JP7513212B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP7513212B2
JP7513212B2 JP2023535154A JP2023535154A JP7513212B2 JP 7513212 B2 JP7513212 B2 JP 7513212B2 JP 2023535154 A JP2023535154 A JP 2023535154A JP 2023535154 A JP2023535154 A JP 2023535154A JP 7513212 B2 JP7513212 B2 JP 7513212B2
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Japan
Prior art keywords
bonding layer
semiconductor chip
semiconductor device
outer edge
bonding
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JP2023535154A
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English (en)
Japanese (ja)
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JPWO2023286432A1 (https=
JPWO2023286432A5 (https=
Inventor
隆 齊藤
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Fuji Electric Co Ltd
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Fuji Electric Co Ltd
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Publication of JPWO2023286432A5 publication Critical patent/JPWO2023286432A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/334—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Die Bonding (AREA)
JP2023535154A 2021-07-16 2022-05-10 半導体装置 Active JP7513212B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021118039 2021-07-16
JP2021118039 2021-07-16
PCT/JP2022/019854 WO2023286432A1 (ja) 2021-07-16 2022-05-10 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2023286432A1 JPWO2023286432A1 (https=) 2023-01-19
JPWO2023286432A5 JPWO2023286432A5 (https=) 2023-09-25
JP7513212B2 true JP7513212B2 (ja) 2024-07-09

Family

ID=84919320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023535154A Active JP7513212B2 (ja) 2021-07-16 2022-05-10 半導体装置

Country Status (5)

Country Link
US (1) US20230335527A1 (https=)
JP (1) JP7513212B2 (https=)
CN (1) CN116802777A (https=)
DE (1) DE112022000219B4 (https=)
WO (1) WO2023286432A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2024214425A1 (https=) * 2023-04-13 2024-10-17

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009218624A (ja) 2009-07-02 2009-09-24 Shinkawa Ltd ボンディング装置及び方法
JP2016213288A (ja) 2015-05-01 2016-12-15 セイコーエプソン株式会社 接合体、電子装置、プロジェクターおよび接合体の製造方法
WO2017203650A1 (ja) 2016-05-26 2017-11-30 三菱電機株式会社 電力用半導体装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4769693B2 (ja) * 2006-11-17 2011-09-07 富士フイルム株式会社 撮像装置、方法、およびプログラム
JP5705467B2 (ja) 2010-06-25 2015-04-22 新電元工業株式会社 半導体装置の接合方法、および、半導体装置
SG10201913296SA (en) * 2010-11-03 2020-02-27 Frys Metals Inc Sintering materials and attachment methods using same
CN103415918A (zh) * 2011-03-10 2013-11-27 富士电机株式会社 电子组件以及制造电子组件的方法
WO2014129626A1 (ja) * 2013-02-22 2014-08-28 古河電気工業株式会社 接続構造体、及び半導体装置
JP6265693B2 (ja) * 2013-11-12 2018-01-24 三菱電機株式会社 半導体装置およびその製造方法
JP6143687B2 (ja) * 2014-02-18 2017-06-07 三菱電機株式会社 半導体装置および半導体装置の製造方法
JP2015177182A (ja) * 2014-03-18 2015-10-05 三菱電機株式会社 パワーモジュール
JP2015216160A (ja) * 2014-05-08 2015-12-03 三菱電機株式会社 電力用半導体装置および電力用半導体装置の製造方法
JP6399906B2 (ja) * 2014-11-20 2018-10-03 三菱電機株式会社 パワーモジュール
JP6989242B2 (ja) * 2015-10-07 2022-01-05 古河電気工業株式会社 接続構造体
CN111316408B (zh) * 2017-10-30 2023-07-18 三菱电机株式会社 电力用半导体装置以及电力用半导体装置的制造方法
JP2021027116A (ja) * 2019-08-02 2021-02-22 ローム株式会社 半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009218624A (ja) 2009-07-02 2009-09-24 Shinkawa Ltd ボンディング装置及び方法
JP2016213288A (ja) 2015-05-01 2016-12-15 セイコーエプソン株式会社 接合体、電子装置、プロジェクターおよび接合体の製造方法
WO2017203650A1 (ja) 2016-05-26 2017-11-30 三菱電機株式会社 電力用半導体装置

Also Published As

Publication number Publication date
CN116802777A (zh) 2023-09-22
DE112022000219T5 (de) 2023-08-17
JPWO2023286432A1 (https=) 2023-01-19
US20230335527A1 (en) 2023-10-19
DE112022000219B4 (de) 2025-09-18
WO2023286432A1 (ja) 2023-01-19

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