DE112022000219B4 - Halbleitervorrichtung - Google Patents

Halbleitervorrichtung

Info

Publication number
DE112022000219B4
DE112022000219B4 DE112022000219.0T DE112022000219T DE112022000219B4 DE 112022000219 B4 DE112022000219 B4 DE 112022000219B4 DE 112022000219 T DE112022000219 T DE 112022000219T DE 112022000219 B4 DE112022000219 B4 DE 112022000219B4
Authority
DE
Germany
Prior art keywords
bonding layer
semiconductor chip
semiconductor device
bonding
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE112022000219.0T
Other languages
German (de)
English (en)
Other versions
DE112022000219T5 (de
Inventor
Takashi Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Publication of DE112022000219T5 publication Critical patent/DE112022000219T5/de
Application granted granted Critical
Publication of DE112022000219B4 publication Critical patent/DE112022000219B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/334—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
DE112022000219.0T 2021-07-16 2022-05-10 Halbleitervorrichtung Active DE112022000219B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021118039 2021-07-16
JP2021-118039 2021-07-16
PCT/JP2022/019854 WO2023286432A1 (ja) 2021-07-16 2022-05-10 半導体装置

Publications (2)

Publication Number Publication Date
DE112022000219T5 DE112022000219T5 (de) 2023-08-17
DE112022000219B4 true DE112022000219B4 (de) 2025-09-18

Family

ID=84919320

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112022000219.0T Active DE112022000219B4 (de) 2021-07-16 2022-05-10 Halbleitervorrichtung

Country Status (5)

Country Link
US (1) US20230335527A1 (https=)
JP (1) JP7513212B2 (https=)
CN (1) CN116802777A (https=)
DE (1) DE112022000219B4 (https=)
WO (1) WO2023286432A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2024214425A1 (https=) * 2023-04-13 2024-10-17

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008129703A (ja) * 2006-11-17 2008-06-05 Fujifilm Corp 撮像装置、方法、およびプログラム
WO2012121355A1 (ja) * 2011-03-10 2012-09-13 富士電機株式会社 電子部品および電子部品の製造方法
WO2014129626A1 (ja) * 2013-02-22 2014-08-28 古河電気工業株式会社 接続構造体、及び半導体装置
JP2015095540A (ja) * 2013-11-12 2015-05-18 三菱電機株式会社 半導体装置およびその製造方法
JP2015153966A (ja) * 2014-02-18 2015-08-24 三菱電機株式会社 半導体装置および半導体装置の製造方法
JP2015177182A (ja) * 2014-03-18 2015-10-05 三菱電機株式会社 パワーモジュール
JP2015216160A (ja) * 2014-05-08 2015-12-03 三菱電機株式会社 電力用半導体装置および電力用半導体装置の製造方法
JP2017071826A (ja) * 2015-10-07 2017-04-13 古河電気工業株式会社 接続構造体
JP6399906B2 (ja) * 2014-11-20 2018-10-03 三菱電機株式会社 パワーモジュール
US10535628B2 (en) * 2010-11-03 2020-01-14 Alpha Assembly Solutions Inc. Sintering materials and attachment methods using same
JP2021027116A (ja) * 2019-08-02 2021-02-22 ローム株式会社 半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4369528B2 (ja) 2009-07-02 2009-11-25 株式会社新川 ボンディング装置及び方法
JP5705467B2 (ja) 2010-06-25 2015-04-22 新電元工業株式会社 半導体装置の接合方法、および、半導体装置
JP2016213288A (ja) * 2015-05-01 2016-12-15 セイコーエプソン株式会社 接合体、電子装置、プロジェクターおよび接合体の製造方法
DE112016006908B4 (de) * 2016-05-26 2024-12-12 Mitsubishi Electric Corporation Leistungshalbleitervorrichtung
CN111316408B (zh) * 2017-10-30 2023-07-18 三菱电机株式会社 电力用半导体装置以及电力用半导体装置的制造方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008129703A (ja) * 2006-11-17 2008-06-05 Fujifilm Corp 撮像装置、方法、およびプログラム
US10535628B2 (en) * 2010-11-03 2020-01-14 Alpha Assembly Solutions Inc. Sintering materials and attachment methods using same
WO2012121355A1 (ja) * 2011-03-10 2012-09-13 富士電機株式会社 電子部品および電子部品の製造方法
WO2014129626A1 (ja) * 2013-02-22 2014-08-28 古河電気工業株式会社 接続構造体、及び半導体装置
JP2015095540A (ja) * 2013-11-12 2015-05-18 三菱電機株式会社 半導体装置およびその製造方法
JP2015153966A (ja) * 2014-02-18 2015-08-24 三菱電機株式会社 半導体装置および半導体装置の製造方法
JP2015177182A (ja) * 2014-03-18 2015-10-05 三菱電機株式会社 パワーモジュール
JP2015216160A (ja) * 2014-05-08 2015-12-03 三菱電機株式会社 電力用半導体装置および電力用半導体装置の製造方法
JP6399906B2 (ja) * 2014-11-20 2018-10-03 三菱電機株式会社 パワーモジュール
JP2017071826A (ja) * 2015-10-07 2017-04-13 古河電気工業株式会社 接続構造体
JP2021027116A (ja) * 2019-08-02 2021-02-22 ローム株式会社 半導体装置

Also Published As

Publication number Publication date
CN116802777A (zh) 2023-09-22
JP7513212B2 (ja) 2024-07-09
DE112022000219T5 (de) 2023-08-17
JPWO2023286432A1 (https=) 2023-01-19
US20230335527A1 (en) 2023-10-19
WO2023286432A1 (ja) 2023-01-19

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Ipc: H10W0072000000