DE112013001486T5 - Chipwiderstand zur einbettung in eine leiterplatte und verfahren zu dessen herstellung - Google Patents

Chipwiderstand zur einbettung in eine leiterplatte und verfahren zu dessen herstellung Download PDF

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Publication number
DE112013001486T5
DE112013001486T5 DE201311001486 DE112013001486T DE112013001486T5 DE 112013001486 T5 DE112013001486 T5 DE 112013001486T5 DE 201311001486 DE201311001486 DE 201311001486 DE 112013001486 T DE112013001486 T DE 112013001486T DE 112013001486 T5 DE112013001486 T5 DE 112013001486T5
Authority
DE
Germany
Prior art keywords
internal electrode
substrate
internal
electrode
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE201311001486
Other languages
German (de)
English (en)
Inventor
c/o Koa Corp. Toyoda Motohisa
c/o Koa Corp. Maeda Yukinori
c/o Koa Corp. Karasawa Hidekazu
c/o Koa Corp. Aruga Katsumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koa Corp
Original Assignee
Koa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koa Corp filed Critical Koa Corp
Publication of DE112013001486T5 publication Critical patent/DE112013001486T5/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/097—Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Non-Adjustable Resistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
DE201311001486 2012-03-16 2013-03-13 Chipwiderstand zur einbettung in eine leiterplatte und verfahren zu dessen herstellung Withdrawn DE112013001486T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-059919 2012-03-16
JP2012059919 2012-03-16
PCT/JP2013/057055 WO2013137338A1 (ja) 2012-03-16 2013-03-13 基板内蔵用チップ抵抗器およびその製造方法

Publications (1)

Publication Number Publication Date
DE112013001486T5 true DE112013001486T5 (de) 2014-11-27

Family

ID=49161243

Family Applications (1)

Application Number Title Priority Date Filing Date
DE201311001486 Withdrawn DE112013001486T5 (de) 2012-03-16 2013-03-13 Chipwiderstand zur einbettung in eine leiterplatte und verfahren zu dessen herstellung

Country Status (4)

Country Link
JP (1) JPWO2013137338A1 (zh)
CN (1) CN104160459A (zh)
DE (1) DE112013001486T5 (zh)
WO (1) WO2013137338A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6503943B2 (ja) * 2015-07-10 2019-04-24 株式会社村田製作所 複合電子部品および抵抗素子
US10083781B2 (en) 2015-10-30 2018-09-25 Vishay Dale Electronics, Llc Surface mount resistors and methods of manufacturing same
US10839989B2 (en) * 2016-09-27 2020-11-17 Panasonic Intellectual Property Management Co., Ltd. Chip resistor
US10438729B2 (en) 2017-11-10 2019-10-08 Vishay Dale Electronics, Llc Resistor with upper surface heat dissipation
JP7209140B2 (ja) * 2018-07-05 2023-01-20 パナソニックＩｐマネジメント株式会社 チップ抵抗器
WO2020162266A1 (ja) * 2019-02-07 2020-08-13 ローム株式会社 抵抗器

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2668375B2 (ja) * 1988-01-25 1997-10-27 ティーディーケイ株式会社 回路部品の電極製造方法
JP2545077Y2 (ja) * 1991-08-09 1997-08-25 コーア株式会社 チツプ形抵抗器
JPH07169601A (ja) * 1993-12-16 1995-07-04 Matsushita Electric Ind Co Ltd 角形チップ抵抗器およびその製造方法
JP3967272B2 (ja) * 2003-02-25 2007-08-29 ローム株式会社 チップ抵抗器
JP4295202B2 (ja) * 2004-11-30 2009-07-15 太陽社電気株式会社 チップ部品及びチップ部品の製造方法
JP2006186064A (ja) * 2004-12-27 2006-07-13 Koa Corp チップ抵抗器
JP4697037B2 (ja) * 2006-05-09 2011-06-08 株式会社デンソー 部品内蔵基板及びその配線不良検査方法
JP5261947B2 (ja) * 2007-03-02 2013-08-14 パナソニック株式会社 低抵抗チップ抵抗器およびその製造方法
JP5481675B2 (ja) * 2009-10-21 2014-04-23 コーア株式会社 基板内蔵用チップ抵抗器およびその製造方法

Also Published As

Publication number Publication date
WO2013137338A1 (ja) 2013-09-19
JPWO2013137338A1 (ja) 2015-08-03
CN104160459A (zh) 2014-11-19

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Date Code Title Description
R005 Application deemed withdrawn due to failure to request examination