JPWO2021229374A1 - - Google Patents
Info
- Publication number
- JPWO2021229374A1 JPWO2021229374A1 JP2022522080A JP2022522080A JPWO2021229374A1 JP WO2021229374 A1 JPWO2021229374 A1 JP WO2021229374A1 JP 2022522080 A JP2022522080 A JP 2022522080A JP 2022522080 A JP2022522080 A JP 2022522080A JP WO2021229374 A1 JPWO2021229374 A1 JP WO2021229374A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/07—Responding to the occurrence of a fault, e.g. fault tolerance
- G06F11/14—Error detection or correction of the data by redundancy in operations
- G06F11/1402—Saving, restoring, recovering or retrying
- G06F11/1415—Saving, restoring, recovering or retrying at system level
- G06F11/1441—Resetting or repowering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D88/00—Three-dimensional [3D] integrated devices
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/30—Authentication, i.e. establishing the identity or authorisation of security principals
- G06F21/31—User authentication
- G06F21/34—User authentication involving the use of external additional devices, e.g. dongles or smart cards
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F7/00—Methods or arrangements for processing data by operating upon the order or content of the data handled
- G06F7/38—Methods or arrangements for performing computations using exclusively denominational number representation, e.g. using binary, ternary, decimal representation
- G06F7/48—Methods or arrangements for performing computations using exclusively denominational number representation, e.g. using binary, ternary, decimal representation using non-contact-making devices, e.g. tube, solid state device; using unspecified devices
- G06F7/544—Methods or arrangements for performing computations using exclusively denominational number representation, e.g. using binary, ternary, decimal representation using non-contact-making devices, e.g. tube, solid state device; using unspecified devices for evaluating functions by calculation
- G06F7/5443—Sum of products
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q50/00—Information and communication technology [ICT] specially adapted for implementation of business processes of specific business sectors, e.g. utilities or tourism
- G06Q50/10—Services
- G06Q50/26—Government or public services
- G06Q50/265—Personal security, identity or safety
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/481—Encapsulations, e.g. protective coatings characterised by their materials comprising semiconductor materials
-
- G—PHYSICS
- G16—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR SPECIFIC APPLICATION FIELDS
- G16H—HEALTHCARE INFORMATICS, i.e. INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR THE HANDLING OR PROCESSING OF MEDICAL OR HEALTHCARE DATA
- G16H40/00—ICT specially adapted for the management or administration of healthcare resources or facilities; ICT specially adapted for the management or operation of medical equipment or devices
- G16H40/60—ICT specially adapted for the management or administration of healthcare resources or facilities; ICT specially adapted for the management or operation of medical equipment or devices for the operation of medical equipment or devices
- G16H40/67—ICT specially adapted for the management or administration of healthcare resources or facilities; ICT specially adapted for the management or operation of medical equipment or devices for the operation of medical equipment or devices for remote operation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6733—Multi-gate TFTs
- H10D30/6734—Multi-gate TFTs having gate electrodes arranged on both top and bottom sides of the channel, e.g. dual-gate TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/08—Manufacture or treatment characterised by using material-based technologies using combinations of technologies, e.g. using both Si and SiC technologies or using both Si and Group III-V technologies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D87/00—Integrated devices comprising both bulk components and either SOI or SOS components on the same substrate
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Security & Cryptography (AREA)
- General Engineering & Computer Science (AREA)
- Business, Economics & Management (AREA)
- Tourism & Hospitality (AREA)
- Computer Hardware Design (AREA)
- Software Systems (AREA)
- Mathematical Analysis (AREA)
- Computational Mathematics (AREA)
- Computing Systems (AREA)
- Mathematical Optimization (AREA)
- Pure & Applied Mathematics (AREA)
- Economics (AREA)
- Health & Medical Sciences (AREA)
- Strategic Management (AREA)
- Primary Health Care (AREA)
- Marketing (AREA)
- Human Resources & Organizations (AREA)
- General Health & Medical Sciences (AREA)
- General Business, Economics & Management (AREA)
- Educational Administration (AREA)
- Development Economics (AREA)
- Quality & Reliability (AREA)
- Thin Film Transistor (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Semiconductor Memories (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025008562A JP7756818B2 (ja) | 2020-05-15 | 2025-01-21 | 半導体装置 |
| JP2025169402A JP2025188138A (ja) | 2020-05-15 | 2025-10-07 | 半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020086266 | 2020-05-15 | ||
| JP2020086266 | 2020-05-15 | ||
| PCT/IB2021/053820 WO2021229374A1 (ja) | 2020-05-15 | 2021-05-06 | 半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025008562A Division JP7756818B2 (ja) | 2020-05-15 | 2025-01-21 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021229374A1 true JPWO2021229374A1 (https=) | 2021-11-18 |
| JPWO2021229374A5 JPWO2021229374A5 (https=) | 2024-05-01 |
| JP7624980B2 JP7624980B2 (ja) | 2025-01-31 |
Family
ID=78525457
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022522080A Active JP7624980B2 (ja) | 2020-05-15 | 2021-05-06 | 半導体装置 |
| JP2025008562A Active JP7756818B2 (ja) | 2020-05-15 | 2025-01-21 | 半導体装置 |
| JP2025169402A Pending JP2025188138A (ja) | 2020-05-15 | 2025-10-07 | 半導体装置 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025008562A Active JP7756818B2 (ja) | 2020-05-15 | 2025-01-21 | 半導体装置 |
| JP2025169402A Pending JP2025188138A (ja) | 2020-05-15 | 2025-10-07 | 半導体装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12581693B2 (https=) |
| JP (3) | JP7624980B2 (https=) |
| KR (1) | KR20230011931A (https=) |
| CN (1) | CN115606008A (https=) |
| DE (1) | DE112021002788T5 (https=) |
| WO (1) | WO2021229374A1 (https=) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008212652A (ja) * | 2007-02-09 | 2008-09-18 | Semiconductor Energy Lab Co Ltd | 補助装置 |
| JP2016001729A (ja) * | 2014-05-22 | 2016-01-07 | 株式会社半導体エネルギー研究所 | 半導体装置、健康管理システム |
| JP2018129046A (ja) * | 2017-02-08 | 2018-08-16 | 株式会社半導体エネルギー研究所 | Aiシステム |
| JP2019046199A (ja) * | 2017-09-01 | 2019-03-22 | 株式会社半導体エネルギー研究所 | プロセッサ、および電子機器 |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101180641B (zh) | 2005-01-31 | 2012-02-08 | 株式会社半导体能源研究所 | 半导体器件及其制造方法 |
| US7732241B2 (en) | 2005-11-30 | 2010-06-08 | Semiconductor Energy Labortory Co., Ltd. | Microstructure and manufacturing method thereof and microelectromechanical system |
| DE102006008258B4 (de) | 2006-02-22 | 2012-01-26 | Siemens Ag | System zur Identifikation eines medizinischen Implantats |
| US20080076974A1 (en) | 2006-04-28 | 2008-03-27 | Semiconductor Energy Laboratory Co., Ltd. | Biological information detection sensor device |
| JP2008043302A (ja) | 2006-08-21 | 2008-02-28 | Hitachi Ltd | 生体植込み用rfidタグ及びその挿入冶具体 |
| JP5147345B2 (ja) | 2006-09-29 | 2013-02-20 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US7839124B2 (en) | 2006-09-29 | 2010-11-23 | Semiconductor Energy Laboratory Co., Ltd. | Wireless power storage device comprising battery, semiconductor device including battery, and method for operating the wireless power storage device |
| JP2008113632A (ja) | 2006-11-07 | 2008-05-22 | Hitachi Ltd | 生体植込用rfidタグおよびその挿入冶具体 |
| WO2008123262A1 (en) | 2007-03-26 | 2008-10-16 | Semiconductor Energy Laboratory Co., Ltd. | Individual management system |
| US7777631B2 (en) | 2007-04-29 | 2010-08-17 | James Neil Rodgers | Body chip |
| US20120109255A1 (en) | 2010-10-27 | 2012-05-03 | National Tsing Hua University | Retina Stimulation Apparatus and Manufacturing Method Thereof |
| US8954156B2 (en) | 2010-10-27 | 2015-02-10 | National Tsing Hua University | Methods and apparatuses for configuring artificial retina devices |
| EP2632388B1 (en) | 2010-10-27 | 2020-03-25 | Iridium Medical Technology Co., Ltd | Flexible artificial retina devices |
| US8530265B2 (en) | 2010-10-27 | 2013-09-10 | National Tsing Hua University | Method of fabricating flexible artificial retina devices |
| US9114004B2 (en) | 2010-10-27 | 2015-08-25 | Iridium Medical Technology Co, Ltd. | Flexible artificial retina devices |
| US8613135B2 (en) | 2011-05-06 | 2013-12-24 | National Tsing Hua University | Method for non-planar chip assembly |
| KR101772255B1 (ko) | 2011-05-06 | 2017-08-28 | 이리듐 메디칼 테크놀로지 컴퍼니 리미티드 | 비평면 집적 회로 디바이스 |
| US9155881B2 (en) | 2011-05-06 | 2015-10-13 | Iridium Medical Technology Co, Ltd. | Non-planar chip assembly |
| US10204898B2 (en) | 2014-08-08 | 2019-02-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and electronic device |
| JP2016111677A (ja) | 2014-09-26 | 2016-06-20 | 株式会社半導体エネルギー研究所 | 半導体装置、無線センサ、及び電子機器 |
| US10770729B2 (en) | 2015-01-09 | 2020-09-08 | Semiconductor Energy Laboratory Co., Ltd. | Electrode, power storage device, and electronic equipment |
| WO2018073708A1 (en) * | 2016-10-20 | 2018-04-26 | Semiconductor Energy Laboratory Co., Ltd. | Storage device, driving method thereof, semiconductor device, electronic component, and electronic device |
| DK201700432A1 (en) | 2017-08-05 | 2019-04-16 | Bluealert.dk ApS | IoT human Microchip Implant with Data |
| JP2019079415A (ja) | 2017-10-26 | 2019-05-23 | 京セラ株式会社 | 電子機器、制御装置、制御プログラム及び電子機器の動作方法 |
| JP7110223B2 (ja) | 2017-11-02 | 2022-08-01 | 株式会社半導体エネルギー研究所 | 給電装置およびその動作方法 |
| WO2020056187A1 (en) | 2018-09-14 | 2020-03-19 | Neuralink Corp. | Electrode fabrication and design |
| US11444056B2 (en) | 2019-07-12 | 2022-09-13 | Neuralink Corp. | Sandwich assembly scheme for thin film electrode array and integrated circuits on both sides of printed circuit board (PCB) and method of manufacture |
| WO2021011401A1 (en) | 2019-07-12 | 2021-01-21 | Neuralink Corp. | Brain implant with subcutaneous wireless relay and external wearable communication and power device |
| CN112085132B (zh) | 2020-08-27 | 2025-08-22 | 浙江曜泰数智科技有限公司 | 一种用于获取动物体温的可植入rfid标签装置 |
| CN212365034U (zh) | 2020-08-27 | 2021-01-15 | 金华市金东区大堰河农牧场 | 一种用于检测温度的可植入rfid标签装置 |
| WO2023038829A1 (en) | 2021-09-09 | 2023-03-16 | Neuralink Corp. | Cell-based brain-machine interface |
| US11630516B1 (en) | 2021-12-27 | 2023-04-18 | Neuralink Corp. | Brain-machine interface (BMI) with user interface (UI) aware controller |
| KR20240052612A (ko) | 2022-10-14 | 2024-04-23 | 국민대학교산학협력단 | 무선전력 구동 기반의 임플란트 칩 장치 |
| KR20240052611A (ko) | 2022-10-14 | 2024-04-23 | 국민대학교산학협력단 | 체외 루프안테나 기반의 임플란트 칩 장치 |
| CN219203493U (zh) | 2023-03-16 | 2023-06-16 | 北京领创医谷科技发展有限责任公司 | 一种人体植入物的射频天线系统 |
| EP4491215A1 (en) | 2023-07-10 | 2025-01-15 | BIOTRONIK SE & Co. KG | Implant communication system, manufacturing method and implant programming device |
-
2021
- 2021-05-06 KR KR1020227038307A patent/KR20230011931A/ko active Pending
- 2021-05-06 DE DE112021002788.3T patent/DE112021002788T5/de active Pending
- 2021-05-06 CN CN202180035657.XA patent/CN115606008A/zh active Pending
- 2021-05-06 JP JP2022522080A patent/JP7624980B2/ja active Active
- 2021-05-06 US US17/924,166 patent/US12581693B2/en active Active
- 2021-05-06 WO PCT/IB2021/053820 patent/WO2021229374A1/ja not_active Ceased
-
2025
- 2025-01-21 JP JP2025008562A patent/JP7756818B2/ja active Active
- 2025-10-07 JP JP2025169402A patent/JP2025188138A/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008212652A (ja) * | 2007-02-09 | 2008-09-18 | Semiconductor Energy Lab Co Ltd | 補助装置 |
| JP2016001729A (ja) * | 2014-05-22 | 2016-01-07 | 株式会社半導体エネルギー研究所 | 半導体装置、健康管理システム |
| JP2018129046A (ja) * | 2017-02-08 | 2018-08-16 | 株式会社半導体エネルギー研究所 | Aiシステム |
| JP2019046199A (ja) * | 2017-09-01 | 2019-03-22 | 株式会社半導体エネルギー研究所 | プロセッサ、および電子機器 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE112021002788T5 (de) | 2023-04-27 |
| JP7624980B2 (ja) | 2025-01-31 |
| JP2025188138A (ja) | 2025-12-25 |
| KR20230011931A (ko) | 2023-01-25 |
| CN115606008A (zh) | 2023-01-13 |
| WO2021229374A1 (ja) | 2021-11-18 |
| JP7756818B2 (ja) | 2025-10-20 |
| US20230178654A1 (en) | 2023-06-08 |
| JP2025066126A (ja) | 2025-04-22 |
| US12581693B2 (en) | 2026-03-17 |
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