KR102772133B1 - 몰드 관통 비아들을 가진 몰딩된 영역들을 갖는 마이크로전자 어셈블리 및 그 제조 방법 - Google Patents

몰드 관통 비아들을 가진 몰딩된 영역들을 갖는 마이크로전자 어셈블리 및 그 제조 방법 Download PDF

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KR102772133B1
KR102772133B1 KR1020200170257A KR20200170257A KR102772133B1 KR 102772133 B1 KR102772133 B1 KR 102772133B1 KR 1020200170257 A KR1020200170257 A KR 1020200170257A KR 20200170257 A KR20200170257 A KR 20200170257A KR 102772133 B1 KR102772133 B1 KR 102772133B1
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die
vias
interconnects
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microelectronic
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KR20210119866A (ko
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산카 가네산
램 비스와나쓰
자비에 프란코스 브룬
타렉 에이. 이브라힘
제이슨 엠. 감바
마니쉬 두비
로버트 알랜 메이
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인텔 코포레이션
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    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
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KR1020200170257A 2020-03-25 2020-12-08 몰드 관통 비아들을 가진 몰딩된 영역들을 갖는 마이크로전자 어셈블리 및 그 제조 방법 Active KR102772133B1 (ko)

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KR1020250021399A KR20250031168A (ko) 2020-03-25 2025-02-19 몰드 관통 비아들을 가진 몰딩된 영역들을 갖는 마이크로전자 어셈블리 및 그 제조 방법

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US16/829,396 2020-03-25
US16/829,396 US11302643B2 (en) 2020-03-25 2020-03-25 Microelectronic component having molded regions with through-mold vias

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KR102772133B1 true KR102772133B1 (ko) 2025-02-26

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KR1020250021399A Pending KR20250031168A (ko) 2020-03-25 2025-02-19 몰드 관통 비아들을 가진 몰딩된 영역들을 갖는 마이크로전자 어셈블리 및 그 제조 방법

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JP (2) JP7458969B2 (https=)
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