DE112014001679A5 - Optoelektronischer Halbleiterchip mit einer ALD-Schicht verkapselt und entsprechendes Verfahren zur Herstellung - Google Patents

Optoelektronischer Halbleiterchip mit einer ALD-Schicht verkapselt und entsprechendes Verfahren zur Herstellung Download PDF

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Publication number
DE112014001679A5
DE112014001679A5 DE112014001679.9T DE112014001679T DE112014001679A5 DE 112014001679 A5 DE112014001679 A5 DE 112014001679A5 DE 112014001679 T DE112014001679 T DE 112014001679T DE 112014001679 A5 DE112014001679 A5 DE 112014001679A5
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Prior art keywords
production
semiconductor chip
corresponding method
optoelectronic semiconductor
ald layer
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Pending
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DE112014001679.9T
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English (en)
Inventor
Karl Engl
Markus Maute
Georg Hartung
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Ams Osram International GmbH
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Osram Opto Semiconductors GmbH
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Publication of DE112014001679A5 publication Critical patent/DE112014001679A5/de
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40—Materials therefor
    • H01L33/405—Reflective materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H01L33/382—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending partially in or entirely through the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0025—Processes relating to coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
DE112014001679.9T 2013-03-26 2014-03-14 Optoelektronischer Halbleiterchip mit einer ALD-Schicht verkapselt und entsprechendes Verfahren zur Herstellung Pending DE112014001679A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013103079.3 2013-03-26
DE102013103079.3A DE102013103079A1 (de) 2013-03-26 2013-03-26 Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips
PCT/EP2014/055110 WO2014154503A1 (de) 2013-03-26 2014-03-14 Optoelektronischer halbleiterchip mit einer ald-schicht verkapselt und entsprechendes verfahren zur herstellung

Publications (1)

Publication Number Publication Date
DE112014001679A5 true DE112014001679A5 (de) 2015-12-24

Family

ID=50277245

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102013103079.3A Withdrawn DE102013103079A1 (de) 2013-03-26 2013-03-26 Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips
DE112014001679.9T Pending DE112014001679A5 (de) 2013-03-26 2014-03-14 Optoelektronischer Halbleiterchip mit einer ALD-Schicht verkapselt und entsprechendes Verfahren zur Herstellung

Family Applications Before (1)

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DE102013103079.3A Withdrawn DE102013103079A1 (de) 2013-03-26 2013-03-26 Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips

Country Status (4)

Country Link
US (1) US20160005930A1 (de)
CN (1) CN105308762B (de)
DE (2) DE102013103079A1 (de)
WO (1) WO2014154503A1 (de)

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US20160005930A1 (en) 2016-01-07
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CN105308762A (zh) 2016-02-03

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