JPWO2021229374A1 - - Google Patents

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Publication number
JPWO2021229374A1
JPWO2021229374A1 JP2022522080A JP2022522080A JPWO2021229374A1 JP WO2021229374 A1 JPWO2021229374 A1 JP WO2021229374A1 JP 2022522080 A JP2022522080 A JP 2022522080A JP 2022522080 A JP2022522080 A JP 2022522080A JP WO2021229374 A1 JPWO2021229374 A1 JP WO2021229374A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022522080A
Other languages
Japanese (ja)
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JP7624980B2 (ja
JPWO2021229374A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed filed Critical
Publication of JPWO2021229374A1 publication Critical patent/JPWO2021229374A1/ja
Publication of JPWO2021229374A5 publication Critical patent/JPWO2021229374A5/ja
Priority to JP2025008562A priority Critical patent/JP7756818B2/ja
Application granted granted Critical
Publication of JP7624980B2 publication Critical patent/JP7624980B2/ja
Priority to JP2025169402A priority patent/JP2025188138A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00Error detection; Error correction; Monitoring
    • G06F11/07Responding to the occurrence of a fault, e.g. fault tolerance
    • G06F11/14Error detection or correction of the data by redundancy in operations
    • G06F11/1402Saving, restoring, recovering or retrying
    • G06F11/1415Saving, restoring, recovering or retrying at system level
    • G06F11/1441Resetting or repowering
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D88/00Three-dimensional [3D] integrated devices
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/30Authentication, i.e. establishing the identity or authorisation of security principals
    • G06F21/31User authentication
    • G06F21/34User authentication involving the use of external additional devices, e.g. dongles or smart cards
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F7/00Methods or arrangements for processing data by operating upon the order or content of the data handled
    • G06F7/38Methods or arrangements for performing computations using exclusively denominational number representation, e.g. using binary, ternary, decimal representation
    • G06F7/48Methods or arrangements for performing computations using exclusively denominational number representation, e.g. using binary, ternary, decimal representation using non-contact-making devices, e.g. tube, solid state device; using unspecified devices
    • G06F7/544Methods or arrangements for performing computations using exclusively denominational number representation, e.g. using binary, ternary, decimal representation using non-contact-making devices, e.g. tube, solid state device; using unspecified devices for evaluating functions by calculation
    • G06F7/5443Sum of products
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06QINFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q50/00Information and communication technology [ICT] specially adapted for implementation of business processes of specific business sectors, e.g. utilities or tourism
    • G06Q50/10Services
    • G06Q50/26Government or public services
    • G06Q50/265Personal security, identity or safety
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/40Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/481Encapsulations, e.g. protective coatings characterised by their materials comprising semiconductor materials
    • GPHYSICS
    • G16INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR SPECIFIC APPLICATION FIELDS
    • G16HHEALTHCARE INFORMATICS, i.e. INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR THE HANDLING OR PROCESSING OF MEDICAL OR HEALTHCARE DATA
    • G16H40/00ICT specially adapted for the management or administration of healthcare resources or facilities; ICT specially adapted for the management or operation of medical equipment or devices
    • G16H40/60ICT specially adapted for the management or administration of healthcare resources or facilities; ICT specially adapted for the management or operation of medical equipment or devices for the operation of medical equipment or devices
    • G16H40/67ICT specially adapted for the management or administration of healthcare resources or facilities; ICT specially adapted for the management or operation of medical equipment or devices for the operation of medical equipment or devices for remote operation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6733Multi-gate TFTs
    • H10D30/6734Multi-gate TFTs having gate electrodes arranged on both top and bottom sides of the channel, e.g. dual-gate TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/02Manufacture or treatment characterised by using material-based technologies
    • H10D84/08Manufacture or treatment characterised by using material-based technologies using combinations of technologies, e.g. using both Si and SiC technologies or using both Si and Group III-V technologies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D87/00Integrated devices comprising both bulk components and either SOI or SOS components on the same substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Security & Cryptography (AREA)
  • General Engineering & Computer Science (AREA)
  • Business, Economics & Management (AREA)
  • Tourism & Hospitality (AREA)
  • Computer Hardware Design (AREA)
  • Software Systems (AREA)
  • Mathematical Analysis (AREA)
  • Computational Mathematics (AREA)
  • Computing Systems (AREA)
  • Mathematical Optimization (AREA)
  • Pure & Applied Mathematics (AREA)
  • Economics (AREA)
  • Health & Medical Sciences (AREA)
  • Strategic Management (AREA)
  • Primary Health Care (AREA)
  • Marketing (AREA)
  • Human Resources & Organizations (AREA)
  • General Health & Medical Sciences (AREA)
  • General Business, Economics & Management (AREA)
  • Educational Administration (AREA)
  • Development Economics (AREA)
  • Quality & Reliability (AREA)
  • Thin Film Transistor (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
JP2022522080A 2020-05-15 2021-05-06 半導体装置 Active JP7624980B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2025008562A JP7756818B2 (ja) 2020-05-15 2025-01-21 半導体装置
JP2025169402A JP2025188138A (ja) 2020-05-15 2025-10-07 半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020086266 2020-05-15
JP2020086266 2020-05-15
PCT/IB2021/053820 WO2021229374A1 (ja) 2020-05-15 2021-05-06 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025008562A Division JP7756818B2 (ja) 2020-05-15 2025-01-21 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2021229374A1 true JPWO2021229374A1 (https=) 2021-11-18
JPWO2021229374A5 JPWO2021229374A5 (https=) 2024-05-01
JP7624980B2 JP7624980B2 (ja) 2025-01-31

Family

ID=78525457

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2022522080A Active JP7624980B2 (ja) 2020-05-15 2021-05-06 半導体装置
JP2025008562A Active JP7756818B2 (ja) 2020-05-15 2025-01-21 半導体装置
JP2025169402A Pending JP2025188138A (ja) 2020-05-15 2025-10-07 半導体装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2025008562A Active JP7756818B2 (ja) 2020-05-15 2025-01-21 半導体装置
JP2025169402A Pending JP2025188138A (ja) 2020-05-15 2025-10-07 半導体装置

Country Status (6)

Country Link
US (1) US12581693B2 (https=)
JP (3) JP7624980B2 (https=)
KR (1) KR20230011931A (https=)
CN (1) CN115606008A (https=)
DE (1) DE112021002788T5 (https=)
WO (1) WO2021229374A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008212652A (ja) * 2007-02-09 2008-09-18 Semiconductor Energy Lab Co Ltd 補助装置
JP2016001729A (ja) * 2014-05-22 2016-01-07 株式会社半導体エネルギー研究所 半導体装置、健康管理システム
JP2018129046A (ja) * 2017-02-08 2018-08-16 株式会社半導体エネルギー研究所 Aiシステム
JP2019046199A (ja) * 2017-09-01 2019-03-22 株式会社半導体エネルギー研究所 プロセッサ、および電子機器

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CN101180641B (zh) 2005-01-31 2012-02-08 株式会社半导体能源研究所 半导体器件及其制造方法
US7732241B2 (en) 2005-11-30 2010-06-08 Semiconductor Energy Labortory Co., Ltd. Microstructure and manufacturing method thereof and microelectromechanical system
DE102006008258B4 (de) 2006-02-22 2012-01-26 Siemens Ag System zur Identifikation eines medizinischen Implantats
US20080076974A1 (en) 2006-04-28 2008-03-27 Semiconductor Energy Laboratory Co., Ltd. Biological information detection sensor device
JP2008043302A (ja) 2006-08-21 2008-02-28 Hitachi Ltd 生体植込み用rfidタグ及びその挿入冶具体
JP5147345B2 (ja) 2006-09-29 2013-02-20 株式会社半導体エネルギー研究所 半導体装置
US7839124B2 (en) 2006-09-29 2010-11-23 Semiconductor Energy Laboratory Co., Ltd. Wireless power storage device comprising battery, semiconductor device including battery, and method for operating the wireless power storage device
JP2008113632A (ja) 2006-11-07 2008-05-22 Hitachi Ltd 生体植込用rfidタグおよびその挿入冶具体
WO2008123262A1 (en) 2007-03-26 2008-10-16 Semiconductor Energy Laboratory Co., Ltd. Individual management system
US7777631B2 (en) 2007-04-29 2010-08-17 James Neil Rodgers Body chip
US20120109255A1 (en) 2010-10-27 2012-05-03 National Tsing Hua University Retina Stimulation Apparatus and Manufacturing Method Thereof
US8954156B2 (en) 2010-10-27 2015-02-10 National Tsing Hua University Methods and apparatuses for configuring artificial retina devices
EP2632388B1 (en) 2010-10-27 2020-03-25 Iridium Medical Technology Co., Ltd Flexible artificial retina devices
US8530265B2 (en) 2010-10-27 2013-09-10 National Tsing Hua University Method of fabricating flexible artificial retina devices
US9114004B2 (en) 2010-10-27 2015-08-25 Iridium Medical Technology Co, Ltd. Flexible artificial retina devices
US8613135B2 (en) 2011-05-06 2013-12-24 National Tsing Hua University Method for non-planar chip assembly
KR101772255B1 (ko) 2011-05-06 2017-08-28 이리듐 메디칼 테크놀로지 컴퍼니 리미티드 비평면 집적 회로 디바이스
US9155881B2 (en) 2011-05-06 2015-10-13 Iridium Medical Technology Co, Ltd. Non-planar chip assembly
US10204898B2 (en) 2014-08-08 2019-02-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
JP2016111677A (ja) 2014-09-26 2016-06-20 株式会社半導体エネルギー研究所 半導体装置、無線センサ、及び電子機器
US10770729B2 (en) 2015-01-09 2020-09-08 Semiconductor Energy Laboratory Co., Ltd. Electrode, power storage device, and electronic equipment
WO2018073708A1 (en) * 2016-10-20 2018-04-26 Semiconductor Energy Laboratory Co., Ltd. Storage device, driving method thereof, semiconductor device, electronic component, and electronic device
DK201700432A1 (en) 2017-08-05 2019-04-16 Bluealert.dk ApS IoT human Microchip Implant with Data
JP2019079415A (ja) 2017-10-26 2019-05-23 京セラ株式会社 電子機器、制御装置、制御プログラム及び電子機器の動作方法
JP7110223B2 (ja) 2017-11-02 2022-08-01 株式会社半導体エネルギー研究所 給電装置およびその動作方法
WO2020056187A1 (en) 2018-09-14 2020-03-19 Neuralink Corp. Electrode fabrication and design
US11444056B2 (en) 2019-07-12 2022-09-13 Neuralink Corp. Sandwich assembly scheme for thin film electrode array and integrated circuits on both sides of printed circuit board (PCB) and method of manufacture
WO2021011401A1 (en) 2019-07-12 2021-01-21 Neuralink Corp. Brain implant with subcutaneous wireless relay and external wearable communication and power device
CN112085132B (zh) 2020-08-27 2025-08-22 浙江曜泰数智科技有限公司 一种用于获取动物体温的可植入rfid标签装置
CN212365034U (zh) 2020-08-27 2021-01-15 金华市金东区大堰河农牧场 一种用于检测温度的可植入rfid标签装置
WO2023038829A1 (en) 2021-09-09 2023-03-16 Neuralink Corp. Cell-based brain-machine interface
US11630516B1 (en) 2021-12-27 2023-04-18 Neuralink Corp. Brain-machine interface (BMI) with user interface (UI) aware controller
KR20240052612A (ko) 2022-10-14 2024-04-23 국민대학교산학협력단 무선전력 구동 기반의 임플란트 칩 장치
KR20240052611A (ko) 2022-10-14 2024-04-23 국민대학교산학협력단 체외 루프안테나 기반의 임플란트 칩 장치
CN219203493U (zh) 2023-03-16 2023-06-16 北京领创医谷科技发展有限责任公司 一种人体植入物的射频天线系统
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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008212652A (ja) * 2007-02-09 2008-09-18 Semiconductor Energy Lab Co Ltd 補助装置
JP2016001729A (ja) * 2014-05-22 2016-01-07 株式会社半導体エネルギー研究所 半導体装置、健康管理システム
JP2018129046A (ja) * 2017-02-08 2018-08-16 株式会社半導体エネルギー研究所 Aiシステム
JP2019046199A (ja) * 2017-09-01 2019-03-22 株式会社半導体エネルギー研究所 プロセッサ、および電子機器

Also Published As

Publication number Publication date
DE112021002788T5 (de) 2023-04-27
JP7624980B2 (ja) 2025-01-31
JP2025188138A (ja) 2025-12-25
KR20230011931A (ko) 2023-01-25
CN115606008A (zh) 2023-01-13
WO2021229374A1 (ja) 2021-11-18
JP7756818B2 (ja) 2025-10-20
US20230178654A1 (en) 2023-06-08
JP2025066126A (ja) 2025-04-22
US12581693B2 (en) 2026-03-17

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