DE1066666B - - Google Patents

Info

Publication number
DE1066666B
DE1066666B DENDAT1066666D DE1066666DA DE1066666B DE 1066666 B DE1066666 B DE 1066666B DE NDAT1066666 D DENDAT1066666 D DE NDAT1066666D DE 1066666D A DE1066666D A DE 1066666DA DE 1066666 B DE1066666 B DE 1066666B
Authority
DE
Germany
Prior art keywords
plastic
insulating
heat
grains
good
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DENDAT1066666D
Other languages
German (de)
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of DE1066666B publication Critical patent/DE1066666B/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
    • H01G4/206—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06 inorganic and synthetic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/905—Materials of manufacture

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Organic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Push-Button Switches (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Thermistors And Varistors (AREA)
DENDAT1066666D 1954-12-16 Pending DE1066666B (forum.php)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DES41978A DE976537C (de) 1954-12-16 1954-12-16 Gehaeuse fuer Richtleiter oder Transistoren
DES44477A DE1002087B (de) 1954-12-16 1955-06-24 Gehaeuse fuer Richtleiter, Transistoren od. dgl.
DES0046368 1955-11-15

Publications (1)

Publication Number Publication Date
DE1066666B true DE1066666B (forum.php) 1959-10-08

Family

ID=27212574

Family Applications (3)

Application Number Title Priority Date Filing Date
DENDAT1066666D Pending DE1066666B (forum.php) 1954-12-16
DES41978A Expired DE976537C (de) 1954-12-16 1954-12-16 Gehaeuse fuer Richtleiter oder Transistoren
DES44477A Pending DE1002087B (de) 1954-12-16 1955-06-24 Gehaeuse fuer Richtleiter, Transistoren od. dgl.

Family Applications After (2)

Application Number Title Priority Date Filing Date
DES41978A Expired DE976537C (de) 1954-12-16 1954-12-16 Gehaeuse fuer Richtleiter oder Transistoren
DES44477A Pending DE1002087B (de) 1954-12-16 1955-06-24 Gehaeuse fuer Richtleiter, Transistoren od. dgl.

Country Status (6)

Country Link
US (1) US2817048A (forum.php)
CH (1) CH341235A (forum.php)
DE (3) DE976537C (forum.php)
FR (1) FR1140504A (forum.php)
GB (1) GB824265A (forum.php)
NL (4) NL100919C (forum.php)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB818464A (en) * 1956-03-12 1959-08-19 Gen Electric Co Ltd Improvements in or relating to semiconductor devices
NL101297C (forum.php) * 1956-06-12
US3126509A (en) * 1956-07-27 1964-03-24 Electrical condenser having two electrically
US2905873A (en) * 1956-09-17 1959-09-22 Rca Corp Semiconductor power devices and method of manufacture
US2955242A (en) * 1956-11-27 1960-10-04 Raytheon Co Hermetically sealed power transistors
GB831295A (en) * 1957-08-08 1960-03-30 Pye Ltd Improvements in or relating to semiconductor devices
US3089067A (en) * 1957-09-30 1963-05-07 Gen Motors Corp Semiconductor device
US2896136A (en) * 1958-04-23 1959-07-21 Philco Corp Semiconductor units
US3134049A (en) * 1958-05-13 1964-05-19 Globe Union Inc Modular electrical units and assemblies thereof
US2963632A (en) * 1958-09-10 1960-12-06 Gen Electric Cantilever semiconductor mounting
US3058041A (en) * 1958-09-12 1962-10-09 Raytheon Co Electrical cooling devices
DE1110764B (de) * 1958-10-21 1961-07-13 Siemens Ag Verfahren zur Herstellung einer Halbleiteranordnung
US2948835A (en) * 1958-10-21 1960-08-09 Texas Instruments Inc Transistor structure
GB945742A (forum.php) * 1959-02-06 Texas Instruments Inc
US3018424A (en) * 1959-05-28 1962-01-23 Westinghouse Electric Corp Rectifier apparatus
US3025437A (en) * 1960-02-05 1962-03-13 Lear Inc Semiconductor heat sink and electrical insulator
US3171046A (en) * 1960-06-23 1965-02-23 Gen Motors Corp Ignition device
NL274757A (forum.php) * 1961-02-15 1900-01-01
DE1248811B (forum.php) * 1961-03-28
US3248471A (en) * 1962-02-07 1966-04-26 Bendix Corp Heat sinks
US3274456A (en) * 1962-11-21 1966-09-20 Gen Instrument Corp Rectifier assembly and method of making same
US3311798A (en) * 1963-09-27 1967-03-28 Trw Semiconductors Inc Component package
GB1053069A (forum.php) * 1963-06-28
US3265982A (en) * 1963-10-24 1966-08-09 Hazeltine Research Inc Common emitter transistor amplifier including a heat sink
US3229757A (en) * 1963-12-16 1966-01-18 Richleu Corp Heat dissipator apparatus for a transistor
DE1281582C2 (de) * 1964-08-27 1975-02-20 Robert Bosch Gmbh, 7000 Stuttgart Anordnung eines in einer elektrisch leitfaehigen kapsel untergebrachten halbleiterbauelementes an einem zu seiner halterung und waermeableitung dienenden bauteil
US3327180A (en) * 1964-09-23 1967-06-20 Pass & Seymour Inc Mounting for semiconductors
US3457476A (en) * 1965-02-12 1969-07-22 Hughes Aircraft Co Gate cooling structure for field effect transistors
US3377525A (en) * 1965-12-03 1968-04-09 Gen Electric Electrically insulated mounting bracket for encased semicon-ductor device
US3471754A (en) * 1966-03-26 1969-10-07 Sony Corp Isolation structure for integrated circuits
DE1564665C3 (de) * 1966-07-18 1975-10-30 Siemens Ag, 1000 Berlin Und 8000 Muenchen Halbleiterbauelement und Verfahren zu seiner Herstellung
JPS4697Y1 (forum.php) * 1967-03-09 1971-01-06
US3522491A (en) * 1967-05-31 1970-08-04 Wakefield Eng Inc Heat transfer apparatus for cooling semiconductor components
US3678995A (en) * 1970-06-22 1972-07-25 Rca Corp Support for electrical components and method of making the same
US3738422A (en) * 1971-05-04 1973-06-12 Allen Bradley Co Heat dissipating insulating mounting
JPS5153155Y2 (forum.php) * 1973-07-31 1976-12-18
US3898594A (en) * 1973-11-02 1975-08-05 Trw Inc Microwave semiconductor device package
US4303935A (en) * 1977-12-13 1981-12-01 Robert Bosch Gmbh Semiconductor apparatus with electrically insulated heat sink
DE2755404A1 (de) * 1977-12-13 1979-06-21 Bosch Gmbh Robert Halbleiteranordnung
US4295151A (en) * 1980-01-14 1981-10-13 Rca Corporation Method of bonding two parts together and article produced thereby
JPS6066843A (ja) * 1983-09-22 1985-04-17 Hitachi Ltd 集積回路パツケ−ジ
US4920405A (en) * 1986-11-28 1990-04-24 Fuji Electric Co., Ltd. Overcurrent limiting semiconductor device
US5212625A (en) * 1988-12-01 1993-05-18 Akzo Nv Semiconductor module having projecting cooling fin groups
DE68923778T2 (de) * 1988-12-01 1996-04-11 Akzo Nobel Nv Halbleitermodul.
US5313094A (en) * 1992-01-28 1994-05-17 International Business Machines Corportion Thermal dissipation of integrated circuits using diamond paths
BR112013013628A2 (pt) * 2010-12-02 2016-09-13 Nestec Sa sensor térmico de baixa inércia em uma máquina de bebidas

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE548391C (de) * 1932-04-11 Koch & Sterzel Akt Ges Trockengleichrichter mit einem die Anschlussenden ueberbrueckenden Kondensator
DE869649C (de) * 1934-03-01 1953-03-05 Julius Pintsch K G Elektronenroehre zum Anfachen, insbesondere Verstaerken, Erzeugen oder Empfangen vonultrahochfrequenten, elektromagnetischen Schwingungen
DE678693C (de) * 1935-06-05 1939-07-19 Aeg Elektrisches Isolierband
GB473574A (en) * 1935-10-24 1937-10-15 Lorenz C Ag Electron discharge tubes
DE746985C (de) * 1938-05-17 1944-09-01 Siemens Reiniger Werke Ag Elektrische Entladungsroehre, vorzugsweise mit Gas- oder Dampffuellung und Gluehkathode
GB584672A (en) * 1944-01-14 1947-01-21 Erich Schaefer Improvements in or relating to electrical condensers having plastic film dielectrics
DE863372C (de) * 1944-09-30 1953-01-15 Siemens Ag Kristalldetektor zur Spannungsmessung oder Demodulation elektrischer Wellen
US2528113A (en) * 1946-10-18 1950-10-31 Rca Corp Single unit capacitor and resistor
US2738452A (en) * 1950-06-30 1956-03-13 Siemens Ag Dry multi-pellet rectifiers
GB697070A (en) * 1951-01-11 1953-09-16 Erie Resistor Corp Improvements in electric components comprising resistances and capacitances
BE527420A (forum.php) * 1953-03-20
US2712620A (en) * 1954-08-10 1955-07-05 Int Standard Electric Corp Blocking layer rectifier and housing therefor

Also Published As

Publication number Publication date
NL100919C (forum.php) 1900-01-01
GB824265A (en) 1959-11-25
DE976537C (de) 1963-10-31
NL269872A (forum.php) 1900-01-01
NL202863A (forum.php) 1900-01-01
FR1140504A (fr) 1957-07-24
CH341235A (de) 1959-09-30
DE1002087B (de) 1957-02-07
US2817048A (en) 1957-12-17
NL110715C (forum.php) 1900-01-01

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