FR1140504A - Semi-conducteurs tels que redresseurs et transistors - Google Patents

Semi-conducteurs tels que redresseurs et transistors

Info

Publication number
FR1140504A
FR1140504A FR1140504DA FR1140504A FR 1140504 A FR1140504 A FR 1140504A FR 1140504D A FR1140504D A FR 1140504DA FR 1140504 A FR1140504 A FR 1140504A
Authority
FR
France
Prior art keywords
rectifiers
semiconductors
transistors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens and Halske AG
Siemens AG
Original Assignee
Siemens and Halske AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens and Halske AG, Siemens AG filed Critical Siemens and Halske AG
Application granted granted Critical
Publication of FR1140504A publication Critical patent/FR1140504A/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/224Housing; Encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/20Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
    • H01G4/206Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06 inorganic and synthetic material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/16Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737Organic materials with or without a thermoconductive filler
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64Impedance arrangements
    • H01L23/642Capacitive arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01012Magnesium [Mg]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01014Silicon [Si]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01019Potassium [K]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16152Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19041Component type being a capacitor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00Heat exchange
    • Y10S165/905Materials of manufacture

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Thermistors And Varistors (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Push-Button Switches (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Organic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
FR1140504D 1954-12-16 1955-12-15 Semi-conducteurs tels que redresseurs et transistors Expired FR1140504A (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DES41978A DE976537C (de) 1954-12-16 1954-12-16 Gehaeuse fuer Richtleiter oder Transistoren
DES44477A DE1002087B (de) 1954-12-16 1955-06-24 Gehaeuse fuer Richtleiter, Transistoren od. dgl.
DES0046368 1955-11-15

Publications (1)

Publication Number Publication Date
FR1140504A true FR1140504A (fr) 1957-07-24

Family

ID=27212574

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1140504D Expired FR1140504A (fr) 1954-12-16 1955-12-15 Semi-conducteurs tels que redresseurs et transistors

Country Status (6)

Country Link
US (1) US2817048A (fr)
CH (1) CH341235A (fr)
DE (3) DE976537C (fr)
FR (1) FR1140504A (fr)
GB (1) GB824265A (fr)
NL (4) NL269872A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2412166A1 (fr) * 1977-12-13 1979-07-13 Bosch Gmbh Robert Dispositif a semi-conducteurs apte a servir de redresseur

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB818464A (en) * 1956-03-12 1959-08-19 Gen Electric Co Ltd Improvements in or relating to semiconductor devices
NL101297C (fr) * 1956-06-12
US3126509A (en) * 1956-07-27 1964-03-24 Electrical condenser having two electrically
US2905873A (en) * 1956-09-17 1959-09-22 Rca Corp Semiconductor power devices and method of manufacture
US2955242A (en) * 1956-11-27 1960-10-04 Raytheon Co Hermetically sealed power transistors
GB831295A (en) * 1957-08-08 1960-03-30 Pye Ltd Improvements in or relating to semiconductor devices
US3089067A (en) * 1957-09-30 1963-05-07 Gen Motors Corp Semiconductor device
US2896136A (en) * 1958-04-23 1959-07-21 Philco Corp Semiconductor units
US3134049A (en) * 1958-05-13 1964-05-19 Globe Union Inc Modular electrical units and assemblies thereof
US2963632A (en) * 1958-09-10 1960-12-06 Gen Electric Cantilever semiconductor mounting
US3058041A (en) * 1958-09-12 1962-10-09 Raytheon Co Electrical cooling devices
US2948835A (en) * 1958-10-21 1960-08-09 Texas Instruments Inc Transistor structure
DE1110764B (de) * 1958-10-21 1961-07-13 Siemens Ag Verfahren zur Herstellung einer Halbleiteranordnung
GB945747A (fr) * 1959-02-06 Texas Instruments Inc
US3018424A (en) * 1959-05-28 1962-01-23 Westinghouse Electric Corp Rectifier apparatus
US3025437A (en) * 1960-02-05 1962-03-13 Lear Inc Semiconductor heat sink and electrical insulator
US3171046A (en) * 1960-06-23 1965-02-23 Gen Motors Corp Ignition device
NL274757A (fr) * 1961-02-15 1900-01-01
DE1248811B (fr) * 1961-03-28
US3248471A (en) * 1962-02-07 1966-04-26 Bendix Corp Heat sinks
US3274456A (en) * 1962-11-21 1966-09-20 Gen Instrument Corp Rectifier assembly and method of making same
US3311798A (en) * 1963-09-27 1967-03-28 Trw Semiconductors Inc Component package
GB1053069A (fr) * 1963-06-28
US3265982A (en) * 1963-10-24 1966-08-09 Hazeltine Research Inc Common emitter transistor amplifier including a heat sink
US3229757A (en) * 1963-12-16 1966-01-18 Richleu Corp Heat dissipator apparatus for a transistor
DE1281582C2 (de) * 1964-08-27 1975-02-20 Robert Bosch Gmbh, 7000 Stuttgart Anordnung eines in einer elektrisch leitfaehigen kapsel untergebrachten halbleiterbauelementes an einem zu seiner halterung und waermeableitung dienenden bauteil
US3327180A (en) * 1964-09-23 1967-06-20 Pass & Seymour Inc Mounting for semiconductors
US3457476A (en) * 1965-02-12 1969-07-22 Hughes Aircraft Co Gate cooling structure for field effect transistors
US3377525A (en) * 1965-12-03 1968-04-09 Gen Electric Electrically insulated mounting bracket for encased semicon-ductor device
US3471754A (en) * 1966-03-26 1969-10-07 Sony Corp Isolation structure for integrated circuits
DE1564665C3 (de) * 1966-07-18 1975-10-30 Siemens Ag, 1000 Berlin Und 8000 Muenchen Halbleiterbauelement und Verfahren zu seiner Herstellung
JPS4697Y1 (fr) * 1967-03-09 1971-01-06
US3522491A (en) * 1967-05-31 1970-08-04 Wakefield Eng Inc Heat transfer apparatus for cooling semiconductor components
US3678995A (en) * 1970-06-22 1972-07-25 Rca Corp Support for electrical components and method of making the same
US3738422A (en) * 1971-05-04 1973-06-12 Allen Bradley Co Heat dissipating insulating mounting
JPS5153155Y2 (fr) * 1973-07-31 1976-12-18
US3898594A (en) * 1973-11-02 1975-08-05 Trw Inc Microwave semiconductor device package
DE2755404A1 (de) * 1977-12-13 1979-06-21 Bosch Gmbh Robert Halbleiteranordnung
US4295151A (en) * 1980-01-14 1981-10-13 Rca Corporation Method of bonding two parts together and article produced thereby
JPS6066843A (ja) * 1983-09-22 1985-04-17 Hitachi Ltd 集積回路パツケ−ジ
US4920405A (en) * 1986-11-28 1990-04-24 Fuji Electric Co., Ltd. Overcurrent limiting semiconductor device
EP0376365B1 (fr) * 1988-12-01 1995-08-09 Akzo Nobel N.V. Module semi-conducteur
US5212625A (en) * 1988-12-01 1993-05-18 Akzo Nv Semiconductor module having projecting cooling fin groups
US5313094A (en) * 1992-01-28 1994-05-17 International Business Machines Corportion Thermal dissipation of integrated circuits using diamond paths
RU2579178C2 (ru) * 2010-12-02 2016-04-10 Нестек С.А. Малоинерционный термодатчик в устройстве для приготовления напитков

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE548391C (de) * 1932-04-11 Koch & Sterzel Akt Ges Trockengleichrichter mit einem die Anschlussenden ueberbrueckenden Kondensator
DE869649C (de) * 1934-03-01 1953-03-05 Julius Pintsch K G Elektronenroehre zum Anfachen, insbesondere Verstaerken, Erzeugen oder Empfangen vonultrahochfrequenten, elektromagnetischen Schwingungen
DE678693C (de) * 1935-06-05 1939-07-19 Aeg Elektrisches Isolierband
GB473574A (en) * 1935-10-24 1937-10-15 Lorenz C Ag Electron discharge tubes
DE746985C (de) * 1938-05-17 1944-09-01 Siemens Reiniger Werke Ag Elektrische Entladungsroehre, vorzugsweise mit Gas- oder Dampffuellung und Gluehkathode
GB584672A (en) * 1944-01-14 1947-01-21 Erich Schaefer Improvements in or relating to electrical condensers having plastic film dielectrics
DE863372C (de) * 1944-09-30 1953-01-15 Siemens Ag Kristalldetektor zur Spannungsmessung oder Demodulation elektrischer Wellen
US2528113A (en) * 1946-10-18 1950-10-31 Rca Corp Single unit capacitor and resistor
US2738452A (en) * 1950-06-30 1956-03-13 Siemens Ag Dry multi-pellet rectifiers
GB697070A (en) * 1951-01-11 1953-09-16 Erie Resistor Corp Improvements in electric components comprising resistances and capacitances
BE527420A (fr) * 1953-03-20
US2712620A (en) * 1954-08-10 1955-07-05 Int Standard Electric Corp Blocking layer rectifier and housing therefor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2412166A1 (fr) * 1977-12-13 1979-07-13 Bosch Gmbh Robert Dispositif a semi-conducteurs apte a servir de redresseur

Also Published As

Publication number Publication date
GB824265A (en) 1959-11-25
NL202863A (fr) 1900-01-01
US2817048A (en) 1957-12-17
NL100919C (fr) 1900-01-01
DE976537C (de) 1963-10-31
DE1066666B (fr) 1959-10-08
NL269872A (fr) 1900-01-01
CH341235A (de) 1959-09-30
NL110715C (fr) 1900-01-01
DE1002087B (de) 1957-02-07

Similar Documents

Publication Publication Date Title
FR1140504A (fr) Semi-conducteurs tels que redresseurs et transistors
FR1128423A (fr) Transisteur
FR1149240A (fr) Transistor
FR1132063A (fr) Redresseur à semi-conducteur
FR1130175A (fr) Semi-conducteur
CH334119A (de) Halbleiteranordnung
CH377449A (de) Transistor
FR1166105A (fr) Table fonctionnelle à transistors
CH333028A (de) Mehrstufiger Transistor-Wechselstromverstärker
FR1129770A (fr) Transistor perfectionné
CH339292A (fr) Transistor
FR1152082A (fr) Circuits à transistors
FR1145746A (fr) Circuit à transistors
FR1178512A (fr) Circuits d'excitation à transistors
FR1128221A (fr) évier
FR1135470A (fr) Perfectionnements aux redresseurs à semi-conducteur
FR1162732A (fr) Redresseurs ou transistors plats
FR1127863A (fr) Amplificateur à transisteur
FR1118283A (fr) Amplificateur à transisteur
FR1152538A (fr) Calculatrice à transistors
AT194489B (de) Halbleitergerät
FR1143171A (fr) Diode semi-conductrice
FR1143135A (fr) Perfectionnements aux redresseurs à semi-conducteurs
FR1297430A (fr) Semi-conducteurs tels que des diodes et des transistors
FR1132566A (fr) Perfectionnements aux éléments semi-conducteurs, tels que transistors et diodes