DE1212639B - Sperrschichtelektrodensystem, das einen halbleitenden einkristall aus germanium oder silizium enthaelt - Google Patents
Sperrschichtelektrodensystem, das einen halbleitenden einkristall aus germanium oder silizium enthaeltInfo
- Publication number
- DE1212639B DE1212639B DE19551212639 DE1212639A DE1212639B DE 1212639 B DE1212639 B DE 1212639B DE 19551212639 DE19551212639 DE 19551212639 DE 1212639 A DE1212639 A DE 1212639A DE 1212639 B DE1212639 B DE 1212639B
- Authority
- DE
- Germany
- Prior art keywords
- electrode system
- support plate
- single crystal
- germanium
- pores
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052732 germanium Inorganic materials 0.000 title claims description 10
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 title claims description 10
- 230000004888 barrier function Effects 0.000 title claims description 8
- 229910052710 silicon Inorganic materials 0.000 title claims description 6
- 239000010703 silicon Substances 0.000 title claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 239000011148 porous material Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 239000013078 crystal Substances 0.000 claims description 9
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 7
- 229910052750 molybdenum Inorganic materials 0.000 claims description 7
- 239000011733 molybdenum Substances 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 6
- 229910052721 tungsten Inorganic materials 0.000 claims description 6
- 239000010937 tungsten Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 239000011651 chromium Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 239000003814 drug Substances 0.000 claims 1
- 150000002739 metals Chemical class 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- 239000000370 acceptor Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
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- H01L23/492—Bases or plates or solder therefor
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Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Die Bonding (AREA)
Description
DEUTSCHES
PATENTAMT
AUSLEGESCHRIFT
Int. α.:
HOIl
Deutsche KL: 21g-11/02
Nummer: 1212 639
Aktenzeichen: N10854 VIII c/21 g
Anmeldetag: 28. Juni 1955
Auslegetag: 17. März 1966
Die Erfindung bezieht sich auf ein Sperrschichtelektrodensystem, das einen halbleitenden Einkristall
aus Germanium oder Silizium enthält, insbesondere Kristalldiode oder Transistor, wobei der halbleitende
Einkristall auf einer Wärme ableitenden Tragplatte festgelötet ist.
Es ist bekannt, daß bei solchen Systemen die Gefahr eines Bruches im Halbleiterkörper besteht, unter
anderem infolge seiner Sprödigkeit und seines abweichenden Ausdehnungskoeffizienten gegenüber
dem Material der Tragplatte. Man hat daher einen Einkristall aus Germanium auf einer Tragplatte befestigt,
die aus .einer Legierung von 54% Eisen, 29% Nickel und 17% Kobalt besteht. Der lineare
Ausdehnungskoeffizient dieser Legierung beträgt 4 · 10~6 im harten Zustand und 6 ' 10~6 im ausgeglühten
Zustand. Diese Werte nähern sich daher demjenigen für Germanium. So läßt sich im allgemeinen
bei einem bestimmten Halbleitermaterial ein Metall oder eine Legierung mit einem angemessenen
Ausdehnungskoeffizienten für die Tragplatte wählen. An das Material für eine Tragplatte können aber
noch weitere Anforderungen gestellt werden. Zur Erzielung einer guten Kühlung ist eine hohe Wärmeleitfähigkeit
erwünscht. Das Material muß weiterhin gegen die Ätzflüssigkeiten in für praktische Zwecke
ausreichendem Maße beständig sein, durch die der halbleitende Körper nach dem Löten gewöhnlich gereinigt
wird. Außerdem darf das vom Ätzmittel etwa gelöste Material der Tragplatte nicht als störende
Verunreinigung im Halbleiterkörper wirken.
Diesen Anforderungen kann die obenerwähnte Eisen-Nickel-Kobalt-Legierung nicht entsprechen.
Bei dem Sperrschichtelektrodensystem nach der Erfindung wird daher eine Tragplatte verwendet, die
aus Molybdän, Wolfram oder Chrom besteht und porös ist. Die Ausdehnungskoeffizienten dieser Metalle
sind:
λ · 10«
Chrom 6,8
Molybdän 4,9
Wolfram 4,3
Diese Ausdehnungskoeffizienten haben somit einen solchen Wert, daß für einen aufgelöteten Germanium-
oder Silizium-Einkristall die Bruchgefahr bei Temperaturschwankungen sehr gering ist.
Besonders geeignet sind Molybdän und Wolfram wegen ihrer hohen Wärmeleitfähigkeit, so daß die im
halbleitenden Körper bei Stromdurchgang entwikkelte Wärme schnell abgeleitet werden kann.
Bei der üblichen Ätzbehandlung sind diese Metalle Sperrschichtelektrodensystem, das einen
halbleitenden Einkristall aus Germanium oder
Siliziuim enthält
halbleitenden Einkristall aus Germanium oder
Siliziuim enthält
Anmelder:
N. V. Philips' Gloeilampenfabrieken, Eindhoven
(Niederlande)
Vertreter:
Dr. rer. nat. P. Roßbach, Patentanwalt,
Hamburg 1, Mönckebergstr. 7
Als Erfinder benannt:
Theo Willem Willemse, Delft (Niederlande)
Beanspruchte Priorität:
Niederlande vom 1. Juli 1954 (188 893)
2 ■ ■ .
für praktische Zwecke hinreichend beständig, und sie rufen keine störenden Verunreinigungen im Halbleiterkörper
hervor.
Diese Metalle haben ferner eine hohe mechanische Festigkeit, so daß, wenn der halbleitende Körper
unter Zwischenfügung einer Tragplatte aus diesen Metallen auf einer anderen Platte, z. B. einer
Kühlplatte aus Kupfer, festgelötet wird, die Formänderung der Tragplatte gegenüber der Formänderung
der Kühlplatte aus Kupfer gering ist.
Für einen guten Wärmeübergang muß eine gut haftende Lötschicht zwischen dem halbleitenden
Körper und der Tragplatte angebracht werden. Molybdän, Wolfram und Chrom lassen sich praktisch
nicht oder nur schwierig löten.
Eine Tragplatte nach der Erfindung aus den erwähnten Materialien kann durch Sintern von Metallpulver
ohne .besondere Schwierigkeiten hergestellt werden; die vorhandenen Poren ermöglichen eine
bessere Lötung.
Eine günstige Ausführungsform ergibt sich, wenn die Poren mit einem anderen Metall gefüllt sind.
Durch eine Änderung des Metalls der Tragplatte, des Porenvolumens und des Metalls, mit dem die
Poren gefüllt sind, kann der Ausdehnungskoeffizient weiter angepaßt und die Wärmeleitfähigkeit und die
Lötfähigkeit weiter verbessert werden.
Ein geeignetes Metall zum Füllen der Poren ist Silber. Zwecks Erhöhung des Fließens können dem
.-> >■ '-- ZVi i r!HD 609 538/305
Silber einige zehntel Prozent Germanium oder Silizium zugesetzt werden. Weitere brauchbare Metalle
sind Gold und Kupfer.
Die Erfindung wird an Hand eines in der Zeichnung dargestellten Ausführungsbeispieles näher erläutert,
in der eine Diode in vergrößertem Maßstab dargestellt ist.
Mit 1 ist die poröse Tragplatte bezeichnet, die z. B. aus Molybdän besteht. Diese Platte ist mit einer
dünnen Goldschicht 2 bedeckt, die zur besseren Haftung
einer dünnen Lötschicht 3 dient, durch die der halbleitende Körper 4, z. B. ein Germanium-Einkristall,
befestigt ist. Die Goldschicht kann auf galvanischem Wege-aufgebracht werden. — -- ■-
Als Lötmaterial kann Zinn verwendet werden, dem in an sich bekannter Weise Donatoren oder
Akzeptoren zugesetzt sein können.
Die Tragplatte ist selbst wieder auf eüier Kühlplatte
5 festgelötet, die z. B. aus Kupfer, Aluminium, Nickel oder Eisen besteht. Als Lötmaterial 6 kann
Silber verwendet werden.
Naturgemäß kann die Unterseite der Tragplatte wieder vergoldet sein; in diesem Falle ist die Zahl
der möglichen Lösungsmittel viel großer.
Die poröse Tragplatte kann z. B. aus Wolfram oder Molybdän mit einem Porenvolumen von 10% bestehen.
Wenn diese Poren mit Silber oder einem solchen als Lötmaterial verwendbaren Metall gefüllt
werden, so kann die Befestigung der Tragplatte auf der Kühlplatte vorteilhaft !gleichzeitig erfolgen. Der
Ausdehnungskoeffizient der Tragplatte beträgt 5,8 · 10~6 und ist daher besonders gut demjenigen
von Germanium angepaßt, der bei Betriebstemperatur etwa 5,6 · 10~6 beträgt.
Claims (7)
1. Sperrschichtelektrodensystem, das einen halbleitenden Einkristall aus Germanium oder
35 Silizium enthält, wobei der halbleitende Einkristall
auf einer Wärme ableitenden Tragplatte festgelötet ist, dadurch gekennzeichnet,
daß die Tragplatte aus Molybdän, Wolfram oder Chrom besteht und porös ist.
2. Sperrschiehtelektrodensystem nach Anspruch 1, dadurch gekennzeichnet, daß das Porenvolumen
10% beträgt.
3. Sperrschiehtelektrodensystem nach Anspruch l.oder 2, dadurch gekennzeichnet, daß
die Poren mit einem anderen Metall gefüllt sind.
4. Sperrschiehtelektrodensystem nach Anspruch 3, dadurch gekennzeichnet, daß die Poren
mit einem als Lötmaterial- verwendbaren Metall gefüllt sind.
5. Sperrschiehtelektrodensystem nach An- - sprach 3 oder 4, dadurch !gekennzeichnet, daß
die Poren mit Silber, Gold oder Kupfer gefüllt sind.
6. Sperrschiehtelektrodensystem nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet,
daß die Tragplatte vergoldet ist.
7. Sperrschiehtelektrodensystem nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet,
daß die Tragplatte auf einer Kühlplatte festgelötet ist.
In Betracht gezogene Druckschriften:
Deutsche Patentanmeldungen ρ 9071 VIIIc/21g
(bekanntgemacht am 8.2.1951), w 2733 VIIIc 21g (bekanntgemacht am 11.12.1952);
britische Patentschrift Nr. 669 399;
schweizerische Patentschrift Nr. 247 861;
»Naturforschung und Medizin in Deutschland 1939-1946«, Wiesbaden, 1948, Bd. 15, Teil I, S. 282;
»Electronics« (1952), Juni-Heft, S. 210 und 212;
»Proceedings of the IRE«, Bd. 40 (1952), November-Heft, S. 1342.
Hierzu 1 Blatt Zeichnungen
609 538/305 3.66 © Bundesdruckerei Berlin
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL188893 | 1954-07-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE1212639B true DE1212639B (de) | 1966-03-17 |
Family
ID=19750670
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DEN27010A Pending DE1242298B (de) | 1954-07-01 | 1955-06-28 | Tragplatte fuer ein Sperrschichtelektrodensystem, das einen halbleitenden Einkristall aus Germanium oder Silizium enthaelt |
DE19551212639 Pending DE1212639B (de) | 1954-07-01 | 1955-06-28 | Sperrschichtelektrodensystem, das einen halbleitenden einkristall aus germanium oder silizium enthaelt |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DEN27010A Pending DE1242298B (de) | 1954-07-01 | 1955-06-28 | Tragplatte fuer ein Sperrschichtelektrodensystem, das einen halbleitenden Einkristall aus Germanium oder Silizium enthaelt |
Country Status (8)
Country | Link |
---|---|
US (1) | US2971251A (de) |
BE (1) | BE539442A (de) |
CH (1) | CH333704A (de) |
DE (2) | DE1242298B (de) |
ES (1) | ES222691A1 (de) |
FR (1) | FR1126817A (de) |
GB (1) | GB772583A (de) |
NL (1) | NL107577C (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1242298B (de) * | 1954-07-01 | 1967-06-15 | Philips Nv | Tragplatte fuer ein Sperrschichtelektrodensystem, das einen halbleitenden Einkristall aus Germanium oder Silizium enthaelt |
DE1665969B1 (de) * | 1967-06-15 | 1972-01-20 | Siemens Ag | Dichte Durchfuehrung eines oder mehrerer elektrischer und/oder Waermeleiter durch einen Isolierkoerper |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1285068B (de) * | 1957-01-11 | 1968-12-12 | Siemens Ag | Legierungskontakt auf mit einer Goldschicht versehenen Halbleiterkristallen |
US2922092A (en) * | 1957-05-09 | 1960-01-19 | Westinghouse Electric Corp | Base contact members for semiconductor devices |
US3000085A (en) * | 1958-06-13 | 1961-09-19 | Westinghouse Electric Corp | Plating of sintered tungsten contacts |
NL239159A (de) * | 1958-08-08 | |||
NL249694A (de) * | 1959-12-30 | |||
US3173451A (en) * | 1960-06-23 | 1965-03-16 | Owens Corning Fiberglass Corp | Cast manifold with liner |
DE1133834B (de) * | 1960-09-21 | 1962-07-26 | Siemens Ag | Siliziumgleichrichter und Verfahren zu dessen Herstellung |
DE1143588B (de) * | 1960-09-22 | 1963-02-14 | Siemens Ag | Gesinterter Kontaktkoerper fuer Halbleiteranordnungen |
US3141226A (en) * | 1961-09-27 | 1964-07-21 | Hughes Aircraft Co | Semiconductor electrode attachment |
US3235943A (en) * | 1962-01-04 | 1966-02-22 | Corning Glass Works | Method of making a flux free bonded article |
US3264074A (en) * | 1962-04-04 | 1966-08-02 | Lear Siegler Inc | Thin film electron emissive electrode |
US3214833A (en) * | 1962-09-25 | 1965-11-02 | George F Erickson | Ceramic to metal bonding process |
US3200490A (en) * | 1962-12-07 | 1965-08-17 | Philco Corp | Method of forming ohmic bonds to a germanium-coated silicon body with eutectic alloyforming materials |
US3241931A (en) * | 1963-03-01 | 1966-03-22 | Rca Corp | Semiconductor devices |
US3291578A (en) * | 1963-11-04 | 1966-12-13 | Gen Electric | Metallized semiconductor support and mounting structure |
US3342567A (en) * | 1963-12-27 | 1967-09-19 | Rca Corp | Low resistance bonds to germaniumsilicon bodies and method of making such bonds |
US3308353A (en) * | 1964-09-10 | 1967-03-07 | Talon Inc | Semi-conductor device with specific support member material |
GB1150356A (en) * | 1965-10-26 | 1969-04-30 | Int Nickel Ltd | Coating Bodies of Oxidisable Elements and Alloys with Gold Alloys |
US3367774A (en) * | 1966-11-10 | 1968-02-06 | Lambert & Brake Corp | Method of producing a composite friction member |
FR1518717A (fr) * | 1966-12-21 | 1968-03-29 | Radiotechnique Coprim Rtc | Perfectionnements aux diodes électroluminescentes |
US3620692A (en) * | 1970-04-01 | 1971-11-16 | Rca Corp | Mounting structure for high-power semiconductor devices |
US3753665A (en) * | 1970-11-12 | 1973-08-21 | Gen Electric | Magnetic film plated wire |
US3833425A (en) * | 1972-02-23 | 1974-09-03 | Us Navy | Solar cell array |
JPS51102565A (de) * | 1975-03-07 | 1976-09-10 | Hitachi Ltd | |
JPS5921032A (ja) * | 1982-07-26 | 1984-02-02 | Sumitomo Electric Ind Ltd | 半導体装置用基板 |
JPS59141247A (ja) * | 1983-01-31 | 1984-08-13 | Sumitomo Electric Ind Ltd | 半導体基板材料 |
JPS59141248A (ja) * | 1983-01-31 | 1984-08-13 | Sumitomo Electric Ind Ltd | 半導体基板材料 |
US4929516A (en) * | 1985-03-14 | 1990-05-29 | Olin Corporation | Semiconductor die attach system |
US4872047A (en) * | 1986-11-07 | 1989-10-03 | Olin Corporation | Semiconductor die attach system |
US4978052A (en) * | 1986-11-07 | 1990-12-18 | Olin Corporation | Semiconductor die attach system |
JPH07105464B2 (ja) * | 1992-12-04 | 1995-11-13 | 住友電気工業株式会社 | 半導体素子搭載用半導体装置 |
US5886407A (en) * | 1993-04-14 | 1999-03-23 | Frank J. Polese | Heat-dissipating package for microcircuit devices |
US5972737A (en) * | 1993-04-14 | 1999-10-26 | Frank J. Polese | Heat-dissipating package for microcircuit devices and process for manufacture |
US5686676A (en) * | 1996-05-07 | 1997-11-11 | Brush Wellman Inc. | Process for making improved copper/tungsten composites |
Citations (2)
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---|---|---|---|---|
CH247861A (de) * | 1943-05-01 | 1947-03-31 | Standard Telephon & Radio Ag | Verfahren zur Herstellung von Trockengleichrichterscheiben und nach diesem Verfahren hergestellte Gleichrichterscheibe. |
GB669399A (en) * | 1947-12-24 | 1952-04-02 | Western Electric Co | Improvements in semi-conductive alloys and devices utilizing them |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2441603A (en) * | 1943-07-28 | 1948-05-18 | Bell Telephone Labor Inc | Electrical translating materials and method of making them |
US2391456A (en) * | 1944-01-29 | 1945-12-25 | Mallory & Co Inc P R | Spark plug electrode |
US2555001A (en) * | 1947-02-04 | 1951-05-29 | Bell Telephone Labor Inc | Bonded article and method of bonding |
US2525565A (en) * | 1948-07-12 | 1950-10-10 | Eitel Mccullough Inc | Filamentary cathode for electron tubes |
US2690409A (en) * | 1949-07-08 | 1954-09-28 | Thompson Prod Inc | Binary coating of refractory metals |
BE539442A (de) * | 1954-07-01 | |||
US2763822A (en) * | 1955-05-10 | 1956-09-18 | Westinghouse Electric Corp | Silicon semiconductor devices |
-
0
- BE BE539442D patent/BE539442A/xx unknown
- NL NL107577D patent/NL107577C/xx active
-
1955
- 1955-06-20 US US516690A patent/US2971251A/en not_active Expired - Lifetime
- 1955-06-28 DE DEN27010A patent/DE1242298B/de active Pending
- 1955-06-28 ES ES0222691A patent/ES222691A1/es not_active Expired
- 1955-06-28 GB GB18648/55A patent/GB772583A/en not_active Expired
- 1955-06-28 DE DE19551212639 patent/DE1212639B/de active Pending
- 1955-06-29 FR FR1126817D patent/FR1126817A/fr not_active Expired
- 1955-07-01 CH CH333704D patent/CH333704A/de unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH247861A (de) * | 1943-05-01 | 1947-03-31 | Standard Telephon & Radio Ag | Verfahren zur Herstellung von Trockengleichrichterscheiben und nach diesem Verfahren hergestellte Gleichrichterscheibe. |
GB669399A (en) * | 1947-12-24 | 1952-04-02 | Western Electric Co | Improvements in semi-conductive alloys and devices utilizing them |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1242298B (de) * | 1954-07-01 | 1967-06-15 | Philips Nv | Tragplatte fuer ein Sperrschichtelektrodensystem, das einen halbleitenden Einkristall aus Germanium oder Silizium enthaelt |
DE1665969B1 (de) * | 1967-06-15 | 1972-01-20 | Siemens Ag | Dichte Durchfuehrung eines oder mehrerer elektrischer und/oder Waermeleiter durch einen Isolierkoerper |
Also Published As
Publication number | Publication date |
---|---|
DE1242298B (de) | 1967-06-15 |
NL107577C (de) | |
GB772583A (en) | 1957-04-17 |
ES222691A1 (es) | 1956-01-01 |
FR1126817A (fr) | 1956-12-03 |
US2971251A (en) | 1961-02-14 |
CH333704A (de) | 1958-10-31 |
BE539442A (de) |
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