JPWO2021229374A5 - - Google Patents

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Publication number
JPWO2021229374A5
JPWO2021229374A5 JP2022522080A JP2022522080A JPWO2021229374A5 JP WO2021229374 A5 JPWO2021229374 A5 JP WO2021229374A5 JP 2022522080 A JP2022522080 A JP 2022522080A JP 2022522080 A JP2022522080 A JP 2022522080A JP WO2021229374 A5 JPWO2021229374 A5 JP WO2021229374A5
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Japan
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unit
function
semiconductor device
communication unit
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JP2022522080A
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English (en)
Japanese (ja)
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JP7624980B2 (ja
JPWO2021229374A1 (https=
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Priority claimed from PCT/IB2021/053820 external-priority patent/WO2021229374A1/ja
Publication of JPWO2021229374A1 publication Critical patent/JPWO2021229374A1/ja
Publication of JPWO2021229374A5 publication Critical patent/JPWO2021229374A5/ja
Priority to JP2025008562A priority Critical patent/JP7756818B2/ja
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Publication of JP7624980B2 publication Critical patent/JP7624980B2/ja
Priority to JP2025169402A priority patent/JP2025188138A/ja
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JP2022522080A 2020-05-15 2021-05-06 半導体装置 Active JP7624980B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2025008562A JP7756818B2 (ja) 2020-05-15 2025-01-21 半導体装置
JP2025169402A JP2025188138A (ja) 2020-05-15 2025-10-07 半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020086266 2020-05-15
JP2020086266 2020-05-15
PCT/IB2021/053820 WO2021229374A1 (ja) 2020-05-15 2021-05-06 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025008562A Division JP7756818B2 (ja) 2020-05-15 2025-01-21 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2021229374A1 JPWO2021229374A1 (https=) 2021-11-18
JPWO2021229374A5 true JPWO2021229374A5 (https=) 2024-05-01
JP7624980B2 JP7624980B2 (ja) 2025-01-31

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ID=78525457

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2022522080A Active JP7624980B2 (ja) 2020-05-15 2021-05-06 半導体装置
JP2025008562A Active JP7756818B2 (ja) 2020-05-15 2025-01-21 半導体装置
JP2025169402A Pending JP2025188138A (ja) 2020-05-15 2025-10-07 半導体装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2025008562A Active JP7756818B2 (ja) 2020-05-15 2025-01-21 半導体装置
JP2025169402A Pending JP2025188138A (ja) 2020-05-15 2025-10-07 半導体装置

Country Status (6)

Country Link
US (1) US12581693B2 (https=)
JP (3) JP7624980B2 (https=)
KR (1) KR20230011931A (https=)
CN (1) CN115606008A (https=)
DE (1) DE112021002788T5 (https=)
WO (1) WO2021229374A1 (https=)

Family Cites Families (40)

* Cited by examiner, † Cited by third party
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JP2016111677A (ja) 2014-09-26 2016-06-20 株式会社半導体エネルギー研究所 半導体装置、無線センサ、及び電子機器
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CN212365034U (zh) 2020-08-27 2021-01-15 金华市金东区大堰河农牧场 一种用于检测温度的可植入rfid标签装置
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