DE102011084058B4 - Verfahren zur Herstellung einer Halbleitervorrichtung - Google Patents

Verfahren zur Herstellung einer Halbleitervorrichtung Download PDF

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Publication number
DE102011084058B4
DE102011084058B4 DE102011084058.3A DE102011084058A DE102011084058B4 DE 102011084058 B4 DE102011084058 B4 DE 102011084058B4 DE 102011084058 A DE102011084058 A DE 102011084058A DE 102011084058 B4 DE102011084058 B4 DE 102011084058B4
Authority
DE
Germany
Prior art keywords
lead frame
upper mold
mold
projection
displacement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102011084058.3A
Other languages
German (de)
English (en)
Other versions
DE102011084058A1 (de
Inventor
Ken Sakamoto
Taketoshi Shikano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE102011084058A1 publication Critical patent/DE102011084058A1/de
Application granted granted Critical
Publication of DE102011084058B4 publication Critical patent/DE102011084058B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
    • B29C45/14262—Clamping or tensioning means for the insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14147—Positioning or centering articles in the mould using pins or needles penetrating through the insert

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
DE102011084058.3A 2010-10-06 2011-10-05 Verfahren zur Herstellung einer Halbleitervorrichtung Active DE102011084058B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-226608 2010-10-06
JP2010226608A JP5333402B2 (ja) 2010-10-06 2010-10-06 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
DE102011084058A1 DE102011084058A1 (de) 2012-04-12
DE102011084058B4 true DE102011084058B4 (de) 2016-04-07

Family

ID=45872539

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102011084058.3A Active DE102011084058B4 (de) 2010-10-06 2011-10-05 Verfahren zur Herstellung einer Halbleitervorrichtung

Country Status (5)

Country Link
US (1) US8334176B2 (https=)
JP (1) JP5333402B2 (https=)
KR (1) KR101265043B1 (https=)
CN (1) CN102446777B (https=)
DE (1) DE102011084058B4 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5975086B2 (ja) * 2014-10-28 2016-08-23 第一精工株式会社 金型および成形品の製造方法
DE112017007957B4 (de) * 2017-08-23 2023-01-26 Mitsubishi Electric Corporation Verfahren zum Herstellen einer Halbleitervorrichtung
CN112536970B (zh) * 2020-11-23 2023-04-25 刘自福 全自动数据线注塑系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05185467A (ja) * 1992-01-08 1993-07-27 Apitsuku Yamada Kk リードフレームの樹脂モールド金型
JPH07130780A (ja) * 1993-10-29 1995-05-19 Apic Yamada Kk リードフレームのモールド方法
JPH11121656A (ja) * 1997-10-16 1999-04-30 Nec Corp 樹脂封止型ｂｇａおよびｂｇａ用樹脂封止金型

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH081915B2 (ja) * 1985-06-18 1996-01-10 松下電器産業株式会社 封止金型装置
JP2581113B2 (ja) * 1987-11-25 1997-02-12 三菱電機株式会社 半導体装置のモールド方法および装置
JPH0621127A (ja) * 1992-07-03 1994-01-28 Nec Kyushu Ltd 樹脂モールドｉｃ用封入金型
JPH06244228A (ja) * 1993-02-18 1994-09-02 Oki Electric Ind Co Ltd リードフレーム及びその樹脂封止用成形型
KR100272178B1 (ko) 1993-11-09 2000-12-01 윤종용 반도체패키지의 몰드장치
JP3151346B2 (ja) * 1993-12-10 2001-04-03 株式会社日立製作所 半導体集積回路装置およびその製造方法ならびにその製造に用いるモールド金型
JPH08156009A (ja) 1994-12-12 1996-06-18 Nec Kansai Ltd 樹脂モールド装置
JPH08323798A (ja) 1995-05-30 1996-12-10 Nec Kansai Ltd 樹脂モールド装置
KR100242664B1 (ko) 1997-05-30 2000-02-01 김영환 시-비엘피 패키지용 몰드체이스
JP3727446B2 (ja) * 1997-08-19 2005-12-14 沖電気工業株式会社 半導体装置の樹脂封止成形金型
US6319625B1 (en) * 1999-10-29 2001-11-20 George J. Gemberling Graphite plate assembly and method of manufacture
JP4173346B2 (ja) * 2001-12-14 2008-10-29 株式会社ルネサステクノロジ 半導体装置
US6955941B2 (en) * 2002-03-07 2005-10-18 Micron Technology, Inc. Methods and apparatus for packaging semiconductor devices
JP3866127B2 (ja) * 2002-03-20 2007-01-10 株式会社ルネサステクノロジ 半導体装置
JP4426880B2 (ja) * 2004-03-12 2010-03-03 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
JP4481705B2 (ja) * 2004-03-31 2010-06-16 ルネサスエレクトロニクス株式会社 半導体素子封止装置および半導体素子封止方法
TWI270190B (en) * 2005-09-29 2007-01-01 Siliconware Precision Industries Co Ltd Lead frame structure and package for integrating the same
JP2008166395A (ja) 2006-12-27 2008-07-17 Renesas Technology Corp 半導体装置の製造方法
KR101561934B1 (ko) * 2007-11-16 2015-10-21 페어차일드코리아반도체 주식회사 반도체 패키지 및 그의 제조방법
JP5341556B2 (ja) * 2008-09-30 2013-11-13 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 半導体装置の製造方法
JP5378781B2 (ja) * 2008-12-26 2013-12-25 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体装置
US8586419B2 (en) * 2010-01-19 2013-11-19 Vishay-Siliconix Semiconductor packages including die and L-shaped lead and method of manufacture

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05185467A (ja) * 1992-01-08 1993-07-27 Apitsuku Yamada Kk リードフレームの樹脂モールド金型
JPH07130780A (ja) * 1993-10-29 1995-05-19 Apic Yamada Kk リードフレームのモールド方法
JPH11121656A (ja) * 1997-10-16 1999-04-30 Nec Corp 樹脂封止型ｂｇａおよびｂｇａ用樹脂封止金型

Also Published As

Publication number Publication date
JP2012080039A (ja) 2012-04-19
KR20120035866A (ko) 2012-04-16
CN102446777A (zh) 2012-05-09
JP5333402B2 (ja) 2013-11-06
CN102446777B (zh) 2014-12-24
US20120088337A1 (en) 2012-04-12
DE102011084058A1 (de) 2012-04-12
US8334176B2 (en) 2012-12-18
KR101265043B1 (ko) 2013-05-16

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Free format text: PREVIOUS MAIN CLASS: H01L0021560000

Ipc: H10W0074010000