DE1002087B - Gehaeuse fuer Richtleiter, Transistoren od. dgl. - Google Patents

Gehaeuse fuer Richtleiter, Transistoren od. dgl.

Info

Publication number
DE1002087B
DE1002087B DES44477A DES0044477A DE1002087B DE 1002087 B DE1002087 B DE 1002087B DE S44477 A DES44477 A DE S44477A DE S0044477 A DES0044477 A DE S0044477A DE 1002087 B DE1002087 B DE 1002087B
Authority
DE
Germany
Prior art keywords
housing
insulating layer
thermally conductive
transistors
plastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DES44477A
Other languages
English (en)
Inventor
Dipl-Phys Eberhard Thuermel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to NL110715D priority Critical patent/NL110715C/xx
Priority to NL100919D priority patent/NL100919C/xx
Priority to DENDAT1066666D priority patent/DE1066666B/de
Priority to NL269872D priority patent/NL269872A/xx
Priority to NL202863D priority patent/NL202863A/xx
Priority to DES41978A priority patent/DE976537C/de
Application filed by Siemens AG filed Critical Siemens AG
Priority to DES44477A priority patent/DE1002087B/de
Priority to US552922A priority patent/US2817048A/en
Priority to CH341235D priority patent/CH341235A/de
Priority to FR1140504D priority patent/FR1140504A/fr
Priority to GB36207/55A priority patent/GB824265A/en
Publication of DE1002087B publication Critical patent/DE1002087B/de
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/224Housing; Encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/20Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
    • H01G4/206Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06 inorganic and synthetic material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/16Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737Organic materials with or without a thermoconductive filler
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64Impedance arrangements
    • H01L23/642Capacitive arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01012Magnesium [Mg]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01014Silicon [Si]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01019Potassium [K]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16152Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19041Component type being a capacitor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00Heat exchange
    • Y10S165/905Materials of manufacture

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Inorganic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Organic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Push-Button Switches (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Thermistors And Varistors (AREA)

Description

  • Gehäuse für Richtleiter, Transistoren od. dgl. Die Hauptpatentanmeldung S 41978 VIIIc/21g bezieht sich auf einen Transistor mit auf das Gehäuse gut wärmeleitend aufgesetztem Kollektor und einer außerhalb des Gehäuses angebrachten Isolierschicht, auf die eine Masse, welche gegebenenfalls in einen Schraubbolzen übergeht, aufgesetzt ist. Die Isolierschicht wirkt gemäß dem Hauptpatent gleichzeitig als Dielektrikum eines Kondensators, dessen eine Belegung das Gehäuse und dessen andere Belegung die Masse ist. Die Erfindung löst die Aufgabe einer besonders zweckmäßigen Ausbildung des isolierenden Dielektrikums.
  • Gemäß der Erfindung besteht die Isolierschicht aus einem Kunststoff, z. B. Kunstharz, der gegebenenfalls aushärtet oder zähflüssig-plastisch bleibt und dem ein pulverförmiger, fester und gut wärmeleitender Isolator, z. B. aus Quarz oder Keramik, eingelagert ist. Die Größe der einzelnen Quarzkörner ist dabei von einheitlicher Korngröße und so groß bemessen, wie der Abstand der beiden Belegungen voneinander sein soll.
  • Die Isolierschicht ist so aufgebracht, daß jeweils nur eine Lage Quarzkörner zwischen den entgegengesetzten Belegungen vorhanden ist. Durch diese Ausbildung des Dielektrikums wird der Vorteil erreicht, daß es bei besonders guter Wärmeleitung gleichzeitig einen wohldefinierten Abstand der Belegung festlegt.
  • In der Zeichnung ist eine Ausführungsform der Einrichtung nach der Erfindung beispielsweise dargestellt. Sie entspricht im wesentlichen der Fig. 3 der Hauptpatentanmeldung.
  • 1 bedeutet einen p-n-p-Flächentransistor, auf den eine Metallplatte 2 auf der Kollektorseite aufgelötet ist. Auf der Metallplatte 2 ist eine Isolierschicht 8 und auf diese eine Metallplatte 9 mit einem Bolzen 10 aufgesetzt. Beide sind durch Klammern 11 zusammengehalten. Erfindungsgemäß besteht die Isolierschicht 8 aus einem isolierenden Kunststoff, im Beispielsfalle Araldit 12, in welches Quarzkörner 13 von gleicher Größe derart eingelagert sind, daß sie eine einfache Lage von Quarzkörnern ergeben, welche den Abstand zwischen den Schichten 2 und 9 eindeutig definiert. Für einen Transistor von 1½ bis 2 Watt beträgt die Korngröße der Quarzkörner etwa 20 µ; es ist aber auch denkbar, etwas größere Körner von bis zu etwa 100 µ zur Abstandsfestlegung zu verwenden und die Zwischenräume mit kleineren Körnern von etwa 5 µ. auszufüllen.

Claims (2)

  1. PATENTANSPRÜCHE: 1. Gehäuse für Richtleiter, Transistoren od. dgl., deren mindestens eine Elektrode in guter wärmeleitender Verbindung mit mindestens einem Teil des Gehäuses steht, welcher unter Zwischenschaltung einer elektrischen Isolierschicht auf eine zur Wärmeaufnahme dienenden Massegut wärmeleitend aufsetzbar ist, und bei denen die Isolierschicht außerhalb des Gehäuses angeordnet und mit diesem baulich derart vereinigt ist, daß sie als Dielektrikum eines Kondensators dient, dessen eine Belegung das Gehäuse und dessen andere Belegung ein auf die zur Wärmeaufnahme dienende Masse aufsetzbarer Metallbeil ist, nach der Hauptpatentanmeldung S 41978 VIII c/21 g, dadurch gekennzeichnet, daß die Isolierschicht aus einem Kunststoff, z. B. Kunstharz, der gegebenenfalls aushärtet oder zähflüssig-plastisch bleibt, besteht, dem ein pulverförmiger, fester und gut wärmeleitender Isolator, z. B. aus Quarz oder Keramik, eingelagert ist.
  2. 2. Gehäuse nach Anspruch 1, dadurch Bekenn, zeichnest, daß die einzelnen Körner des eingelagerten pulverförmigen Isolators unter sich nahezu gleich groß sind und eine Lage bilden.
DES44477A 1954-12-16 1955-06-24 Gehaeuse fuer Richtleiter, Transistoren od. dgl. Pending DE1002087B (de)

Priority Applications (11)

Application Number Priority Date Filing Date Title
NL100919D NL100919C (de) 1954-12-16
DENDAT1066666D DE1066666B (de) 1954-12-16
NL269872D NL269872A (de) 1954-12-16
NL202863D NL202863A (de) 1954-12-16
NL110715D NL110715C (de) 1954-12-16
DES41978A DE976537C (de) 1954-12-16 1954-12-16 Gehaeuse fuer Richtleiter oder Transistoren
DES44477A DE1002087B (de) 1954-12-16 1955-06-24 Gehaeuse fuer Richtleiter, Transistoren od. dgl.
US552922A US2817048A (en) 1954-12-16 1955-12-13 Transistor arrangement
CH341235D CH341235A (de) 1954-12-16 1955-12-13 Halbleiteranordnung
FR1140504D FR1140504A (fr) 1954-12-16 1955-12-15 Semi-conducteurs tels que redresseurs et transistors
GB36207/55A GB824265A (en) 1954-12-16 1955-12-16 Improvements in or relating to housings for electrical components

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DES41978A DE976537C (de) 1954-12-16 1954-12-16 Gehaeuse fuer Richtleiter oder Transistoren
DES44477A DE1002087B (de) 1954-12-16 1955-06-24 Gehaeuse fuer Richtleiter, Transistoren od. dgl.
DES0046368 1955-11-15

Publications (1)

Publication Number Publication Date
DE1002087B true DE1002087B (de) 1957-02-07

Family

ID=27212574

Family Applications (3)

Application Number Title Priority Date Filing Date
DENDAT1066666D Pending DE1066666B (de) 1954-12-16
DES41978A Expired DE976537C (de) 1954-12-16 1954-12-16 Gehaeuse fuer Richtleiter oder Transistoren
DES44477A Pending DE1002087B (de) 1954-12-16 1955-06-24 Gehaeuse fuer Richtleiter, Transistoren od. dgl.

Family Applications Before (2)

Application Number Title Priority Date Filing Date
DENDAT1066666D Pending DE1066666B (de) 1954-12-16
DES41978A Expired DE976537C (de) 1954-12-16 1954-12-16 Gehaeuse fuer Richtleiter oder Transistoren

Country Status (6)

Country Link
US (1) US2817048A (de)
CH (1) CH341235A (de)
DE (3) DE976537C (de)
FR (1) FR1140504A (de)
GB (1) GB824265A (de)
NL (4) NL100919C (de)

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DE1110764B (de) * 1958-10-21 1961-07-13 Siemens Ag Verfahren zur Herstellung einer Halbleiteranordnung
DE1226715B (de) * 1961-02-15 1966-10-13 Philips Patentverwaltung Halbleiterbauelement mit einem flaechenhaft an Stromzufuehrungen angeloeteten Halbleiterelement und Verfahren zu seiner Herstellung

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US3126509A (en) * 1956-07-27 1964-03-24 Electrical condenser having two electrically
US2905873A (en) * 1956-09-17 1959-09-22 Rca Corp Semiconductor power devices and method of manufacture
US2955242A (en) * 1956-11-27 1960-10-04 Raytheon Co Hermetically sealed power transistors
GB831295A (en) * 1957-08-08 1960-03-30 Pye Ltd Improvements in or relating to semiconductor devices
US3089067A (en) * 1957-09-30 1963-05-07 Gen Motors Corp Semiconductor device
US2896136A (en) * 1958-04-23 1959-07-21 Philco Corp Semiconductor units
US3134049A (en) * 1958-05-13 1964-05-19 Globe Union Inc Modular electrical units and assemblies thereof
US2963632A (en) * 1958-09-10 1960-12-06 Gen Electric Cantilever semiconductor mounting
US3058041A (en) * 1958-09-12 1962-10-09 Raytheon Co Electrical cooling devices
US2948835A (en) * 1958-10-21 1960-08-09 Texas Instruments Inc Transistor structure
GB945747A (de) * 1959-02-06 Texas Instruments Inc
US3018424A (en) * 1959-05-28 1962-01-23 Westinghouse Electric Corp Rectifier apparatus
US3025437A (en) * 1960-02-05 1962-03-13 Lear Inc Semiconductor heat sink and electrical insulator
US3171046A (en) * 1960-06-23 1965-02-23 Gen Motors Corp Ignition device
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US3274456A (en) * 1962-11-21 1966-09-20 Gen Instrument Corp Rectifier assembly and method of making same
US3311798A (en) * 1963-09-27 1967-03-28 Trw Semiconductors Inc Component package
GB1053069A (de) * 1963-06-28
US3265982A (en) * 1963-10-24 1966-08-09 Hazeltine Research Inc Common emitter transistor amplifier including a heat sink
US3229757A (en) * 1963-12-16 1966-01-18 Richleu Corp Heat dissipator apparatus for a transistor
DE1281582C2 (de) * 1964-08-27 1975-02-20 Robert Bosch Gmbh, 7000 Stuttgart Anordnung eines in einer elektrisch leitfaehigen kapsel untergebrachten halbleiterbauelementes an einem zu seiner halterung und waermeableitung dienenden bauteil
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DE2755404A1 (de) * 1977-12-13 1979-06-21 Bosch Gmbh Robert Halbleiteranordnung
US4295151A (en) * 1980-01-14 1981-10-13 Rca Corporation Method of bonding two parts together and article produced thereby
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US4920405A (en) * 1986-11-28 1990-04-24 Fuji Electric Co., Ltd. Overcurrent limiting semiconductor device
DE68923778T2 (de) * 1988-12-01 1996-04-11 Akzo Nobel Nv Halbleitermodul.
US5212625A (en) * 1988-12-01 1993-05-18 Akzo Nv Semiconductor module having projecting cooling fin groups
US5313094A (en) * 1992-01-28 1994-05-17 International Business Machines Corportion Thermal dissipation of integrated circuits using diamond paths
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US2528113A (en) * 1946-10-18 1950-10-31 Rca Corp Single unit capacitor and resistor
US2738452A (en) * 1950-06-30 1956-03-13 Siemens Ag Dry multi-pellet rectifiers
GB697070A (en) * 1951-01-11 1953-09-16 Erie Resistor Corp Improvements in electric components comprising resistances and capacitances
BE527420A (de) * 1953-03-20
US2712620A (en) * 1954-08-10 1955-07-05 Int Standard Electric Corp Blocking layer rectifier and housing therefor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1110764B (de) * 1958-10-21 1961-07-13 Siemens Ag Verfahren zur Herstellung einer Halbleiteranordnung
DE1226715B (de) * 1961-02-15 1966-10-13 Philips Patentverwaltung Halbleiterbauelement mit einem flaechenhaft an Stromzufuehrungen angeloeteten Halbleiterelement und Verfahren zu seiner Herstellung

Also Published As

Publication number Publication date
NL110715C (de) 1900-01-01
NL269872A (de) 1900-01-01
DE1066666B (de) 1959-10-08
NL202863A (de) 1900-01-01
FR1140504A (fr) 1957-07-24
US2817048A (en) 1957-12-17
NL100919C (de) 1900-01-01
DE976537C (de) 1963-10-31
CH341235A (de) 1959-09-30
GB824265A (en) 1959-11-25

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