DE1940643A1 - Waessrige Loesung zur chemischen Kupferabscheidung - Google Patents

Waessrige Loesung zur chemischen Kupferabscheidung

Info

Publication number
DE1940643A1
DE1940643A1 DE19691940643 DE1940643A DE1940643A1 DE 1940643 A1 DE1940643 A1 DE 1940643A1 DE 19691940643 DE19691940643 DE 19691940643 DE 1940643 A DE1940643 A DE 1940643A DE 1940643 A1 DE1940643 A1 DE 1940643A1
Authority
DE
Germany
Prior art keywords
copper
formaldehyde
solution
ppm
salt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19691940643
Other languages
German (de)
English (en)
Inventor
Dutkewych Oleh Borys
Michael Gulla
Shipley Lucia Helene
Shipley Jun Charles Raymond
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
Shipley Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Inc filed Critical Shipley Co Inc
Publication of DE1940643A1 publication Critical patent/DE1940643A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE19691940643 1968-08-13 1969-08-09 Waessrige Loesung zur chemischen Kupferabscheidung Pending DE1940643A1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US75216668A 1968-08-13 1968-08-13
US75225068A 1968-08-13 1968-08-13
US75216568A 1968-08-13 1968-08-13

Publications (1)

Publication Number Publication Date
DE1940643A1 true DE1940643A1 (de) 1970-05-06

Family

ID=27419423

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19691940643 Pending DE1940643A1 (de) 1968-08-13 1969-08-09 Waessrige Loesung zur chemischen Kupferabscheidung

Country Status (8)

Country Link
JP (1) JPS5114453B1 (enrdf_load_stackoverflow)
BE (1) BE737368A (enrdf_load_stackoverflow)
DE (1) DE1940643A1 (enrdf_load_stackoverflow)
ES (1) ES370451A1 (enrdf_load_stackoverflow)
FR (1) FR2015590A1 (enrdf_load_stackoverflow)
GB (1) GB1283715A (enrdf_load_stackoverflow)
NL (1) NL6912126A (enrdf_load_stackoverflow)
SE (3) SE377580B (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS528343U (enrdf_load_stackoverflow) * 1975-07-01 1977-01-20
JPS57124483U (enrdf_load_stackoverflow) * 1981-01-29 1982-08-03
JPS5853573A (ja) * 1981-09-28 1983-03-30 Nissan Motor Co Ltd スペアタイヤ使用報知器
JP2001020077A (ja) * 1999-07-07 2001-01-23 Sony Corp 無電解めっき方法及び無電解めっき液

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1522048A (fr) * 1966-05-06 1968-04-19 Photocircuits Corp Dépôt non galvanique de métaux

Also Published As

Publication number Publication date
FR2015590A1 (enrdf_load_stackoverflow) 1970-04-30
SE360394B (enrdf_load_stackoverflow) 1973-09-24
DE1966580A1 (de) 1973-03-08
BE737368A (enrdf_load_stackoverflow) 1970-02-12
GB1283715A (en) 1972-08-02
NL6912126A (enrdf_load_stackoverflow) 1970-02-17
ES370451A1 (es) 1971-07-01
JPS5114453B1 (enrdf_load_stackoverflow) 1976-05-10
SE396409B (sv) 1977-09-19
DE1966580B2 (de) 1976-03-04
SE377580B (enrdf_load_stackoverflow) 1975-07-14

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Legal Events

Date Code Title Description
OHW Rejection