FR2412166A1 - Dispositif a semi-conducteurs apte a servir de redresseur - Google Patents
Dispositif a semi-conducteurs apte a servir de redresseurInfo
- Publication number
- FR2412166A1 FR2412166A1 FR7835101A FR7835101A FR2412166A1 FR 2412166 A1 FR2412166 A1 FR 2412166A1 FR 7835101 A FR7835101 A FR 7835101A FR 7835101 A FR7835101 A FR 7835101A FR 2412166 A1 FR2412166 A1 FR 2412166A1
- Authority
- FR
- France
- Prior art keywords
- rectifier
- semiconductor device
- device suitable
- act
- semi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/071—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next and on each other, i.e. mixed assemblies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/074—Stacked arrangements of non-apertured devices
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01076—Osmium [Os]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01077—Iridium [Ir]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/909—Macrocell arrays, e.g. gate arrays with variable size or configuration of cells
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Rectifiers (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Synchronous Machinery (AREA)
Abstract
A.DISPOSITIF A SEMI-CONDUCTEURS APTE A SERVIR DE REDRESSEUR. B.DISPOSITIF CARACTERISE EN CE QUE L'ELEMENT SEMI-CONDUCTEUR EST ISOLE ELECTRIQUEMENT DE LA PIECE DE FOND AU MOYEN D'UNE COUCHE ISOLANTE PRESENTANT UNE BONNE CONDUCTIBILITE THERMIQUE. C.L'INVENTION S'APPLIQUE NOTAMMENT A L'EQUIPEMENT DES VOITURES AUTOMOBILES.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19772755404 DE2755404A1 (de) | 1977-12-13 | 1977-12-13 | Halbleiteranordnung |
DE19782838342 DE2838342A1 (de) | 1978-09-02 | 1978-09-02 | Gleichrichteranordnung |
DE19782838412 DE2838412A1 (de) | 1978-09-02 | 1978-09-02 | Gleichrichteranordnung |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2412166A1 true FR2412166A1 (fr) | 1979-07-13 |
FR2412166B1 FR2412166B1 (fr) | 1985-12-27 |
Family
ID=27187393
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7835101A Expired FR2412166B1 (fr) | 1977-12-13 | 1978-12-13 | Dispositif a semi-conducteurs apte a servir de redresseur |
Country Status (6)
Country | Link |
---|---|
US (1) | US4303935A (fr) |
JP (1) | JPS5489485A (fr) |
FR (1) | FR2412166B1 (fr) |
GB (1) | GB2014360B (fr) |
IT (1) | IT1101536B (fr) |
YU (1) | YU288878A (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2563379A1 (fr) * | 1984-04-20 | 1985-10-25 | Artus | Ensemble de dispositifs electroniques a semi-conducteurs montes sur radiateur |
EP0624943A1 (fr) * | 1993-05-10 | 1994-11-17 | STMicroelectronics S.A. | Composant limiteur de courant série |
WO1997024762A1 (fr) * | 1995-12-30 | 1997-07-10 | Robert Bosch Gmbh | Diode de redressement |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2473801A1 (fr) * | 1979-12-13 | 1981-07-17 | Bosch Gmbh Robert | Bloc de diodes |
US4414562A (en) * | 1980-07-24 | 1983-11-08 | Thermal Associates, Inc. | Semiconductor heat sink assembly including thermally responsive means for increasing compression as the temperature of said assembly increases |
US4689583A (en) * | 1984-02-13 | 1987-08-25 | Raytheon Company | Dual diode module with heat sink, for use in a cavity power combiner |
US4606000A (en) * | 1985-03-27 | 1986-08-12 | General Motors Corporation | Bridge rectifier |
JPH0691119B2 (ja) * | 1989-07-31 | 1994-11-14 | 株式会社東芝 | 半導体装置 |
US5005069A (en) * | 1990-04-30 | 1991-04-02 | Motorola Inc. | Rectifier and method |
US5631806A (en) * | 1995-07-31 | 1997-05-20 | Fried; Robert | Lead with slits for reducing solder overflow and eliminating air gaps in the execution of solder joints |
FR2737618B1 (fr) * | 1995-08-02 | 1997-10-24 | Valeo Equip Electr Moteur | Alternateur comportant des pieces d'adaptation pour diodes de pont redresseur, notamment pour vehicule automobile, et piece d'adaptation pour un tel alternateur |
JPH10215552A (ja) * | 1996-08-08 | 1998-08-11 | Denso Corp | 交流発電機の整流装置とその製造方法 |
JP3426101B2 (ja) * | 1997-02-25 | 2003-07-14 | 三菱電機株式会社 | 整流装置 |
US6160309A (en) * | 1999-03-25 | 2000-12-12 | Le; Hiep | Press-fit semiconductor package |
DE19946255A1 (de) * | 1999-09-27 | 2001-03-29 | Philips Corp Intellectual Pty | Gleichrichteranordnung |
JP3894413B2 (ja) * | 2000-06-08 | 2007-03-22 | 三菱電機株式会社 | 車両用交流発電機 |
FR2813442A1 (fr) * | 2000-08-31 | 2002-03-01 | Valeo Equip Electr Moteur | Diode de puissance destinee a equiper le pont redresseur d'une machine electrique tournante telle qu'un alternateur pour vehicule automobile |
FR2813441B1 (fr) * | 2000-08-31 | 2005-01-14 | Valeo Equip Electr Moteur | Diode de puissance destinee a equiper le pont redresseur d'une machine electrique tournante tel qu'un alternateur pour vehicule automobile |
JP2002359328A (ja) * | 2001-03-29 | 2002-12-13 | Hitachi Ltd | 半導体装置 |
DE10127052A1 (de) * | 2001-06-02 | 2002-12-12 | Bosch Gmbh Robert | Verbindung eines Halbleiterbauelements mit einem Kühlkörper, Halbleiterbauelement, Kühlkörper und Verfahren |
GB201101700D0 (en) * | 2011-02-01 | 2011-03-16 | Goodrich Control Sys | Rotating rectifier |
US20130075891A1 (en) * | 2011-09-23 | 2013-03-28 | Formosa Microsemi Co., Ltd. | Flip chip type full wave rectification semiconductor device and its manufacturing method |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1140504A (fr) * | 1954-12-16 | 1957-07-24 | Siemens Ag | Semi-conducteurs tels que redresseurs et transistors |
US2887628A (en) * | 1956-06-12 | 1959-05-19 | Gen Electric | Semiconductor device construction |
DE1589553A1 (de) * | 1965-06-26 | 1970-03-26 | Robert Bosch Gmbh | Halbleiterbauelement |
DE1614479A1 (de) * | 1967-04-03 | 1970-07-16 | Siemens Ag | Halbleiterbauelement |
US3763403A (en) * | 1972-03-01 | 1973-10-02 | Gen Electric | Isolated heat-sink semiconductor device |
DE2448186A1 (de) * | 1973-10-10 | 1975-04-17 | Siemens Ag | Kuehleranordnung fuer zwei oder mehrere halbleiterventile |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2516344A (en) * | 1947-07-18 | 1950-07-25 | Daniel W Ross | Rectifier |
US2864006A (en) * | 1956-07-06 | 1958-12-09 | Gen Electric | Cooling structure for semiconductor devices |
BE571550A (fr) * | 1957-09-27 | |||
NL244922A (fr) * | 1958-11-03 | |||
US3179855A (en) * | 1961-08-28 | 1965-04-20 | Baldwin Co D H | Mounting means for a diode assembly |
US3275921A (en) * | 1963-04-03 | 1966-09-27 | Westinghouse Electric Corp | Semiconductor rectifier assembly |
US3377524A (en) * | 1965-09-30 | 1968-04-09 | Gen Electric | Mounting arrangement for semiconductor devices |
DE1287683C2 (de) * | 1965-11-09 | 1969-09-18 | Licentia Patent-Verwaltungs-GmbH, 6000 Prankfurt | Sicherung gegen Überspannungen |
US3439255A (en) * | 1965-12-02 | 1969-04-15 | Motorola Inc | Encapsulated semiconductor device including a ceramic substrate |
US3377525A (en) * | 1965-12-03 | 1968-04-09 | Gen Electric | Electrically insulated mounting bracket for encased semicon-ductor device |
DE1973009U (de) * | 1967-04-03 | 1967-11-23 | Siemens Ag | Halbleiterbauelement. |
DE1589555B2 (de) * | 1967-10-31 | 1977-01-27 | Robert Bosch Gmbh, 7000 Stuttgart | Halbleiterbauelement |
DE1944515A1 (de) * | 1969-09-02 | 1971-03-04 | Siemens Ag | Halbleiterbauelement mit Kunststoffuellung |
GB1328351A (en) * | 1969-12-31 | 1973-08-30 | Lucas Industries Ltd | Full wave rectifier assemblies |
US3780322A (en) * | 1971-07-15 | 1973-12-18 | Motorola Inc | Minimized temperature coefficient voltage standard means |
US3721868A (en) * | 1971-11-15 | 1973-03-20 | Gen Electric | Semiconductor device with novel lead attachments |
-
1978
- 1978-12-04 US US05/965,743 patent/US4303935A/en not_active Expired - Lifetime
- 1978-12-11 JP JP15212178A patent/JPS5489485A/ja active Pending
- 1978-12-11 YU YU288878A patent/YU288878A/xx unknown
- 1978-12-12 GB GB7848048A patent/GB2014360B/en not_active Expired
- 1978-12-13 IT IT3078878A patent/IT1101536B/it active
- 1978-12-13 FR FR7835101A patent/FR2412166B1/fr not_active Expired
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1140504A (fr) * | 1954-12-16 | 1957-07-24 | Siemens Ag | Semi-conducteurs tels que redresseurs et transistors |
US2887628A (en) * | 1956-06-12 | 1959-05-19 | Gen Electric | Semiconductor device construction |
DE1589553A1 (de) * | 1965-06-26 | 1970-03-26 | Robert Bosch Gmbh | Halbleiterbauelement |
DE1614479A1 (de) * | 1967-04-03 | 1970-07-16 | Siemens Ag | Halbleiterbauelement |
US3763403A (en) * | 1972-03-01 | 1973-10-02 | Gen Electric | Isolated heat-sink semiconductor device |
DE2448186A1 (de) * | 1973-10-10 | 1975-04-17 | Siemens Ag | Kuehleranordnung fuer zwei oder mehrere halbleiterventile |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2563379A1 (fr) * | 1984-04-20 | 1985-10-25 | Artus | Ensemble de dispositifs electroniques a semi-conducteurs montes sur radiateur |
EP0624943A1 (fr) * | 1993-05-10 | 1994-11-17 | STMicroelectronics S.A. | Composant limiteur de courant série |
FR2705173A1 (fr) * | 1993-05-10 | 1994-11-18 | Sgs Thomson Microelectronics | Composant limiteur de courant série. |
WO1997024762A1 (fr) * | 1995-12-30 | 1997-07-10 | Robert Bosch Gmbh | Diode de redressement |
Also Published As
Publication number | Publication date |
---|---|
IT1101536B (it) | 1985-10-07 |
FR2412166B1 (fr) | 1985-12-27 |
GB2014360B (en) | 1982-10-06 |
GB2014360A (en) | 1979-08-22 |
YU288878A (en) | 1982-10-31 |
IT7830788A0 (it) | 1978-12-13 |
US4303935A (en) | 1981-12-01 |
JPS5489485A (en) | 1979-07-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR2412166A1 (fr) | Dispositif a semi-conducteurs apte a servir de redresseur | |
NL7707320A (nl) | Werkwijze en inrichting voor de vervaardiging van een geisoleerde elektrische draad van het geemailleerde draadtype. | |
BE865470A (fr) | Dispositif de mesure de la teneur en eau d'une substance non conductrice de l'electricite | |
ES420919A1 (es) | Un metodo de fabricar un sistema mejorado de tiras conduc- toras de metalurgia de aluminio sobre un dispositivo semi- conductor de silicio monocristalino. | |
IT1065789B (it) | Procedimento e dispositivo per la determinazione di quantita'di postdosatura | |
BE749546A (fr) | Appareil de sertissage d'une piece de connexion electrique | |
PL201878A1 (pl) | Urzadzenie do montazu przewodow w stykach zlacza elektrycznego | |
IT7925368A0 (it) | Rivelatore per accertare la presenza di un segnale elettrico con prestabilite proprieta'. | |
IT1084172B (it) | Procedimento e composizione per il rivestimento di un substrato elettricamente conduttore | |
BE793343A (fr) | Installation de generation de chaleur au moyen d'un courant electrique | |
CH545011A (fr) | Dispositif de raccordement entre plusieurs conducteurs électriques | |
IT7947709A0 (it) | Dispositivo per montare un motore sull'ala di un aeromobile | |
FR1045430A (fr) | Dispositif destiné à faciliter la pose de connexions électriques multiples | |
IT7820220A0 (it) | Dispositivo per impostare ed indicare l'erogazione di potenza di un generatore di calore elettrico. | |
GB1514742A (en) | Electronic switching devices | |
IT7848030A0 (it) | Procedimento per l'isolamento elettrico di conduttori metallici | |
FR2330231A1 (fr) | Dispositif d'analyse electrique d'une image | |
JPS53109487A (en) | Manufacture for semiconductor device | |
JPS52109883A (en) | Manufacture of silicon semiconductor device | |
BE782844A (fr) | Installation pour la determination et la representation electrique des coordonnees de lieu de points d'une surface | |
ES392402A1 (es) | Un dispositivo semiconductor. | |
JPS5743432A (en) | Semiconductor device | |
DK548777A (da) | Haerdnede polyolefinsammensaetninger med forbedret varmeaeldningsstabilitet fremgangsmaade til forbedring heraf samt elektrisk leder isoleret med ovennaevnte polyolefinsammensaetning | |
JPS5348791A (en) | Production of infrared ray detector | |
FR1046987A (fr) | Appareil indicateur de la vitesse moyenne d'une automobile ou d'un autre véhicule |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |