KR20230011931A - 반도체 장치 - Google Patents

반도체 장치 Download PDF

Info

Publication number
KR20230011931A
KR20230011931A KR1020227038307A KR20227038307A KR20230011931A KR 20230011931 A KR20230011931 A KR 20230011931A KR 1020227038307 A KR1020227038307 A KR 1020227038307A KR 20227038307 A KR20227038307 A KR 20227038307A KR 20230011931 A KR20230011931 A KR 20230011931A
Authority
KR
South Korea
Prior art keywords
insulator
oxide
conductor
transistor
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020227038307A
Other languages
English (en)
Korean (ko)
Inventor
슌페이 야마자키
šœ페이 야마자키
다카유키 이케다
다츠야 오누키
유토 야쿠보
Original Assignee
가부시키가이샤 한도오따이 에네루기 켄큐쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 한도오따이 에네루기 켄큐쇼 filed Critical 가부시키가이샤 한도오따이 에네루기 켄큐쇼
Publication of KR20230011931A publication Critical patent/KR20230011931A/ko
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D88/00Three-dimensional [3D] integrated devices
    • H01L27/0688
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00Error detection; Error correction; Monitoring
    • G06F11/07Responding to the occurrence of a fault, e.g. fault tolerance
    • G06F11/14Error detection or correction of the data by redundancy in operations
    • G06F11/1402Saving, restoring, recovering or retrying
    • G06F11/1415Saving, restoring, recovering or retrying at system level
    • G06F11/1441Resetting or repowering
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/30Authentication, i.e. establishing the identity or authorisation of security principals
    • G06F21/31User authentication
    • G06F21/34User authentication involving the use of external additional devices, e.g. dongles or smart cards
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F7/00Methods or arrangements for processing data by operating upon the order or content of the data handled
    • G06F7/38Methods or arrangements for performing computations using exclusively denominational number representation, e.g. using binary, ternary, decimal representation
    • G06F7/48Methods or arrangements for performing computations using exclusively denominational number representation, e.g. using binary, ternary, decimal representation using non-contact-making devices, e.g. tube, solid state device; using unspecified devices
    • G06F7/544Methods or arrangements for performing computations using exclusively denominational number representation, e.g. using binary, ternary, decimal representation using non-contact-making devices, e.g. tube, solid state device; using unspecified devices for evaluating functions by calculation
    • G06F7/5443Sum of products
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06QINFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q50/00Information and communication technology [ICT] specially adapted for implementation of business processes of specific business sectors, e.g. utilities or tourism
    • G06Q50/10Services
    • G06Q50/26Government or public services
    • G06Q50/265Personal security, identity or safety
    • H01L29/7869
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/40Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/481Encapsulations, e.g. protective coatings characterised by their materials comprising semiconductor materials
    • GPHYSICS
    • G16INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR SPECIFIC APPLICATION FIELDS
    • G16HHEALTHCARE INFORMATICS, i.e. INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR THE HANDLING OR PROCESSING OF MEDICAL OR HEALTHCARE DATA
    • G16H40/00ICT specially adapted for the management or administration of healthcare resources or facilities; ICT specially adapted for the management or operation of medical equipment or devices
    • G16H40/60ICT specially adapted for the management or administration of healthcare resources or facilities; ICT specially adapted for the management or operation of medical equipment or devices for the operation of medical equipment or devices
    • G16H40/67ICT specially adapted for the management or administration of healthcare resources or facilities; ICT specially adapted for the management or operation of medical equipment or devices for the operation of medical equipment or devices for remote operation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6733Multi-gate TFTs
    • H10D30/6734Multi-gate TFTs having gate electrodes arranged on both top and bottom sides of the channel, e.g. dual-gate TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/02Manufacture or treatment characterised by using material-based technologies
    • H10D84/08Manufacture or treatment characterised by using material-based technologies using combinations of technologies, e.g. using both Si and SiC technologies or using both Si and Group III-V technologies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D87/00Integrated devices comprising both bulk components and either SOI or SOS components on the same substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Security & Cryptography (AREA)
  • General Engineering & Computer Science (AREA)
  • Business, Economics & Management (AREA)
  • Tourism & Hospitality (AREA)
  • Computer Hardware Design (AREA)
  • Software Systems (AREA)
  • Mathematical Analysis (AREA)
  • Computational Mathematics (AREA)
  • Computing Systems (AREA)
  • Mathematical Optimization (AREA)
  • Pure & Applied Mathematics (AREA)
  • Economics (AREA)
  • Health & Medical Sciences (AREA)
  • Strategic Management (AREA)
  • Primary Health Care (AREA)
  • Marketing (AREA)
  • Human Resources & Organizations (AREA)
  • General Health & Medical Sciences (AREA)
  • General Business, Economics & Management (AREA)
  • Educational Administration (AREA)
  • Development Economics (AREA)
  • Quality & Reliability (AREA)
  • Thin Film Transistor (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
KR1020227038307A 2020-05-15 2021-05-06 반도체 장치 Pending KR20230011931A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-086266 2020-05-15
JP2020086266 2020-05-15
PCT/IB2021/053820 WO2021229374A1 (ja) 2020-05-15 2021-05-06 半導体装置

Publications (1)

Publication Number Publication Date
KR20230011931A true KR20230011931A (ko) 2023-01-25

Family

ID=78525457

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227038307A Pending KR20230011931A (ko) 2020-05-15 2021-05-06 반도체 장치

Country Status (6)

Country Link
US (1) US12581693B2 (https=)
JP (3) JP7624980B2 (https=)
KR (1) KR20230011931A (https=)
CN (1) CN115606008A (https=)
DE (1) DE112021002788T5 (https=)
WO (1) WO2021229374A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019079415A (ja) 2017-10-26 2019-05-23 京セラ株式会社 電子機器、制御装置、制御プログラム及び電子機器の動作方法

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101180641B (zh) 2005-01-31 2012-02-08 株式会社半导体能源研究所 半导体器件及其制造方法
US7732241B2 (en) 2005-11-30 2010-06-08 Semiconductor Energy Labortory Co., Ltd. Microstructure and manufacturing method thereof and microelectromechanical system
DE102006008258B4 (de) 2006-02-22 2012-01-26 Siemens Ag System zur Identifikation eines medizinischen Implantats
US20080076974A1 (en) 2006-04-28 2008-03-27 Semiconductor Energy Laboratory Co., Ltd. Biological information detection sensor device
JP2008043302A (ja) 2006-08-21 2008-02-28 Hitachi Ltd 生体植込み用rfidタグ及びその挿入冶具体
JP5147345B2 (ja) 2006-09-29 2013-02-20 株式会社半導体エネルギー研究所 半導体装置
US7839124B2 (en) 2006-09-29 2010-11-23 Semiconductor Energy Laboratory Co., Ltd. Wireless power storage device comprising battery, semiconductor device including battery, and method for operating the wireless power storage device
JP2008113632A (ja) 2006-11-07 2008-05-22 Hitachi Ltd 生体植込用rfidタグおよびその挿入冶具体
EP1955679B1 (en) 2007-02-09 2013-11-06 Semiconductor Energy Laboratory Co., Ltd. Assist device
WO2008123262A1 (en) 2007-03-26 2008-10-16 Semiconductor Energy Laboratory Co., Ltd. Individual management system
US7777631B2 (en) 2007-04-29 2010-08-17 James Neil Rodgers Body chip
US20120109255A1 (en) 2010-10-27 2012-05-03 National Tsing Hua University Retina Stimulation Apparatus and Manufacturing Method Thereof
US8954156B2 (en) 2010-10-27 2015-02-10 National Tsing Hua University Methods and apparatuses for configuring artificial retina devices
EP2632388B1 (en) 2010-10-27 2020-03-25 Iridium Medical Technology Co., Ltd Flexible artificial retina devices
US8530265B2 (en) 2010-10-27 2013-09-10 National Tsing Hua University Method of fabricating flexible artificial retina devices
US9114004B2 (en) 2010-10-27 2015-08-25 Iridium Medical Technology Co, Ltd. Flexible artificial retina devices
US8613135B2 (en) 2011-05-06 2013-12-24 National Tsing Hua University Method for non-planar chip assembly
KR101772255B1 (ko) 2011-05-06 2017-08-28 이리듐 메디칼 테크놀로지 컴퍼니 리미티드 비평면 집적 회로 디바이스
US9155881B2 (en) 2011-05-06 2015-10-13 Iridium Medical Technology Co, Ltd. Non-planar chip assembly
JP6580863B2 (ja) 2014-05-22 2019-09-25 株式会社半導体エネルギー研究所 半導体装置、健康管理システム
US10204898B2 (en) 2014-08-08 2019-02-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
JP2016111677A (ja) 2014-09-26 2016-06-20 株式会社半導体エネルギー研究所 半導体装置、無線センサ、及び電子機器
US10770729B2 (en) 2015-01-09 2020-09-08 Semiconductor Energy Laboratory Co., Ltd. Electrode, power storage device, and electronic equipment
WO2018073708A1 (en) * 2016-10-20 2018-04-26 Semiconductor Energy Laboratory Co., Ltd. Storage device, driving method thereof, semiconductor device, electronic component, and electronic device
JP2018129046A (ja) 2017-02-08 2018-08-16 株式会社半導体エネルギー研究所 Aiシステム
DK201700432A1 (en) 2017-08-05 2019-04-16 Bluealert.dk ApS IoT human Microchip Implant with Data
JP2019046199A (ja) * 2017-09-01 2019-03-22 株式会社半導体エネルギー研究所 プロセッサ、および電子機器
JP7110223B2 (ja) 2017-11-02 2022-08-01 株式会社半導体エネルギー研究所 給電装置およびその動作方法
WO2020056187A1 (en) 2018-09-14 2020-03-19 Neuralink Corp. Electrode fabrication and design
US11444056B2 (en) 2019-07-12 2022-09-13 Neuralink Corp. Sandwich assembly scheme for thin film electrode array and integrated circuits on both sides of printed circuit board (PCB) and method of manufacture
WO2021011401A1 (en) 2019-07-12 2021-01-21 Neuralink Corp. Brain implant with subcutaneous wireless relay and external wearable communication and power device
CN112085132B (zh) 2020-08-27 2025-08-22 浙江曜泰数智科技有限公司 一种用于获取动物体温的可植入rfid标签装置
CN212365034U (zh) 2020-08-27 2021-01-15 金华市金东区大堰河农牧场 一种用于检测温度的可植入rfid标签装置
WO2023038829A1 (en) 2021-09-09 2023-03-16 Neuralink Corp. Cell-based brain-machine interface
US11630516B1 (en) 2021-12-27 2023-04-18 Neuralink Corp. Brain-machine interface (BMI) with user interface (UI) aware controller
KR20240052612A (ko) 2022-10-14 2024-04-23 국민대학교산학협력단 무선전력 구동 기반의 임플란트 칩 장치
KR20240052611A (ko) 2022-10-14 2024-04-23 국민대학교산학협력단 체외 루프안테나 기반의 임플란트 칩 장치
CN219203493U (zh) 2023-03-16 2023-06-16 北京领创医谷科技发展有限责任公司 一种人体植入物的射频天线系统
EP4491215A1 (en) 2023-07-10 2025-01-15 BIOTRONIK SE & Co. KG Implant communication system, manufacturing method and implant programming device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019079415A (ja) 2017-10-26 2019-05-23 京セラ株式会社 電子機器、制御装置、制御プログラム及び電子機器の動作方法

Also Published As

Publication number Publication date
DE112021002788T5 (de) 2023-04-27
JP7624980B2 (ja) 2025-01-31
JP2025188138A (ja) 2025-12-25
CN115606008A (zh) 2023-01-13
WO2021229374A1 (ja) 2021-11-18
JPWO2021229374A1 (https=) 2021-11-18
JP7756818B2 (ja) 2025-10-20
US20230178654A1 (en) 2023-06-08
JP2025066126A (ja) 2025-04-22
US12581693B2 (en) 2026-03-17

Similar Documents

Publication Publication Date Title
JP7144483B2 (ja) 半導体装置
KR102876210B1 (ko) 반도체 장치
JP2023152817A (ja) 半導体装置
JP2025065240A (ja) 半導体装置
JP7829754B2 (ja) 半導体装置
CN110462803B (zh) 半导体装置及半导体装置的制造方法
JP7756818B2 (ja) 半導体装置
KR20230069128A (ko) 반도체 장치의 구동 방법
JP7583046B2 (ja) 半導体装置
US12592269B2 (en) Semiconductor device, display apparatus, data processing system, and control system of the semiconductor device
US20250208999A1 (en) Semiconductor device
JP7651555B2 (ja) 半導体装置
CN121510590A (zh) 存储阵列及其制备方法、存储器、电子设备
WO2024201206A1 (ja) 半導体装置
WO2024013604A1 (ja) 半導体装置
CN118401927A (zh) 半导体装置、显示装置、数据处理系统以及半导体装置的控制系统

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20221101

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20240429

Comment text: Request for Examination of Application