automation, Inc. Automated opening and closing of ultra clean storage containers
TW495802B (en) * 1999-04-13 2002-07-21 Semiconductor 300 Gmbh & Amp C Arrangement for storing objects, particularly for storing disklike objects such as wafers, flat panels or CDs
KR100620160B1 (ko) * 2002-12-30 2006-09-01 동부일렉트로닉스 주식회사 레티클 로딩장치
KR100665293B1 (ko) * 2006-01-04 2007-01-17 코리아테크노(주) 마스크 운송박스 박스커버 오프너
CN105448783A (zh) * 2015-12-28 2016-03-30 江苏创基新能源有限公司 装框件的溢胶检查装置
CN108615332A (zh) * 2016-12-13 2018-10-02 海太半导体（无锡）有限公司 贴片设备基板位置传感器感应和报警系统
JP7186225B2 (ja) * 2017-11-30 2022-12-08 チャイナ トライアンフ インターナショナル エンジニアリング カンパニー リミテッド 密閉チャンバ内での基板位置を判定する方法およびこの方法を実行する装置
CN110941145B (zh) * 2018-09-21 2021-07-30 上海微电子装备（集团）股份有限公司 一种掩膜版检测装置及方法、掩膜版库设备
CN110609451A (zh) * 2019-08-19 2019-12-24 武汉华星光电技术有限公司 一种曝光机
CN113671799A (zh) * 2020-05-15 2021-11-19 长鑫存储技术有限公司 光罩检测装置、方法、曝光机和光刻设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6276531A (ja) * 1985-09-27 1987-04-08 Canon Inc 基板収納方法
JPS6278084A (ja) * 1985-09-27 1987-04-10 キヤノン株式会社 基板収納容器
US4776462A (en) * 1985-09-27 1988-10-11 Canon Kabushiki Kaisha Container for a sheet-like article
US4999671A (en) * 1986-07-11 1991-03-12 Canon Kabushiki Kaisha Reticle conveying device
EP0452041B1 (en) * 1990-04-06 1996-11-27 Canon Kabushiki Kaisha Substrate conveying device and method of controlling the same
DE4238834A1 (en) * 1991-11-18 1993-05-19 Fusion Systems Corp Robotic semiconductor wafer transporter with vertical photodetector array - scans detectors to determine which slots are occupied by wafers illuminated from emitter on robot arm
US5225691A (en) * 1992-05-18 1993-07-06 Avalon Engineering, Inc. Semiconductor wafer cassette mapper with emitter and detector arrays for slot interrogation

Also Published As

Publication number Publication date
GB9517171D0 (en) 1995-10-25
CN1130260A (zh) 1996-09-04
FR2723929B1 (fr) 1997-07-25
KR960009089A (ko) 1996-03-22
GB2292636B (en) 1998-12-23
FR2723929A1 (fr) 1996-03-01
GB2292636A (en) 1996-02-28
JPH0878325A (ja) 1996-03-22
KR0144945B1 (ko) 1998-08-17

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Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee