DE112015002348T5 - Halbleitervorrichtung für elektrische Energie - Google Patents

Halbleitervorrichtung für elektrische Energie Download PDF

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Publication number
DE112015002348T5
DE112015002348T5 DE112015002348.8T DE112015002348T DE112015002348T5 DE 112015002348 T5 DE112015002348 T5 DE 112015002348T5 DE 112015002348 T DE112015002348 T DE 112015002348T DE 112015002348 T5 DE112015002348 T5 DE 112015002348T5
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Germany
Prior art keywords
electric power
semiconductor device
lead terminal
electrical energy
electrode
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Pending
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DE112015002348.8T
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German (de)
English (en)
Inventor
Masayoshi Shinkai
Hiroyuki Harada
Junji Fujino
Mikio Ishihara
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication date
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Publication of DE112015002348T5 publication Critical patent/DE112015002348T5/de
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    • H—ELECTRICITY
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    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/479—Leadframes on or in insulating or insulated package substrates, interposers, or redistribution layers
    • H—ELECTRICITY
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
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    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
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    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
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    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
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    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
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    • H10W72/07331—Connecting techniques
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    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/075—Connecting or disconnecting of bond wires
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07636—Soldering or alloying
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    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/551—Materials of bond wires
    • H10W72/555—Materials of bond wires of outermost layers of multilayered bond wires, e.g. material of a coating
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/652—Materials of strap connectors comprising metals or metalloids, e.g. silver
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/651—Materials of strap connectors
    • H10W72/655—Materials of strap connectors of outermost layers of multilayered strap connectors, e.g. material of a coating
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    • H10W72/853—On the same surface
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    • H10W72/853—On the same surface
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    • H10W76/10—Containers or parts thereof
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    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
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    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
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    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/755—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a laterally-adjacent insulating package substrate, interpose or RDL
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    • H10W90/00—Package configurations
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    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE112015002348.8T 2014-05-20 2015-05-15 Halbleitervorrichtung für elektrische Energie Pending DE112015002348T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014103985 2014-05-20
JP2014-103985 2014-05-20
PCT/JP2015/063993 WO2015178296A1 (ja) 2014-05-20 2015-05-15 電力用半導体装置

Publications (1)

Publication Number Publication Date
DE112015002348T5 true DE112015002348T5 (de) 2017-02-16

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DE112015002348.8T Pending DE112015002348T5 (de) 2014-05-20 2015-05-15 Halbleitervorrichtung für elektrische Energie

Country Status (5)

Country Link
US (1) US10658284B2 (https=)
JP (2) JP6316412B2 (https=)
CN (2) CN106104779B (https=)
DE (1) DE112015002348T5 (https=)
WO (1) WO2015178296A1 (https=)

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DE102022100931B4 (de) 2021-02-24 2025-08-28 Mitsubishi Electric Corporation Halbleitervorrichtung und Verfahren zu deren Herstellung

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DE202016101688U1 (de) * 2016-03-30 2016-04-21 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit einem Schaltungsträger
JP6759784B2 (ja) * 2016-07-12 2020-09-23 三菱電機株式会社 半導体モジュール
JP6717103B2 (ja) * 2016-08-03 2020-07-01 株式会社豊田自動織機 半導体モジュール
JP6907670B2 (ja) * 2017-04-17 2021-07-21 三菱電機株式会社 半導体装置および半導体装置の製造方法
DE112017008277B4 (de) 2017-12-13 2025-03-13 Mitsubishi Electric Corporation Halbleitervorrichtung und leistungsumwandlungsvorrichtung
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CN110914981B (zh) * 2018-05-29 2023-06-16 新电元工业株式会社 半导体模块
JP7091878B2 (ja) * 2018-06-22 2022-06-28 三菱電機株式会社 パワーモジュール、電力変換装置、及びパワーモジュールの製造方法
JP6457144B1 (ja) * 2018-09-19 2019-01-23 株式会社加藤電器製作所 半導体モジュール
CN111627864B (zh) * 2020-06-03 2022-06-07 西安卫光科技有限公司 一种高结温SiC陶瓷封装硅堆外壳结构
CN117836928A (zh) * 2021-08-18 2024-04-05 三菱电机株式会社 半导体装置
JP7811033B2 (ja) * 2024-07-11 2026-02-04 大分デバイステクノロジー株式会社 パワー半導体デバイスの製造方法

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JP2007184525A (ja) 2005-12-07 2007-07-19 Mitsubishi Electric Corp 電子機器装置
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CN111725167A (zh) * 2019-03-20 2020-09-29 株式会社东芝 功率模块
DE102020202957B4 (de) 2019-03-20 2023-08-24 Kabushiki Kaisha Toshiba Leistungsmodul
DE102022100931B4 (de) 2021-02-24 2025-08-28 Mitsubishi Electric Corporation Halbleitervorrichtung und Verfahren zu deren Herstellung

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CN110120375A (zh) 2019-08-13
JPWO2015178296A1 (ja) 2017-04-20
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JP6316412B2 (ja) 2018-04-25
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