GB1283715A - Electroless copper plating - Google Patents

Electroless copper plating

Info

Publication number
GB1283715A
GB1283715A GB3777969A GB3777969A GB1283715A GB 1283715 A GB1283715 A GB 1283715A GB 3777969 A GB3777969 A GB 3777969A GB 3777969 A GB3777969 A GB 3777969A GB 1283715 A GB1283715 A GB 1283715A
Authority
GB
United Kingdom
Prior art keywords
salt
hcho
source
agent
soluble
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3777969A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
Shipley Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Inc filed Critical Shipley Co Inc
Publication of GB1283715A publication Critical patent/GB1283715A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
GB3777969A 1968-08-13 1969-07-28 Electroless copper plating Expired GB1283715A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US75216668A 1968-08-13 1968-08-13
US75225068A 1968-08-13 1968-08-13
US75216568A 1968-08-13 1968-08-13

Publications (1)

Publication Number Publication Date
GB1283715A true GB1283715A (en) 1972-08-02

Family

ID=27419423

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3777969A Expired GB1283715A (en) 1968-08-13 1969-07-28 Electroless copper plating

Country Status (8)

Country Link
JP (1) JPS5114453B1 (enrdf_load_stackoverflow)
BE (1) BE737368A (enrdf_load_stackoverflow)
DE (1) DE1940643A1 (enrdf_load_stackoverflow)
ES (1) ES370451A1 (enrdf_load_stackoverflow)
FR (1) FR2015590A1 (enrdf_load_stackoverflow)
GB (1) GB1283715A (enrdf_load_stackoverflow)
NL (1) NL6912126A (enrdf_load_stackoverflow)
SE (3) SE377580B (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2796084A1 (fr) * 1999-07-07 2001-01-12 Sony Corp Procede et solution de placage chimique

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS528343U (enrdf_load_stackoverflow) * 1975-07-01 1977-01-20
JPS57124483U (enrdf_load_stackoverflow) * 1981-01-29 1982-08-03
JPS5853573A (ja) * 1981-09-28 1983-03-30 Nissan Motor Co Ltd スペアタイヤ使用報知器

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1522048A (fr) * 1966-05-06 1968-04-19 Photocircuits Corp Dépôt non galvanique de métaux

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2796084A1 (fr) * 1999-07-07 2001-01-12 Sony Corp Procede et solution de placage chimique
NL1015624C2 (nl) * 1999-07-07 2001-05-30 Sony Corp Stroomloze-plateringswerkwijze en stroomloze-platerings oplossing.
US6534117B1 (en) 1999-07-07 2003-03-18 Sony Corporation Electroless plating method and electroless plating solution

Also Published As

Publication number Publication date
FR2015590A1 (enrdf_load_stackoverflow) 1970-04-30
SE360394B (enrdf_load_stackoverflow) 1973-09-24
DE1940643A1 (de) 1970-05-06
DE1966580A1 (de) 1973-03-08
BE737368A (enrdf_load_stackoverflow) 1970-02-12
NL6912126A (enrdf_load_stackoverflow) 1970-02-17
ES370451A1 (es) 1971-07-01
JPS5114453B1 (enrdf_load_stackoverflow) 1976-05-10
SE396409B (sv) 1977-09-19
DE1966580B2 (de) 1976-03-04
SE377580B (enrdf_load_stackoverflow) 1975-07-14

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee