GB1283715A - Electroless copper plating - Google Patents
Electroless copper platingInfo
- Publication number
- GB1283715A GB1283715A GB3777969A GB3777969A GB1283715A GB 1283715 A GB1283715 A GB 1283715A GB 3777969 A GB3777969 A GB 3777969A GB 3777969 A GB3777969 A GB 3777969A GB 1283715 A GB1283715 A GB 1283715A
- Authority
- GB
- United Kingdom
- Prior art keywords
- salt
- hcho
- source
- agent
- soluble
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Abstract
1283715 Electroless Cu bath SHIPLEY CO Inc 28 July 1969 [13 Aug 1968(3)] 37779/69 Heading C7F An aqueous electroless Cu bath comprises a source of Cu<SP>++</SP>, OH<SP>-</SP>, a source of HCHO, sufficient complexing agent to render said Cu<SP>++</SP> ions soluble in alkaline solution, and at least two additives selected from (1) a formaldehyde addition agent, (2) a solution soluble salt of a Group VIII metal, (3) an organic silicon compound, and (4) a hydrogen inclusion retarding agent, excepting any combination including both (3) and (4). (1) may be an alkali metal sulphite, bisulphite or phosphite, (2) is preferably the phosphate, nitrate, acetate or a halide of Fe, Co, Ni, Os, Ir, Pt, Ru, Rh or Pd, with Fe, Ni, Pt being preferred, (3) is a silane, e.g. SiH 4 ; disilane, tetramethylsilane, Et 4 Si, tetraphenylsilane, Me 2 SiCl 2 , or a polysiloxane, and (4) may be CN<SP>-</SP> or a soluble compound of V, Mo, Nb, W, Re, As, Sb, Bi, a lanthanide or an actinide, e.g. a molybdate, tungstate, vanadate, arsenate, rhenate or water soluble salts or oxides of said elements. The solution may contain a wetting agent; the Cu salt may be a halide, nitrate, or acetate, but the sulphate is preferred; the source of HCHO is HCHO itself or paraformaldehyde; and the complexing agent may be Rochelle salt, Na salicylate or tartrate, an EDTA salt or a derivative thereof, or triethanolamine, but is preferably a hydroxyalkyl-substituted tertiary amine. In use, a plastics substrate is sensitized and activated using SnCl 2 and PdCl 2 or a colloidal formulation of SnCl 2 and precious metal chloride, and is then plated in the above bath.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US75216668A | 1968-08-13 | 1968-08-13 | |
US75225068A | 1968-08-13 | 1968-08-13 | |
US75216568A | 1968-08-13 | 1968-08-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1283715A true GB1283715A (en) | 1972-08-02 |
Family
ID=27419423
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB3777969A Expired GB1283715A (en) | 1968-08-13 | 1969-07-28 | Electroless copper plating |
Country Status (8)
Country | Link |
---|---|
JP (1) | JPS5114453B1 (en) |
BE (1) | BE737368A (en) |
DE (1) | DE1940643A1 (en) |
ES (1) | ES370451A1 (en) |
FR (1) | FR2015590A1 (en) |
GB (1) | GB1283715A (en) |
NL (1) | NL6912126A (en) |
SE (3) | SE396409B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2796084A1 (en) * | 1999-07-07 | 2001-01-12 | Sony Corp | Chemical copper plating solution for plating contact holes or interconnections in semiconductor device manufacture includes a salt of, e.g., gold, nickel, palladium, cobalt or platinum as a plating accelerator |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS528343U (en) * | 1975-07-01 | 1977-01-20 | ||
JPS57124483U (en) * | 1981-01-29 | 1982-08-03 | ||
JPS5853573A (en) * | 1981-09-28 | 1983-03-30 | Nissan Motor Co Ltd | Alarm of spare tire in use |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1522048A (en) * | 1966-05-06 | 1968-04-19 | Photocircuits Corp | Non-galvanic deposit of metals |
-
1969
- 1969-07-28 GB GB3777969A patent/GB1283715A/en not_active Expired
- 1969-08-08 NL NL6912126A patent/NL6912126A/xx unknown
- 1969-08-09 DE DE19691940643 patent/DE1940643A1/en active Pending
- 1969-08-12 SE SE455269A patent/SE396409B/en unknown
- 1969-08-12 ES ES370451A patent/ES370451A1/en not_active Expired
- 1969-08-12 BE BE737368D patent/BE737368A/xx unknown
- 1969-08-12 SE SE455372A patent/SE377580B/xx unknown
- 1969-08-12 SE SE1120369A patent/SE360394B/xx unknown
- 1969-08-12 FR FR6927779A patent/FR2015590A1/fr not_active Withdrawn
- 1969-08-13 JP JP6357969A patent/JPS5114453B1/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2796084A1 (en) * | 1999-07-07 | 2001-01-12 | Sony Corp | Chemical copper plating solution for plating contact holes or interconnections in semiconductor device manufacture includes a salt of, e.g., gold, nickel, palladium, cobalt or platinum as a plating accelerator |
NL1015624C2 (en) * | 1999-07-07 | 2001-05-30 | Sony Corp | Electroless plating method and electroless plating solution. |
US6534117B1 (en) | 1999-07-07 | 2003-03-18 | Sony Corporation | Electroless plating method and electroless plating solution |
Also Published As
Publication number | Publication date |
---|---|
BE737368A (en) | 1970-02-12 |
NL6912126A (en) | 1970-02-17 |
ES370451A1 (en) | 1971-07-01 |
SE396409B (en) | 1977-09-19 |
DE1966580A1 (en) | 1973-03-08 |
SE377580B (en) | 1975-07-14 |
JPS5114453B1 (en) | 1976-05-10 |
SE360394B (en) | 1973-09-24 |
DE1940643A1 (en) | 1970-05-06 |
FR2015590A1 (en) | 1970-04-30 |
DE1966580B2 (en) | 1976-03-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3403035A (en) | Process for stabilizing autocatalytic metal plating solutions | |
GB1482708A (en) | Catalytic treatment of non-conductors for chemical platin | |
GB1283716A (en) | Electroless copper plating | |
DE1254935B (en) | Aqueous bath for chemical deposition of boron-containing metal coatings | |
US3615732A (en) | Electroless copper plating | |
US3915716A (en) | Chemical nickel plating bath | |
US3993801A (en) | Catalytic developer | |
GB1283715A (en) | Electroless copper plating | |
ES485980A1 (en) | Process for the chemical deposition of gold by autocatalytic reduction | |
GB1194625A (en) | Boron Containing Composite Metallic Films and Plating Baths for their Electroless Deposition | |
US2766138A (en) | Processes of chemical nickel plating | |
GB1426462A (en) | Process and composition for sensitizing articles for metallization | |
US3935013A (en) | Electroless deposition of a copper-nickel alloy on an imagewise pattern of physically developable metal nuclei | |
US4142902A (en) | Electroless gold plating baths | |
US3765936A (en) | Electroless copper plate | |
GB1365172A (en) | Chemical plating composition | |
US3329522A (en) | Pyrophosphate copper strike zincating solution | |
GB994560A (en) | Deposition of palladium | |
GB1455217A (en) | Method for producing a metal film | |
US4355083A (en) | Electrolessly metallized silver coated article | |
GB1305468A (en) | ||
GB1314745A (en) | Electroless plating bath for depositing a nickel alloy layer | |
US4305997A (en) | Electrolessly metallized product of non-catalytic metal or alloy | |
GB1518301A (en) | Deposition of copper | |
GB1218850A (en) | Improvements in autocatalytic copper plating solutions |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |