SE396409B - MAKE SURE THROUGH POWER PLATING ON A SURFACE PRODUCE A FLEXIBLE, SHINY COPPER COATING AND OUTLET FOR PERFORMANCE OF THE KIT - Google Patents

MAKE SURE THROUGH POWER PLATING ON A SURFACE PRODUCE A FLEXIBLE, SHINY COPPER COATING AND OUTLET FOR PERFORMANCE OF THE KIT

Info

Publication number
SE396409B
SE396409B SE455269A SE455269A SE396409B SE 396409 B SE396409 B SE 396409B SE 455269 A SE455269 A SE 455269A SE 455269 A SE455269 A SE 455269A SE 396409 B SE396409 B SE 396409B
Authority
SE
Sweden
Prior art keywords
kit
flexible
outlet
performance
make sure
Prior art date
Application number
SE455269A
Other languages
Swedish (sv)
Inventor
Jr C R Shipley
L H Shipley
M Gulla
O B Dutkewych
Original Assignee
Shipley Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co filed Critical Shipley Co
Publication of SE396409B publication Critical patent/SE396409B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
SE455269A 1968-08-13 1969-08-12 MAKE SURE THROUGH POWER PLATING ON A SURFACE PRODUCE A FLEXIBLE, SHINY COPPER COATING AND OUTLET FOR PERFORMANCE OF THE KIT SE396409B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US75216568A 1968-08-13 1968-08-13
US75216668A 1968-08-13 1968-08-13
US75225068A 1968-08-13 1968-08-13

Publications (1)

Publication Number Publication Date
SE396409B true SE396409B (en) 1977-09-19

Family

ID=27419423

Family Applications (3)

Application Number Title Priority Date Filing Date
SE1120369A SE360394B (en) 1968-08-13 1969-08-12
SE455269A SE396409B (en) 1968-08-13 1969-08-12 MAKE SURE THROUGH POWER PLATING ON A SURFACE PRODUCE A FLEXIBLE, SHINY COPPER COATING AND OUTLET FOR PERFORMANCE OF THE KIT
SE455372A SE377580B (en) 1968-08-13 1969-08-12

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SE1120369A SE360394B (en) 1968-08-13 1969-08-12

Family Applications After (1)

Application Number Title Priority Date Filing Date
SE455372A SE377580B (en) 1968-08-13 1969-08-12

Country Status (8)

Country Link
JP (1) JPS5114453B1 (en)
BE (1) BE737368A (en)
DE (1) DE1940643A1 (en)
ES (1) ES370451A1 (en)
FR (1) FR2015590A1 (en)
GB (1) GB1283715A (en)
NL (1) NL6912126A (en)
SE (3) SE360394B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS528343U (en) * 1975-07-01 1977-01-20
JPS57124483U (en) * 1981-01-29 1982-08-03
JPS5853573A (en) * 1981-09-28 1983-03-30 Nissan Motor Co Ltd Spare tire use alarm
JP2001020077A (en) * 1999-07-07 2001-01-23 Sony Corp Electroless plating method and electroless plating solution

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1522048A (en) * 1966-05-06 1968-04-19 Photocircuits Corp Non-galvanic deposit of metals

Also Published As

Publication number Publication date
ES370451A1 (en) 1971-07-01
GB1283715A (en) 1972-08-02
JPS5114453B1 (en) 1976-05-10
NL6912126A (en) 1970-02-17
DE1966580A1 (en) 1973-03-08
SE377580B (en) 1975-07-14
FR2015590A1 (en) 1970-04-30
SE360394B (en) 1973-09-24
DE1940643A1 (en) 1970-05-06
DE1966580B2 (en) 1976-03-04
BE737368A (en) 1970-02-12

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