DE102014221650A1 - Elektronisches bauelement, elektronisches gerät und verfahren zur herstellung des elektronischen bauelements - Google Patents

Elektronisches bauelement, elektronisches gerät und verfahren zur herstellung des elektronischen bauelements Download PDF

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Publication number
DE102014221650A1
DE102014221650A1 DE201410221650 DE102014221650A DE102014221650A1 DE 102014221650 A1 DE102014221650 A1 DE 102014221650A1 DE 201410221650 DE201410221650 DE 201410221650 DE 102014221650 A DE102014221650 A DE 102014221650A DE 102014221650 A1 DE102014221650 A1 DE 102014221650A1
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Germany
Prior art keywords
component
base
frame
thermal conductivity
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE201410221650
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German (de)
English (en)
Inventor
c/o CANON KABUSHIKI KAISHA Katase Yu
c/o CANON KABUSHIKI KAISHA Ito Fujio
c/o CANON KABUSHIKI KAISHA Kosaka Tadashi
c/o CANON KABUSHIKI KAISHA Tsuduki Koji
c/o CANON KABUSHIKI KAISHA Kataoka Ichiro
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Canon Inc
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Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of DE102014221650A1 publication Critical patent/DE102014221650A1/de
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE201410221650 2013-10-25 2014-10-24 Elektronisches bauelement, elektronisches gerät und verfahren zur herstellung des elektronischen bauelements Withdrawn DE102014221650A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013222521A JP6214337B2 (ja) 2013-10-25 2013-10-25 電子部品、電子機器および電子部品の製造方法。
JP2013-222521 2013-10-25

Publications (1)

Publication Number Publication Date
DE102014221650A1 true DE102014221650A1 (de) 2015-04-30

Family

ID=52812013

Family Applications (1)

Application Number Title Priority Date Filing Date
DE201410221650 Withdrawn DE102014221650A1 (de) 2013-10-25 2014-10-24 Elektronisches bauelement, elektronisches gerät und verfahren zur herstellung des elektronischen bauelements

Country Status (4)

Country Link
US (1) US9585287B2 (https=)
JP (1) JP6214337B2 (https=)
CN (1) CN104576570B (https=)
DE (1) DE102014221650A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10580811B2 (en) 2015-11-24 2020-03-03 Sony Corporation Image pickup element package having a supporting resin frame with a thermally conductive portion including electronic components, and associated image pickup apparatus

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6296687B2 (ja) * 2012-04-27 2018-03-20 キヤノン株式会社 電子部品、電子モジュールおよびこれらの製造方法。
CN106257652B (zh) * 2015-06-16 2020-03-27 台达电子企业管理（上海）有限公司 封装模块及封装方法
CN108352387B (zh) * 2015-10-26 2022-05-31 京瓷株式会社 拍摄装置、车辆及壳体
JP6648525B2 (ja) * 2015-12-28 2020-02-14 株式会社ニコン 基板、撮像ユニットおよび撮像装置
CN106252293B (zh) * 2016-01-06 2018-12-18 苏州能讯高能半导体有限公司 封装外壳及应用该封装外壳的电子元件
US9971235B2 (en) * 2016-01-29 2018-05-15 Seiko Epson Corporation Light source device, projector, and method of manufacturing light source device
CN111971864B (zh) * 2018-04-06 2022-08-02 Ipg光子公司 具有高压隔离功能的海底光中继器
CN110544634A (zh) * 2018-05-28 2019-12-06 浙江清华柔性电子技术研究院 芯片集成方法
CN109830494A (zh) * 2019-03-13 2019-05-31 赵雯萱 一种具有散热功能的影像芯片封装结构及其制作方法
JP2020150207A (ja) * 2019-03-15 2020-09-17 キヤノン株式会社 電子部品およびその製造方法、機器
JP7362280B2 (ja) * 2019-03-22 2023-10-17 キヤノン株式会社 パッケージユニットの製造方法、パッケージユニット、電子モジュール、および機器
JP7406314B2 (ja) 2019-06-24 2023-12-27 キヤノン株式会社 電子モジュール及び機器

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008245244A (ja) 2007-02-26 2008-10-09 Sony Corp 撮像素子パッケージ、撮像素子モジュールおよびレンズ鏡筒並びに撮像装置
JP2011176224A (ja) 2010-02-25 2011-09-08 Canon Inc 固体撮像装置及び撮像装置

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04123462A (ja) 1990-09-14 1992-04-23 Toshiba Corp 半導体実装装置
JP2001102470A (ja) * 1999-09-30 2001-04-13 Sony Corp 半導体装置
US6483101B1 (en) * 1999-12-08 2002-11-19 Amkor Technology, Inc. Molded image sensor package having lens holder
US6526653B1 (en) * 1999-12-08 2003-03-04 Amkor Technology, Inc. Method of assembling a snap lid image sensor package
US6483030B1 (en) * 1999-12-08 2002-11-19 Amkor Technology, Inc. Snap lid image sensor package
JP2002252293A (ja) * 2001-02-26 2002-09-06 Murata Mfg Co Ltd 電子部品パッケージ構造
KR100401020B1 (ko) * 2001-03-09 2003-10-08 앰코 테크놀로지 코리아 주식회사 반도체칩의 스택킹 구조 및 이를 이용한 반도체패키지
US6759266B1 (en) * 2001-09-04 2004-07-06 Amkor Technology, Inc. Quick sealing glass-lidded package fabrication method
JP3773855B2 (ja) * 2001-11-12 2006-05-10 三洋電機株式会社 リードフレーム
JP2004087512A (ja) * 2002-06-25 2004-03-18 Kyocera Corp 半導体素子収納用パッケージおよび半導体装置
JP2004165181A (ja) 2002-06-26 2004-06-10 Kyocera Corp 半導体素子収納用パッケージおよび半導体装置
JP2005050950A (ja) * 2003-07-31 2005-02-24 Sony Corp 中空パッケージ及び半導体装置
US7145253B1 (en) * 2004-06-09 2006-12-05 Amkor Technology, Inc. Encapsulated sensor device
US7629674B1 (en) * 2004-11-17 2009-12-08 Amkor Technology, Inc. Shielded package having shield fence
WO2006101270A1 (en) * 2005-03-25 2006-09-28 Fujifilm Corporation Solid state imaging device and manufacturing method thereof
JP4455509B2 (ja) * 2006-01-31 2010-04-21 シャープ株式会社 半導体装置
JP2007305856A (ja) * 2006-05-12 2007-11-22 Olympus Corp 封止構造及び該封止構造の製造方法
JP2009135353A (ja) * 2007-12-03 2009-06-18 Panasonic Corp 半導体装置及びその製造に使用する樹脂接着材
US7936033B2 (en) * 2008-12-29 2011-05-03 Texas Instruments Incorporated Micro-optical device packaging system
JP5455706B2 (ja) * 2010-02-25 2014-03-26 キヤノン株式会社 固体撮像装置、撮像ユニット及び撮像装置
JP5875313B2 (ja) * 2011-09-30 2016-03-02 キヤノン株式会社 電子部品および電子機器ならびにこれらの製造方法。
WO2013118501A1 (ja) 2012-02-07 2013-08-15 株式会社ニコン 撮像ユニットおよび撮像装置
JP2013243340A (ja) * 2012-04-27 2013-12-05 Canon Inc 電子部品、実装部材、電子機器およびこれらの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008245244A (ja) 2007-02-26 2008-10-09 Sony Corp 撮像素子パッケージ、撮像素子モジュールおよびレンズ鏡筒並びに撮像装置
JP2011176224A (ja) 2010-02-25 2011-09-08 Canon Inc 固体撮像装置及び撮像装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10580811B2 (en) 2015-11-24 2020-03-03 Sony Corporation Image pickup element package having a supporting resin frame with a thermally conductive portion including electronic components, and associated image pickup apparatus

Also Published As

Publication number Publication date
JP2015084377A (ja) 2015-04-30
CN104576570B (zh) 2017-09-12
US20150116946A1 (en) 2015-04-30
CN104576570A (zh) 2015-04-29
JP6214337B2 (ja) 2017-10-18
US9585287B2 (en) 2017-02-28

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