GB1328351A - Full wave rectifier assemblies - Google Patents
Full wave rectifier assembliesInfo
- Publication number
- GB1328351A GB1328351A GB6341469A GB1328351DA GB1328351A GB 1328351 A GB1328351 A GB 1328351A GB 6341469 A GB6341469 A GB 6341469A GB 1328351D A GB1328351D A GB 1328351DA GB 1328351 A GB1328351 A GB 1328351A
- Authority
- GB
- United Kingdom
- Prior art keywords
- fastened
- slots
- strips
- assembly
- dec
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/02—Conversion of ac power input into dc power output without possibility of reversal
- H02M7/04—Conversion of ac power input into dc power output without possibility of reversal by static converters
- H02M7/06—Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes without control electrode or semiconductor devices without control electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Synchronous Machinery (AREA)
Abstract
1328351 Semi-conductor rectifiers JOSEPH LUCAS (INDUSTRIES) Ltd 11 Dec 1970 [31 Dec 1969] 63414/69 Heading H1K A semi-conductor rectifier assembly is attached to a star-connected 3-phase vehicle alternator and comprises an additional half-bridge feeding the voltage regulator. The assembly comprises an anodized aluminium body from one side of which cooling fins project. The phase plates are fastened by thermally conductive adhesive in respective transverse slots on the other face of the body; each connector bears two diodes mounted with one polarity and one mounted with the other polarity. Between the slots are two further slots in which are fastened transverse insulating strips which mount three longitudinally extending terminal strips interconnecting the diodes on the phase plates and providing the two D.C. positive terminals and the common negative terminal. The rivets securing the negative terminal strip and the insulating strips effect electrical connection between the negative strip and the body of the assembly, the anodized coating of the body being locally removed for this purpose. As a variant it may instead be the terminal strips which are adhesively fastened to the body by thermally conductive adhesive.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB6341469 | 1969-12-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1328351A true GB1328351A (en) | 1973-08-30 |
Family
ID=10489007
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB6341469A Expired GB1328351A (en) | 1969-12-31 | 1969-12-31 | Full wave rectifier assemblies |
Country Status (6)
Country | Link |
---|---|
AU (1) | AU2350070A (en) |
DE (1) | DE2064343A1 (en) |
ES (1) | ES387393A1 (en) |
FR (1) | FR2074492A5 (en) |
GB (1) | GB1328351A (en) |
ZA (1) | ZA708444B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4303935A (en) * | 1977-12-13 | 1981-12-01 | Robert Bosch Gmbh | Semiconductor apparatus with electrically insulated heat sink |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2728313A1 (en) * | 1977-06-23 | 1979-01-04 | Siemens Ag | SEMICONDUCTOR COMPONENT |
DE2857170A1 (en) * | 1977-11-18 | 1980-12-04 | Fujitsu Ltd | SEMICONDUCTOR DEVICE |
DE2838412A1 (en) * | 1978-09-02 | 1980-06-19 | Bosch Gmbh Robert | Semiconductor device with heat sink - using a good heat conductor to mount the device on the sink |
JPS5746662A (en) * | 1980-09-04 | 1982-03-17 | Toshiba Corp | Semiconductor rectifier |
-
1969
- 1969-12-31 GB GB6341469A patent/GB1328351A/en not_active Expired
-
1970
- 1970-12-14 ZA ZA708444A patent/ZA708444B/en unknown
- 1970-12-17 AU AU23500/70A patent/AU2350070A/en not_active Expired
- 1970-12-29 DE DE19702064343 patent/DE2064343A1/en active Pending
- 1970-12-29 ES ES387393A patent/ES387393A1/en not_active Expired
- 1970-12-30 FR FR7047404A patent/FR2074492A5/fr not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4303935A (en) * | 1977-12-13 | 1981-12-01 | Robert Bosch Gmbh | Semiconductor apparatus with electrically insulated heat sink |
Also Published As
Publication number | Publication date |
---|---|
ZA708444B (en) | 1971-09-29 |
DE2064343A1 (en) | 1971-07-08 |
FR2074492A5 (en) | 1971-10-01 |
AU2350070A (en) | 1972-06-22 |
ES387393A1 (en) | 1973-05-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |