DE102020132231A1 - Mikroelektronisches bauteil, das geformte bereiche mit through-mold-vias aufweist - Google Patents

Mikroelektronisches bauteil, das geformte bereiche mit through-mold-vias aufweist Download PDF

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Publication number
DE102020132231A1
DE102020132231A1 DE102020132231.3A DE102020132231A DE102020132231A1 DE 102020132231 A1 DE102020132231 A1 DE 102020132231A1 DE 102020132231 A DE102020132231 A DE 102020132231A DE 102020132231 A1 DE102020132231 A1 DE 102020132231A1
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Prior art keywords
substrate
die
microelectronic
tsv
molding material
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Pending
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DE102020132231.3A
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German (de)
English (en)
Inventor
Sanka Ganesan
Ram Viswanath
Xavier Francois Brun
Tarek A. Ibrahim
Jason M. Gamba
Manish Dubey
Robert Alan May
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Intel Corp
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Intel Corp
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    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
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    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
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    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
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    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
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    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
DE102020132231.3A 2020-03-25 2020-12-03 Mikroelektronisches bauteil, das geformte bereiche mit through-mold-vias aufweist Pending DE102020132231A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16/829,396 2020-03-25
US16/829,396 US11302643B2 (en) 2020-03-25 2020-03-25 Microelectronic component having molded regions with through-mold vias

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DE102020132231A1 true DE102020132231A1 (de) 2021-09-30

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US (6) US11302643B2 (https=)
JP (2) JP7458969B2 (https=)
KR (2) KR102772133B1 (https=)
CN (1) CN113451287A (https=)
DE (1) DE102020132231A1 (https=)

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