DE112014000633A5 - Halbleiterschichtenfolge und Verfahren zur Herstellung einer Halbleiterschichtenfolge - Google Patents
Halbleiterschichtenfolge und Verfahren zur Herstellung einer Halbleiterschichtenfolge Download PDFInfo
- Publication number
- DE112014000633A5 DE112014000633A5 DE112014000633.5T DE112014000633T DE112014000633A5 DE 112014000633 A5 DE112014000633 A5 DE 112014000633A5 DE 112014000633 T DE112014000633 T DE 112014000633T DE 112014000633 A5 DE112014000633 A5 DE 112014000633A5
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- 239000004065 semiconductor Substances 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0075—Processes for devices with an active region comprising only III-V compounds comprising nitride compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/0304—Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L31/03044—Inorganic materials including, apart from doping materials or other impurities, only AIIIBV compounds comprising a nitride compounds, e.g. GaN
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035272—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/184—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP
- H01L31/1856—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP comprising nitride compounds, e.g. GaN
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1892—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof methods involving the use of temporary, removable substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/0004—Devices characterised by their operation
- H01L33/002—Devices characterised by their operation having heterojunctions or graded gap
- H01L33/0025—Devices characterised by their operation having heterojunctions or graded gap comprising only AIIIBV compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/025—Physical imperfections, e.g. particular concentration or distribution of impurities
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/12—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a stress relaxation structure, e.g. buffer layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Led Devices (AREA)
- Light Receiving Elements (AREA)
- Recrystallisation Techniques (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013101000.8 | 2013-01-31 | ||
DE102013101000 | 2013-01-31 | ||
PCT/EP2014/051607 WO2014118162A1 (de) | 2013-01-31 | 2014-01-28 | Halbleiterschichtenfolge und verfahren zur herstellung einer halbleiterschichtenfolge |
Publications (2)
Publication Number | Publication Date |
---|---|
DE112014000633A5 true DE112014000633A5 (de) | 2015-10-08 |
DE112014000633B4 DE112014000633B4 (de) | 2020-03-26 |
Family
ID=50030284
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE112014000633.5T Active DE112014000633B4 (de) | 2013-01-31 | 2014-01-28 | Halbleiterschichtenfolge und Verfahren zur Herstellung einer Halbleiterschichtenfolge |
Country Status (6)
Country | Link |
---|---|
US (1) | US9806224B2 (de) |
JP (2) | JP6165884B2 (de) |
KR (1) | KR20150113137A (de) |
CN (2) | CN104956498B (de) |
DE (1) | DE112014000633B4 (de) |
WO (1) | WO2014118162A1 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150113137A (ko) * | 2013-01-31 | 2015-10-07 | 오스람 옵토 세미컨덕터스 게엠베하 | 반도체층 시퀀스 및 반도체층 시퀀스의 제조 방법 |
DE102014105303A1 (de) | 2014-04-14 | 2015-10-15 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer Schichtstruktur als Pufferschicht eines Halbleiterbauelements sowie Schichtstruktur als Pufferschicht eines Halbleiterbauelements |
DE102016110041A1 (de) * | 2016-05-31 | 2017-11-30 | Osram Opto Semiconductors Gmbh | Bauelement zum Detektieren von UV-Strahlung und Verfahren zur Herstellung eines Bauelements |
DE102016120335A1 (de) | 2016-10-25 | 2018-04-26 | Osram Opto Semiconductors Gmbh | Halbleiterschichtenfolge und Verfahren zur Herstellung einer Halbleiterschichtenfolge |
DE102016120419A1 (de) | 2016-10-26 | 2018-04-26 | Osram Opto Semiconductors Gmbh | Halbleiterkörper |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH03264314A (ja) | 1990-03-15 | 1991-11-25 | Mitsubishi Petrochem Co Ltd | 繊維強化熱可塑性樹脂成形体の製造法 |
JP3557876B2 (ja) * | 1997-10-10 | 2004-08-25 | 豊田合成株式会社 | GaN系半導体素子及びその製造方法 |
EP1071143A4 (de) | 1997-12-08 | 2004-06-30 | Mitsubishi Cable Ind Ltd | LICHTEMITTIERENDE VORRICHTUNG AUF GaN BASIS UND VERFAHREN ZUR HERSTELLUNG EINES GaN KRISTALLS |
JP2000068598A (ja) * | 1998-08-20 | 2000-03-03 | Hitachi Ltd | 半導体装置 |
CN1322597C (zh) * | 1999-08-23 | 2007-06-20 | 日本板硝子株式会社 | 发光闸流晶体管及自扫描型发光装置 |
JP4145437B2 (ja) * | 1999-09-28 | 2008-09-03 | 住友電気工業株式会社 | 単結晶GaNの結晶成長方法及び単結晶GaN基板の製造方法と単結晶GaN基板 |
JP4432180B2 (ja) * | 1999-12-24 | 2010-03-17 | 豊田合成株式会社 | Iii族窒化物系化合物半導体の製造方法、iii族窒化物系化合物半導体素子及びiii族窒化物系化合物半導体 |
TW518767B (en) * | 2000-03-31 | 2003-01-21 | Toyoda Gosei Kk | Production method of III nitride compound semiconductor and III nitride compound semiconductor element |
US6495894B2 (en) * | 2000-05-22 | 2002-12-17 | Ngk Insulators, Ltd. | Photonic device, a substrate for fabricating a photonic device, a method for fabricating the photonic device and a method for manufacturing the photonic device-fabricating substrate |
JP3866540B2 (ja) * | 2001-07-06 | 2007-01-10 | 株式会社東芝 | 窒化物半導体素子およびその製造方法 |
DE20122426U1 (de) * | 2001-10-13 | 2005-11-10 | Azzurro Semiconductors Ag | Gruppe-III-Nitrid-basierte Lichtemitterstruktur auf Silizium Substrat |
JP3960815B2 (ja) | 2002-02-12 | 2007-08-15 | シャープ株式会社 | 半導体発光素子 |
JP2003264314A (ja) * | 2002-03-11 | 2003-09-19 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
JP4332720B2 (ja) * | 2003-11-28 | 2009-09-16 | サンケン電気株式会社 | 半導体素子形成用板状基体の製造方法 |
JP4182935B2 (ja) * | 2004-08-25 | 2008-11-19 | 住友電気工業株式会社 | 窒化ガリウムの結晶成長方法および窒化ガリウム基板の製造方法 |
JP2008060331A (ja) * | 2006-08-31 | 2008-03-13 | Rohm Co Ltd | 半導体発光素子 |
US7825432B2 (en) * | 2007-03-09 | 2010-11-02 | Cree, Inc. | Nitride semiconductor structures with interlayer structures |
US8362503B2 (en) * | 2007-03-09 | 2013-01-29 | Cree, Inc. | Thick nitride semiconductor structures with interlayer structures |
DE102007019776A1 (de) | 2007-04-26 | 2008-10-30 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung einer Mehrzahl optoelektronischer Bauelemente |
DE102007029370A1 (de) * | 2007-05-04 | 2008-11-06 | Osram Opto Semiconductors Gmbh | Halbleiterchip und Verfahren zur Herstellung eines Halbleiterchips |
CN101369620A (zh) * | 2008-06-17 | 2009-02-18 | 华南师范大学 | 在硅衬底上实现氮化镓薄膜低温沉积的方法 |
KR101047617B1 (ko) * | 2009-05-21 | 2011-07-07 | 엘지이노텍 주식회사 | 반도체 발광소자 및 그 제조방법 |
US20110057213A1 (en) * | 2009-09-08 | 2011-03-10 | Koninklijke Philips Electronics N.V. | Iii-nitride light emitting device with curvat1jre control layer |
JP5689245B2 (ja) * | 2010-04-08 | 2015-03-25 | パナソニック株式会社 | 窒化物半導体素子 |
CN102237454A (zh) * | 2010-04-29 | 2011-11-09 | 展晶科技(深圳)有限公司 | 半导体光电元件及其制造方法 |
JP2012074665A (ja) | 2010-09-01 | 2012-04-12 | Hitachi Cable Ltd | 発光ダイオード |
KR20120032329A (ko) * | 2010-09-28 | 2012-04-05 | 삼성전자주식회사 | 반도체 소자 |
JP2012094752A (ja) | 2010-10-28 | 2012-05-17 | Shogen Koden Kofun Yugenkoshi | 光電素子及びその製造方法 |
JP5749487B2 (ja) | 2010-12-21 | 2015-07-15 | 株式会社東芝 | 窒化物半導体の積層体及びその製造方法 |
US8525194B2 (en) * | 2011-05-16 | 2013-09-03 | Kabushiki Kaisha Toshiba | Nitride semiconductor device, nitride semiconductor wafer and method for manufacturing nitride semiconductor layer |
JP5911727B2 (ja) | 2011-05-16 | 2016-04-27 | 株式会社東芝 | 窒化物半導体素子、窒化物半導体ウェーハ及び窒化物半導体層の製造方法 |
JP5127978B1 (ja) * | 2011-09-08 | 2013-01-23 | 株式会社東芝 | 窒化物半導体素子、窒化物半導体ウェーハ及び窒化物半導体層の製造方法 |
KR20150113137A (ko) * | 2013-01-31 | 2015-10-07 | 오스람 옵토 세미컨덕터스 게엠베하 | 반도체층 시퀀스 및 반도체층 시퀀스의 제조 방법 |
-
2014
- 2014-01-28 KR KR1020157023495A patent/KR20150113137A/ko not_active Application Discontinuation
- 2014-01-28 CN CN201480006555.5A patent/CN104956498B/zh active Active
- 2014-01-28 WO PCT/EP2014/051607 patent/WO2014118162A1/de active Application Filing
- 2014-01-28 DE DE112014000633.5T patent/DE112014000633B4/de active Active
- 2014-01-28 JP JP2015555676A patent/JP6165884B2/ja active Active
- 2014-01-28 US US14/763,464 patent/US9806224B2/en active Active
- 2014-01-28 CN CN201710350908.9A patent/CN107275425B/zh active Active
-
2017
- 2017-06-21 JP JP2017121165A patent/JP2017208554A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
CN104956498B (zh) | 2017-06-13 |
CN107275425A (zh) | 2017-10-20 |
KR20150113137A (ko) | 2015-10-07 |
DE112014000633B4 (de) | 2020-03-26 |
JP2017208554A (ja) | 2017-11-24 |
WO2014118162A1 (de) | 2014-08-07 |
JP6165884B2 (ja) | 2017-07-19 |
US20150364641A1 (en) | 2015-12-17 |
CN104956498A (zh) | 2015-09-30 |
JP2016511537A (ja) | 2016-04-14 |
CN107275425B (zh) | 2019-10-15 |
US9806224B2 (en) | 2017-10-31 |
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