DE112021002788T5 - Halbleitervorrichtung - Google Patents

Halbleitervorrichtung Download PDF

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Publication number
DE112021002788T5
DE112021002788T5 DE112021002788.3T DE112021002788T DE112021002788T5 DE 112021002788 T5 DE112021002788 T5 DE 112021002788T5 DE 112021002788 T DE112021002788 T DE 112021002788T DE 112021002788 T5 DE112021002788 T5 DE 112021002788T5
Authority
DE
Germany
Prior art keywords
insulator
conductor
oxide
transistor
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112021002788.3T
Other languages
German (de)
English (en)
Inventor
Shunpei Yamazaki
Takayuki Ikeda
Tatsuya Onuki
Yuto Yakubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Publication of DE112021002788T5 publication Critical patent/DE112021002788T5/de
Pending legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/07—Responding to the occurrence of a fault, e.g. fault tolerance
    • G06F11/14—Error detection or correction of the data by redundancy in operations
    • G06F11/1402—Saving, restoring, recovering or retrying
    • G06F11/1415—Saving, restoring, recovering or retrying at system level
    • G06F11/1441—Resetting or repowering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D88/00—Three-dimensional [3D] integrated devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/30—Authentication, i.e. establishing the identity or authorisation of security principals
    • G06F21/31—User authentication
    • G06F21/34—User authentication involving the use of external additional devices, e.g. dongles or smart cards
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F7/00—Methods or arrangements for processing data by operating upon the order or content of the data handled
    • G06F7/38—Methods or arrangements for performing computations using exclusively denominational number representation, e.g. using binary, ternary, decimal representation
    • G06F7/48—Methods or arrangements for performing computations using exclusively denominational number representation, e.g. using binary, ternary, decimal representation using non-contact-making devices, e.g. tube, solid state device; using unspecified devices
    • G06F7/544—Methods or arrangements for performing computations using exclusively denominational number representation, e.g. using binary, ternary, decimal representation using non-contact-making devices, e.g. tube, solid state device; using unspecified devices for evaluating functions by calculation
    • G06F7/5443—Sum of products
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q50/00—Information and communication technology [ICT] specially adapted for implementation of business processes of specific business sectors, e.g. utilities or tourism
    • G06Q50/10—Services
    • G06Q50/26—Government or public services
    • G06Q50/265—Personal security, identity or safety
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/481—Encapsulations, e.g. protective coatings characterised by their materials comprising semiconductor materials
    • G—PHYSICS
    • G16—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR SPECIFIC APPLICATION FIELDS
    • G16H—HEALTHCARE INFORMATICS, i.e. INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR THE HANDLING OR PROCESSING OF MEDICAL OR HEALTHCARE DATA
    • G16H40/00—ICT specially adapted for the management or administration of healthcare resources or facilities; ICT specially adapted for the management or operation of medical equipment or devices
    • G16H40/60—ICT specially adapted for the management or administration of healthcare resources or facilities; ICT specially adapted for the management or operation of medical equipment or devices for the operation of medical equipment or devices
    • G16H40/67—ICT specially adapted for the management or administration of healthcare resources or facilities; ICT specially adapted for the management or operation of medical equipment or devices for the operation of medical equipment or devices for remote operation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6733—Multi-gate TFTs
    • H10D30/6734—Multi-gate TFTs having gate electrodes arranged on both top and bottom sides of the channel, e.g. dual-gate TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/08—Manufacture or treatment characterised by using material-based technologies using combinations of technologies, e.g. using both Si and SiC technologies or using both Si and Group III-V technologies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D87/00—Integrated devices comprising both bulk components and either SOI or SOS components on the same substrate

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Security & Cryptography (AREA)
  • General Engineering & Computer Science (AREA)
  • Business, Economics & Management (AREA)
  • Tourism & Hospitality (AREA)
  • Computer Hardware Design (AREA)
  • Software Systems (AREA)
  • Mathematical Analysis (AREA)
  • Computational Mathematics (AREA)
  • Computing Systems (AREA)
  • Mathematical Optimization (AREA)
  • Pure & Applied Mathematics (AREA)
  • Economics (AREA)
  • Health & Medical Sciences (AREA)
  • Strategic Management (AREA)
  • Primary Health Care (AREA)
  • Marketing (AREA)
  • Human Resources & Organizations (AREA)
  • General Health & Medical Sciences (AREA)
  • General Business, Economics & Management (AREA)
  • Educational Administration (AREA)
  • Development Economics (AREA)
  • Quality & Reliability (AREA)
  • Thin Film Transistor (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
DE112021002788.3T 2020-05-15 2021-05-06 Halbleitervorrichtung Pending DE112021002788T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020086266 2020-05-15
JP2020-086266 2020-05-15
PCT/IB2021/053820 WO2021229374A1 (ja) 2020-05-15 2021-05-06 半導体装置

Publications (1)

Publication Number Publication Date
DE112021002788T5 true DE112021002788T5 (de) 2023-04-27

Family

ID=78525457

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112021002788.3T Pending DE112021002788T5 (de) 2020-05-15 2021-05-06 Halbleitervorrichtung

Country Status (6)

Country Link
US (1) US12581693B2 (https=)
JP (3) JP7624980B2 (https=)
KR (1) KR20230011931A (https=)
CN (1) CN115606008A (https=)
DE (1) DE112021002788T5 (https=)
WO (1) WO2021229374A1 (https=)

Family Cites Families (40)

* Cited by examiner, † Cited by third party
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US7732241B2 (en) 2005-11-30 2010-06-08 Semiconductor Energy Labortory Co., Ltd. Microstructure and manufacturing method thereof and microelectromechanical system
DE102006008258B4 (de) 2006-02-22 2012-01-26 Siemens Ag System zur Identifikation eines medizinischen Implantats
US20080076974A1 (en) 2006-04-28 2008-03-27 Semiconductor Energy Laboratory Co., Ltd. Biological information detection sensor device
JP2008043302A (ja) 2006-08-21 2008-02-28 Hitachi Ltd 生体植込み用ｒｆｉｄタグ及びその挿入冶具体
JP5147345B2 (ja) 2006-09-29 2013-02-20 株式会社半導体エネルギー研究所 半導体装置
US7839124B2 (en) 2006-09-29 2010-11-23 Semiconductor Energy Laboratory Co., Ltd. Wireless power storage device comprising battery, semiconductor device including battery, and method for operating the wireless power storage device
JP2008113632A (ja) 2006-11-07 2008-05-22 Hitachi Ltd 生体植込用ｒｆｉｄタグおよびその挿入冶具体
EP1955679B1 (en) 2007-02-09 2013-11-06 Semiconductor Energy Laboratory Co., Ltd. Assist device
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US7777631B2 (en) 2007-04-29 2010-08-17 James Neil Rodgers Body chip
US20120109255A1 (en) 2010-10-27 2012-05-03 National Tsing Hua University Retina Stimulation Apparatus and Manufacturing Method Thereof
US8954156B2 (en) 2010-10-27 2015-02-10 National Tsing Hua University Methods and apparatuses for configuring artificial retina devices
EP2632388B1 (en) 2010-10-27 2020-03-25 Iridium Medical Technology Co., Ltd Flexible artificial retina devices
US8530265B2 (en) 2010-10-27 2013-09-10 National Tsing Hua University Method of fabricating flexible artificial retina devices
US9114004B2 (en) 2010-10-27 2015-08-25 Iridium Medical Technology Co, Ltd. Flexible artificial retina devices
US8613135B2 (en) 2011-05-06 2013-12-24 National Tsing Hua University Method for non-planar chip assembly
KR101772255B1 (ko) 2011-05-06 2017-08-28 이리듐 메디칼 테크놀로지 컴퍼니 리미티드 비평면 집적 회로 디바이스
US9155881B2 (en) 2011-05-06 2015-10-13 Iridium Medical Technology Co, Ltd. Non-planar chip assembly
JP6580863B2 (ja) 2014-05-22 2019-09-25 株式会社半導体エネルギー研究所 半導体装置、健康管理システム
US10204898B2 (en) 2014-08-08 2019-02-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
JP2016111677A (ja) 2014-09-26 2016-06-20 株式会社半導体エネルギー研究所 半導体装置、無線センサ、及び電子機器
US10770729B2 (en) 2015-01-09 2020-09-08 Semiconductor Energy Laboratory Co., Ltd. Electrode, power storage device, and electronic equipment
WO2018073708A1 (en) * 2016-10-20 2018-04-26 Semiconductor Energy Laboratory Co., Ltd. Storage device, driving method thereof, semiconductor device, electronic component, and electronic device
JP2018129046A (ja) 2017-02-08 2018-08-16 株式会社半導体エネルギー研究所 Ａｉシステム
DK201700432A1 (en) 2017-08-05 2019-04-16 Bluealert.dk ApS IoT human Microchip Implant with Data
JP2019046199A (ja) * 2017-09-01 2019-03-22 株式会社半導体エネルギー研究所 プロセッサ、および電子機器
JP2019079415A (ja) 2017-10-26 2019-05-23 京セラ株式会社 電子機器、制御装置、制御プログラム及び電子機器の動作方法
JP7110223B2 (ja) 2017-11-02 2022-08-01 株式会社半導体エネルギー研究所 給電装置およびその動作方法
WO2020056187A1 (en) 2018-09-14 2020-03-19 Neuralink Corp. Electrode fabrication and design
US11444056B2 (en) 2019-07-12 2022-09-13 Neuralink Corp. Sandwich assembly scheme for thin film electrode array and integrated circuits on both sides of printed circuit board (PCB) and method of manufacture
WO2021011401A1 (en) 2019-07-12 2021-01-21 Neuralink Corp. Brain implant with subcutaneous wireless relay and external wearable communication and power device
CN112085132B (zh) 2020-08-27 2025-08-22 浙江曜泰数智科技有限公司 一种用于获取动物体温的可植入rfid标签装置
CN212365034U (zh) 2020-08-27 2021-01-15 金华市金东区大堰河农牧场 一种用于检测温度的可植入rfid标签装置
WO2023038829A1 (en) 2021-09-09 2023-03-16 Neuralink Corp. Cell-based brain-machine interface
US11630516B1 (en) 2021-12-27 2023-04-18 Neuralink Corp. Brain-machine interface (BMI) with user interface (UI) aware controller
KR20240052612A (ko) 2022-10-14 2024-04-23 국민대학교산학협력단 무선전력 구동 기반의 임플란트 칩 장치
KR20240052611A (ko) 2022-10-14 2024-04-23 국민대학교산학협력단 체외 루프안테나 기반의 임플란트 칩 장치
CN219203493U (zh) 2023-03-16 2023-06-16 北京领创医谷科技发展有限责任公司 一种人体植入物的射频天线系统
EP4491215A1 (en) 2023-07-10 2025-01-15 BIOTRONIK SE & Co. KG Implant communication system, manufacturing method and implant programming device

Also Published As

Publication number Publication date
JP7624980B2 (ja) 2025-01-31
JP2025188138A (ja) 2025-12-25
KR20230011931A (ko) 2023-01-25
CN115606008A (zh) 2023-01-13
WO2021229374A1 (ja) 2021-11-18
JPWO2021229374A1 (https=) 2021-11-18
JP7756818B2 (ja) 2025-10-20
US20230178654A1 (en) 2023-06-08
JP2025066126A (ja) 2025-04-22
US12581693B2 (en) 2026-03-17

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R079 Amendment of ipc main class

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