CN1130260A - 标线片的装入和取出装置 - Google Patents

标线片的装入和取出装置 Download PDF

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Publication number
CN1130260A
CN1130260A CN95117126A CN95117126A CN1130260A CN 1130260 A CN1130260 A CN 1130260A CN 95117126 A CN95117126 A CN 95117126A CN 95117126 A CN95117126 A CN 95117126A CN 1130260 A CN1130260 A CN 1130260A
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CN
China
Prior art keywords
box
graticule
order
packed
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN95117126A
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English (en)
Chinese (zh)
Inventor
池元浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hanwha Aerospace Co Ltd
Original Assignee
Samsung Aerospace Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Aerospace Industries Ltd filed Critical Samsung Aerospace Industries Ltd
Publication of CN1130260A publication Critical patent/CN1130260A/zh
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70733Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/70741Handling masks outside exposure position, e.g. reticle libraries
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Library & Information Science (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
CN95117126A 1994-08-25 1995-08-25 标线片的装入和取出装置 Pending CN1130260A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR21085/94 1994-08-25
KR1019940021085A KR0144945B1 (ko) 1994-08-25 1994-08-25 레티클 검출장치

Publications (1)

Publication Number Publication Date
CN1130260A true CN1130260A (zh) 1996-09-04

Family

ID=19391159

Family Applications (1)

Application Number Title Priority Date Filing Date
CN95117126A Pending CN1130260A (zh) 1994-08-25 1995-08-25 标线片的装入和取出装置

Country Status (6)

Country Link
JP (1) JPH0878325A (ko)
KR (1) KR0144945B1 (ko)
CN (1) CN1130260A (ko)
DE (1) DE19530856A1 (ko)
FR (1) FR2723929B1 (ko)
GB (1) GB2292636B (ko)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108615332A (zh) * 2016-12-13 2018-10-02 海太半导体(无锡)有限公司 贴片设备基板位置传感器感应和报警系统
CN110609451A (zh) * 2019-08-19 2019-12-24 武汉华星光电技术有限公司 一种曝光机
CN110941145A (zh) * 2018-09-21 2020-03-31 上海微电子装备(集团)股份有限公司 一种掩膜版检测装置及方法、掩膜版库设备
WO2021227903A1 (zh) * 2020-05-15 2021-11-18 长鑫存储技术有限公司 光罩检测装置、方法、曝光机和光刻设备

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6142722A (en) * 1998-06-17 2000-11-07 Genmark Automation, Inc. Automated opening and closing of ultra clean storage containers
TW495802B (en) * 1999-04-13 2002-07-21 Semiconductor 300 Gmbh & Amp C Arrangement for storing objects, particularly for storing disklike objects such as wafers, flat panels or CDs
KR100620160B1 (ko) * 2002-12-30 2006-09-01 동부일렉트로닉스 주식회사 레티클 로딩장치
KR100665293B1 (ko) * 2006-01-04 2007-01-17 코리아테크노(주) 마스크 운송박스 박스커버 오프너
CN105448783A (zh) * 2015-12-28 2016-03-30 江苏创基新能源有限公司 装框件的溢胶检查装置
JP7186225B2 (ja) * 2017-11-30 2022-12-08 チャイナ トライアンフ インターナショナル エンジニアリング カンパニー リミテッド 密閉チャンバ内での基板位置を判定する方法およびこの方法を実行する装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4776462A (en) * 1985-09-27 1988-10-11 Canon Kabushiki Kaisha Container for a sheet-like article
JPS6276531A (ja) * 1985-09-27 1987-04-08 Canon Inc 基板収納方法
JPS6278084A (ja) * 1985-09-27 1987-04-10 キヤノン株式会社 基板収納容器
US4999671A (en) * 1986-07-11 1991-03-12 Canon Kabushiki Kaisha Reticle conveying device
DE69123279T2 (de) * 1990-04-06 1997-04-24 Canon K.K., Tokio/Tokyo Transportvorrichtung für Substrate und Verfahren zur Kontrolle
DE4238834A1 (en) * 1991-11-18 1993-05-19 Fusion Systems Corp Robotic semiconductor wafer transporter with vertical photodetector array - scans detectors to determine which slots are occupied by wafers illuminated from emitter on robot arm
US5225691A (en) * 1992-05-18 1993-07-06 Avalon Engineering, Inc. Semiconductor wafer cassette mapper with emitter and detector arrays for slot interrogation

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108615332A (zh) * 2016-12-13 2018-10-02 海太半导体(无锡)有限公司 贴片设备基板位置传感器感应和报警系统
CN110941145A (zh) * 2018-09-21 2020-03-31 上海微电子装备(集团)股份有限公司 一种掩膜版检测装置及方法、掩膜版库设备
CN110609451A (zh) * 2019-08-19 2019-12-24 武汉华星光电技术有限公司 一种曝光机
WO2021227903A1 (zh) * 2020-05-15 2021-11-18 长鑫存储技术有限公司 光罩检测装置、方法、曝光机和光刻设备

Also Published As

Publication number Publication date
GB2292636B (en) 1998-12-23
FR2723929A1 (fr) 1996-03-01
KR960009089A (ko) 1996-03-22
GB9517171D0 (en) 1995-10-25
GB2292636A (en) 1996-02-28
KR0144945B1 (ko) 1998-08-17
DE19530856A1 (de) 1996-02-29
FR2723929B1 (fr) 1997-07-25
JPH0878325A (ja) 1996-03-22

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C01 Deemed withdrawal of patent application (patent law 1993)
WD01 Invention patent application deemed withdrawn after publication